System Electronics ReportZone 5system Electronics Report [PDF]

Zitiervorschau

BMW i3 Cost Analysis Zone 5: System Electronics

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

1

Disclaimers Legal Disclaimer: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by Munro & Associates, Inc. from generally available data. Munro & Associates, Inc. believe these estimates reflect the probable costs. The actual producer did not supply the data, and therefore the actual costs may differ from these estimates. Furthermore, Munro & Associates, Inc. extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information. Copyright © 2015 Munro & Associates, Inc. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of Munro & Associates Inc. under penalty of law. Technical Disclaimer: The goal of this analysis is to establish a should cost value for manufacturing the vehicle and its sub-systems. These cost totals do not include tooling, Engineering Research and Development (ER&D), testing and calibration, logistics, or profit. Manufacturing process assumptions, such as manual assembly vs. automation or mold cavity numbers, were selected based on an annual volume of 20,000. 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

2

Subject

Page

Disclaimers

2

Description of Report Content

20

Data Overview

21

Interpreting Data

29

Cost Analysis

35

Zone 5: Electronics Overview

36

Zone 5: Electronics

37

System Electronics Overview

38

System Electronics

39

Note: Munro logo in upper right of each page is a link to the front page of the report. 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

3

Subject

Page

Infotainment Unit and Bracket Asm

40

Infotainment Unit Installation

69

IP Screw Cover

71

Central Information Display Installation

73

Passenger A-Pillar Foam Asm

75

Passenger A-Pillar Foam Installation

82

Passenger A-Pillar Speaker Mount Asm

84

Passenger A-Pillar Speaker Mount Installation

91

Passenger A-Pillar Speaker Asm

93

Note: Munro logo in upper right of each page is a link to the front page of the report. 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

4

Subject

Page

Passenger A-Pillar Speaker Installation

100

Driver A-Pillar Foam Asm

102

Driver A-Pillar Foam Installation

109

Driver A-Pillar Speaker Mount Asm

111

Driver A-Pillar Speaker Mount Installation

118

Driver A-Pillar Speaker Asm

120

Driver A-Pillar Speaker Installation

127

Back-up Antenna Installation

129

Horn and EDME Mounting Bracket Asm

131

Note: Munro logo in upper right of each page is a link to the front page of the report. 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

5

Subject

Page

EDME and Horn Installation

136

KAFAS and Controller Mounting Bracket Asm

138

KAFAS and Controller Installation

140

Remote Control Receiver and Bracket Installation

142

Side Wave Traps and Filter Installation

144

Telematic Communication Box and Bracket Asm

146

Bracket Installation

186

Touch Box Control Unit Installation

188

Proximity Sensor Installation

190

Note: Munro logo in upper right of each page is a link to the front page of the report. 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

6

Subject

Page

Parking Maneuvering Assistant Installation

192

Antenna Amplifier Asm

194

Assemble Antenna Amplifier

207

Body Wire Harnesses Overview

209

Body Wire Harnesses

210

Body Domain Controller and Bracket Asm

211

Fuse Box Installation

256

PDC Mounting Tray Asm

258

PDC Mounting Tray Installation

265

Note: Munro logo in upper right of each page is a link to the front page of the report. 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

7

Subject

Page

Fuse Box Bracket Asm

267

Fuse Box Bracket Installation

274

Power Distribution Center Asm

276

Cover, Power Distribution Center

292

Main Wire Harness Installation

294

Driver Underbody Wire Harness Installation

296

12V Battery and Bracket Asm

298

12V Battery and Bracket Installation

322

Positive Battery Cable Wire Harness Installation

324

Note: Munro logo in upper right of each page is a link to the front page of the report. 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

8

Subject

Page

Negative Battery Cable Installation

326

Ground, Chassis to Power Module Installation

328

Ground, Motor Asm to Power Module Installation

330

Ground, Power Module to Chassis Installation

332

Ground, Rear X Brace To Heat Shield Installation

334

Ground, Chassis to Exhaust Heat Shield Installatio

336

Ground, Chassis to Engine Installation

338

Ground, AC Compressor To Motor Installation

340

Ground, Chassis to Motor Installation

342

Note: Munro logo in upper right of each page is a link to the front page of the report. 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

9

Subject

Page

Steering Column Ground Strap Installation

344

Appendix Reports

346

TechInsights Electronics Reports

347

Munro & Associates Wire Harness Reports

872

Technical References

1290

Note: Munro logo in upper right of each page is a link to the front page of the report. 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

10

Design Profit® Process • The Design Profit® Software is used to provide a detailed cost map analyzing every subassembly, part, operation, & tool in the manufacturing process. • The various symbols shown below are used in a hierarchical diagram to quantify & compare design and manufacturing efficiencies & costs. Parts Subassemblies Pre-Processed Parts

Tools

Fastening Operations Non-Value Added Operations

Parallel Processing

Multi-Touches Material Modifications

Repeated Operations Inspections Notes Process Steps

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

11

Design Profit® Process

Each symbol is created by filling out a properties window. Penalty conditions and other information related to the symbol are assigned, in order to calculate the effect of handling difficulties on assembly time.

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

12

Design Profit® Process Components to be Assembled

Part to Fabricate

Fabrication Operations

7 June 2017

Assembly Operations Above is a Design Profit cost map. The top horizontal line of symbols indicates the assemblies, parts, and assembly processes used to create the above parent assembly. Each of the symbols below a parent are analyzed in detail. Total costs are then rolled-up to the parent symbol. The vertical string of symbols on the left shows the details of each step and work cell in the fabrication process. The vertical string of symbols on the right shows the details of each step and work cell in the assembly process. Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

13

Assumptions The following assumptions were made for the cost analysis: • All processing was documented in the Design Profit software. • All raw material prices are based on quotes and published information. • All manufacturing processes include the man and machine to establish an hourly cost for the manufacturing work cell for each process and country utilized in creating the vehicle. These work cell rates are used along with calculation of cycle time to generate the process costs of components. Machine rates are developed through an internal model, accounting for all aspects of the primary and secondary equipment for the process. Operator rates are based on the specific country, and related industry labor rates. Adjustments are made for the number of operators in the workcell. • Common/basic components were costed as commodity items. These included: bearings, seals, fasteners, and electronic components. • Bearings/Seals/Fasteners are compared to numerous costed bills of materials to establish a purchased price. • Electronic component costs are based on the costed bill of materials on hand, quote requests, and published information. Component pricing is run through trend lines to establish a cost for the appropriate targeted volumes. • Machining cycle times are calculated using operations based on speeds and feeds from the standard machinist handbook. 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

14

SG&A Calculations

7 June 2017

Copyright © Munro & Associates, Inc. 2015

Medium High

• The SG&A mark-up used for fabricated parts raw material and processing costs is a variable rate based on the technology level associated with the system. A table of the standard percentage markups is shown to the right. Low technology is typical of a system mostly consisting of simple parts, such as basic stampings and injection molded parts. High technology is typically a system with complex automated assembly, high tolerance machined parts, and complex electronic systems, or more standard processes applied to new applications. Cutting edge is typically a system that uses first to market application of an advanced technology.

Cutting Edge

• The SG&A mark-up used for commodity parts is a flat 3.0% typically used as a standard industry value. This mark-up accounts for the purchasing and handling of commodity parts.

Low

Sales, General, and Administration:

www.LeanDesign.com

Technology SG&A Level Mark-Ups 1 6.0% 2 7.0% 3 8.0% 4 9.0% 5 10.0% 6 11.0% 7 12.0% 8 13.0% 9 14.0% 10 15.0% 11 16.0% 12 17.0% 13 18.0% 14 19.0% 15 20.0% 16 21.0% 17 22.0% 18 23.0% 19 24.0% 20 25.0% 15

Defining Q Burden Quality Burden (Q Burden) is the additional cost carried by each good product unit, to account for the actions and materials used to correct defects in parts (as received or produced) or in production processes. Q Burden is a key component of the Cost of Quality and may be considered equivalent to failure costs. Q Burden reflects the variable cost of poor quality. The probability of a defect can be estimated from industry averages or can be based on company statistics. Q Burden is calculated by adding the incident and disposition costs for each defect and multiplying the sum by the probability of a defect occurrence. The incident is the set of actions that are taken immediately upon the discovery of a real or suspected defect. The disposition is the actions to deal with the defective production after the incident. Q Burden does not include: • Base overhead associated with the quality organization (the amount required to assure compliance with industry and customer standards) • Process documentation generally needed in order to communicate requirements and standards for production, inspection, and testing • Inspection and test equipment depreciation and consumables (unless needed for troubleshooting defective product) • Defect prevention activity (investment in new equipment, process improvement, mistake-proofing activities, redesign, lean/six sigma activities, etc.) 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

16

Die Casting Estimates

The die casting material costs and cycle times are calculated in an internal parametric based cost estimating sheet, and outputs are fed into Design Profit to develop final fabrication costs. Since die casting is a more material driven primary fabrication process, the cells to the right include general dimensional values and material selections. 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

17

Injection Molding Estimates

The injection molding material costs and cycle times are calculated in an internal parametric based cost estimating sheet, and outputs are fed into Design Profit to develop final fabrication costs. Since injection molding is a more complex material driven primary fabrication process, the cells to the right include detailed dimensional values and material selections. 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

18

Stamping Estimates

The stamping material costs and cycle times are calculated in an internal parametric based cost estimating sheet, and outputs are fed into Design Profit to develop final fabrication costs. Since stamping is a more machine driven primary fabrication process, the cells to the right include dimensional values related to stations operating in the press, along with material selections. 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

19

Description of Report Content Zone Report Outline: • Zone Information – Zone Overview – Zone Executive Summary

• Chapter Information – – – –

Chapter Overview Eye Catching Features Executive Summary Repeating Series of Sets of Costing Detail Pages • • •

Assembly Details (Set of 3 Pages) Part Details (Set of 2 Pages) Assembly Process (Set of 2 Pages)

• Appendix Information – TechInsights Reports •

Electronic Component Costing Details

– Munro & Associates Wire Harness Reports • •

Wire Harness Costing Details

Zones and Chapters are meant to be similar in structure to a system and sub-system breakdown, however, they may or may not represent specific Original Equipment Manufacturer (OEM) organizations. For example, the Zone 7: Driveline contains the chapters for Motor, Gear Box and Half Shafts.

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

20

Data Overview – Executive Summaries

Executive Summary: Page 1 of 1

7 June 2017

Copyright © Munro & Associates, Inc. 2015

At the beginning of each Zone report and beginning of each Chapter, there will be a Executive Summary page. This page provides the high level totals of the Zone or Chapter, based on the following detailed data. The upper part of the summary table shows typical metrics totaled from the assembly and fabrication processes, including part counts, operation counts, timing, and weights. The lower part of the table shows the total costs incurred from these processes.

www.LeanDesign.com

21

Data Overview – Assembly Details

Assembly Details: Page 1 of 3

7 June 2017

Copyright © Munro & Associates, Inc. 2015

As the report progresses through the breakdown hierarchy of the Chapter, when an assembly is analyzed, three detail pages will be provided. The first page, shown to the left, is a high level overview. The top left photo is the independent assembly, placed on a grid for a reference perspective. The bottom left photo is the assembly in location, once it is assembled to its parent assembly. The top right is a list of the parent assemblies of this assembly. The bottom right is a table summarizing total metrics and costs related to the completed assembly. www.LeanDesign.com

22

Data Overview – Assembly Details

Assembly Details: Page 2 of 3 •

7 June 2017

Note for large assemblies with many line items this page could become multiple pages. Copyright © Munro & Associates, Inc. 2015

The second assembly detail page, shown to the left, is the detailed breakdown of the totals for each line item within the current assembly. The line items within the breakdown will include assemblies, parts, and assembly processes. This makes these tables effectively a combined Bill of Materials (BOM) and Bill of Process (BOP) for that assembly. The top table provides the typical metrics totaled from the assembly and fabrication process of each line item. The bottom table provides the total costs incurred from these processes. www.LeanDesign.com

23

Data Overview – Assembly Details The third assembly detail page, shown to the left, is a detailed summary of the totals shown on the previous page. The upper part of the summary table shows typical metrics totaled from the assembly and fabrication process, including part counts, operation counts, timing, and weights. The lower part of the table shows the total costs incurred from these processes.

Assembly Details: Page 3 of 3

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

24

Data Overview – Part Details

Part Details: Page 1 of 2

7 June 2017

Copyright © Munro & Associates, Inc. 2015

As the report progresses through the breakdown hierarchy of the Chapter, when a part is analyzed, two detail pages will be provided. The first page, shown to the left, is a high level overview. The top left photo is the independent part, placed on a grid for a reference perspective. The bottom left photo is the part in location, once it is assembled to its parent assembly. The top right is a list of the parent assemblies of this part. The bottom right is a table summarizing total metrics and costs related to the completed part. www.LeanDesign.com

25

Data Overview – Part Details The second part detail page, shown to the left, is the detailed breakdown of the totals for the raw materials and each process step to fabricate the part. The top table provides the typical fabrication process metrics and costs totaled for each step. The bottom table provides the total costs for raw material or purchased parts used in the fabrication process.

Part Details: Page 2 of 2 •

7 June 2017

Note for complex parts with many steps this page could become multiple pages. Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

26

Data Overview – Assembly Process Details

Assembly Process Details: Page 1 of 2

7 June 2017

Copyright © Munro & Associates, Inc. 2015

As the report progresses through the breakdown hierarchy of the Chapter, when an assembly process is analyzed, two detail pages will be provided. The first page, shown to the left, is a high level overview. The top left are photos of the purchased parts utilized in the process, placed on a grid for a reference perspective. The bottom left photo is a view of the location, once the process is complete. The top right is a list of the parent assemblies of this process. The bottom right is a table summarizing total metrics and costs related to the process. www.LeanDesign.com

27

Data Overview – Assembly Process Details

Assembly Process Details: Page 2 of 2 •

7 June 2017

Note for complex processes with many steps this page could become multiple pages. Copyright © Munro & Associates, Inc. 2015

The second assembly process detail page, shown to the left, is the detailed breakdown of the totals for the purchased parts and each assembly process step. The top table provides the typical assembly process metrics and costs totaled for each step. The bottom table provides the total costs for purchased parts used in the assembly process. If a electronic component or wire harness are in the list of purchased parts, then this page will also have a link to the accompanying report in the Appendix. www.LeanDesign.com

28

Interpreting Data – Part Counts Summary tables, include three metrics related to part count. The first metric, “Parts” is the total quantity of parts. The second metric, “Fasteners” is the total quantity of fasteners, within that total part count, meaning that the fasteners count is a sub-total of the parts count. The third metric, “Part Numbers” is the total unique part instances in the total part count (this includes numbers for both main parts and fasteners).

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

29

Interpreting Data – Operation Counts Summary tables, also include two metrics related to operation counts. The first “Steps”, is the total count of the operations required to complete an assembly, part, or assembly process. Operations counted in this total include handling of parts, movement of equipment or operators, handling of tools, fastenings of parts and assemblies, operations to add and remove material during the fabrication process, etc. The second “Fastenings” is the total count of the operations specifically related to fastenings components together, meaning that the fastening count is a sub-total of the steps count. 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

30

Interpreting Data – Fasteners vs. Fastenings Often it would be expected that the analysis would have the same number of fasteners to fastenings, however, that is not always the case. One scenario is shown to the right, where there are less fasteners, than fastenings. This is typical of welding operations or the application of sealant or adhesive, as there is not a standard bolt, nut, or clip to be counted as a fastener. A second scenario is where there are more fasteners, than fastenings. This is typical of a process that engages multiple fasteners at the same time, like a multi-head nut runner. 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

31

Interpreting Data – Right First Time Summary tables include “Right First Time” (RFT). This value states the probably that all the steps that total to this point in the process will be completed without an error. Naturally, as the number and complexity of steps required to complete the assembly, part, or assembly process increase, the RFT percentage will decrease. RFT is calculated using typical bestin-class PPM values for incident rates. However, even with high Sigma level processes, as the steps count increases greatly, the RFT percentage will decrease greatly.

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

32

Interpreting Data – No Commodity Items in Assembly Process Some assembly processes will not require the use of commodity items in the process to fasten parts and assemblies. For example, the installation of the half shafts to the vehicle utilizes a press fit, and therefore does not require commodities, like bolts, nuts, or clips to fasten in place. When no commodities are required, the top left photos will be replaced with the standard statement shown on the left. Additionally there will be no weight or material cost / purchased parts cost present in the process summary.

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

33

Interpreting Data – Low Q Burden

Some assembly and fabrication process steps that have few operations or operations with low PPMs of defects, will often display $0.00 in Q Burden. This is simply because the Q Burden value for that step in the process is less than one cent. However, this fraction of a cent of cost will be rolled-up to any parent part or assembly for these processes and added to its totals.

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

34

Cost Analysis

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

35

Zone 5: Electronics Overview Zone 5 contains system electronics and the body wiring harnesses. The system electronics is comprised of infotainment, center display, rear view camera, telematics communication, audio system, park/maneuver assist modules. The wiring system contains all of the harnesses associated with the typical 12 volt systems used through out the vehicle. The harness group also contains the 12 volt battery and power distribution box. All major components were costed in detail, while prices were applied to commodity items (i.e. seals, fasteners, latches, and seat belts). Estimates are based on actual parts. Photos: Background on 100mm grid paper.

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

36

Zone 5: Electronics Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

37

System Electronics Overview The electronics system primarily contains the 12 volt systems within the vehicle. The main components in the group include: infotainment, central display and telematics communication modules. Additional modules within the group include RF transceivers, touch box control unit, wave trap, suppression module, fuel tank depressurization module, rear view camera module park maneuver (assist) module and audio components. A majority of the modules were housed in injection molded housings except the infotainment unit and rear view camera module which were in metal housings. All major components were costed in detail, while prices were applied to commodity items (i.e. seals, fasteners, latches, and seat belts). Estimates are based on actual parts. Photos: Background on 100mm grid paper.

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

38

System Electronics Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

39

Infotainment Unit and Bracket Asm \... \Zone 5 Electronics \System Electronics \Infotainment Unit and Bracket Asm

Assembly Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

40

Infotainment Unit and Bracket Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

41

Infotainment Unit and Bracket Asm Detailed Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

42

Bracket Asm, Infotainment Unit and Bracket Asm \... \System Electronics \Infotainment Unit and Bracket Asm \Bracket Asm, Infotainment Unit and Bracket Asm

Assembly Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

43

Bracket Asm, Infotainment Unit and Bracket Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

44

Bracket Asm, Infotainment Unit and Bracket Asm Detailed Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

45

Bracket, Bracket Asm \... \Bracket Asm, Infotainment Unit and Bracket Asm \Bracket, Bracket Asm \Bracket Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

46

Bracket, Bracket Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

47

Assemble Bracket \... \Infotainment Unit and Bracket Asm \Bracket Asm, Infotainment Unit and Bracket Asm \Assemble Bracket

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

48

Assemble Bracket

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

49

Retention Slider, Infotainment Unit Asm \... \Infotainment Unit and Bracket Asm \Retention Slider, Infotainment Unit Asm \Retention Feature Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

50

Retention Slider, Infotainment Unit Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

51

Assemble Bracket to Infotainment Unit \... \System Electronics \Infotainment Unit and Bracket Asm \Assemble Bracket to Infotainment Unit

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

52

Assemble Bracket to Infotainment Unit

Click Here for TechInsights Electronics Report on Digital Radio Module

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

53

Optional Equipment System, Infotainment Unit & Bra \... \System Electronics \Infotainment Unit and Bracket Asm \Optional Equipment System, Infotainment Unit & Bra

Assembly Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

54

Optional Equipment System, Infotainment Unit & Bra

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

55

Optional Equipment System, Infotainment Unit & Bra Detailed Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

56

Platform, Optional Equipment System Asm \... \Optional Equipment System, Infotainment Unit & Bra \Platform, Optional Equipment System Asm \Bracket Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

57

Platform, Optional Equipment System Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

58

Assemble Platform \... \Infotainment Unit and Bracket Asm \Optional Equipment System, Infotainment Unit & Bra \Assemble Platform

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

59

Assemble Platform

Click Here for TechInsights Electronics Report on Optional Equipment Board 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

60

Cover, Optional Equipment System Asm \... \Optional Equipment System, Infotainment Unit & Bra \Cover, Optional Equipment System Asm \Cover Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

61

Cover, Optional Equipment System Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

62

Assemble Cover \... \Infotainment Unit and Bracket Asm \Optional Equipment System, Infotainment Unit & Bra \Assemble Cover

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

63

Assemble Cover

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

64

Assemble Labels \... \Infotainment Unit and Bracket Asm \Optional Equipment System, Infotainment Unit & Bra \Assemble Labels

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

65

Assemble Labels

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

66

Assemble Infotainment Auxiliary Printed Circuit \... \System Electronics \Infotainment Unit and Bracket Asm \Assemble Infotainment Auxiliary Printed Circuit

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

67

Assemble Infotainment Auxiliary Printed Circuit

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

68

Infotainment Unit Installation \... \Zone 5 Electronics \System Electronics \Infotainment Unit Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

69

Infotainment Unit Installation

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

70

IP Screw Cover \... \System Electronics \IP Screw Cover \Screw Cover Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

71

IP Screw Cover

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

72

Central Information Display Installation \... \Zone 5 Electronics \System Electronics \Central Information Display Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

73

Central Information Display Installation

Click Here for TechInsights Electronics Report on 10.2” Infotainment Display 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

74

Passenger A-Pillar Foam Asm \... \Zone 5 Electronics \System Electronics \Passenger A-Pillar Foam Asm

Assembly Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

75

Passenger A-Pillar Foam Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

76

Passenger A-Pillar Foam Asm Detailed Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

77

Passenger A-Pillar Foam \... \Passenger A-Pillar Foam Asm \Passenger A-Pillar Foam \A-Pillar Foam Asm Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

78

Passenger A-Pillar Foam

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

79

Assemble Passenger A-Pillar Foam \... \System Electronics \Passenger A-Pillar Foam Asm \Assemble Passenger A-Pillar Foam

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

80

Assemble Passenger A-Pillar Foam

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

81

Passenger A-Pillar Foam Installation \... \Zone 5 Electronics \System Electronics \Passenger A-Pillar Foam Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

82

Passenger A-Pillar Foam Installation

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

83

Passenger A-Pillar Speaker Mount Asm \... \Zone 5 Electronics \System Electronics \Passenger A-Pillar Speaker Mount Asm

Assembly Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

84

Passenger A-Pillar Speaker Mount Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

85

Passenger A-Pillar Speaker Mount Asm Detailed Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

86

Passenger A-Pillar Speaker Mount \... \Passenger A-Pillar Speaker Mount Asm \Passenger A-Pillar Speaker Mount \Passenger A-Pillar Speaker Mount Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

87

Passenger A-Pillar Speaker Mount

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

88

Assemble A-Pillar Speaker Mount \... \System Electronics \Passenger A-Pillar Speaker Mount Asm \Assemble A-Pillar Speaker Mount

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

89

Assemble A-Pillar Speaker Mount

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

90

Passenger A-Pillar Speaker Mount Installation \... \Zone 5 Electronics \System Electronics \Passenger A-Pillar Speaker Mount Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

91

Passenger A-Pillar Speaker Mount Installation

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

92

Passenger A-Pillar Speaker Asm \... \Zone 5 Electronics \System Electronics \Passenger A-Pillar Speaker Asm

Assembly Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

93

Passenger A-Pillar Speaker Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

94

Passenger A-Pillar Speaker Asm Detailed Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

95

Passenger A-Pillar Speaker Mount, Passenger A-Pill \... \Passenger A-Pillar Speaker Asm \Passenger A-Pillar Speaker Mount, Passenger A-Pill \Passenger A-Pillar Speaker Mount Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

96

Passenger A-Pillar Speaker Mount, Passenger A-Pill

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

97

Assemble Passenger A-Pillar Speaker \... \System Electronics \Passenger A-Pillar Speaker Asm \Assemble Passenger A-Pillar Speaker

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

98

Assemble Passenger A-Pillar Speaker

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

99

Passenger A-Pillar Speaker Installation \... \Zone 5 Electronics \System Electronics \Passenger A-Pillar Speaker Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

100

Passenger A-Pillar Speaker Installation

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

101

Driver A-Pillar Foam Asm \... \Zone 5 Electronics \System Electronics \Driver A-Pillar Foam Asm

Assembly Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

102

Driver A-Pillar Foam Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

103

Driver A-Pillar Foam Asm Detailed Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

104

Driver A-Pillar Foam, Driver A-Pillar Foam Asm \... \Driver A-Pillar Foam Asm \Driver A-Pillar Foam, Driver A-Pillar Foam Asm \A-Pillar Foam Asm Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

105

Driver A-Pillar Foam, Driver A-Pillar Foam Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

106

Assemble Driver A-Pillar Foam \... \System Electronics \Driver A-Pillar Foam Asm \Assemble Driver A-Pillar Foam

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

107

Assemble Driver A-Pillar Foam

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

108

Driver A-Pillar Foam Installation \... \Zone 5 Electronics \System Electronics \Driver A-Pillar Foam Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

109

Driver A-Pillar Foam Installation

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

110

Driver A-Pillar Speaker Mount Asm \... \Zone 5 Electronics \System Electronics \Driver A-Pillar Speaker Mount Asm

Assembly Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

111

Driver A-Pillar Speaker Mount Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

112

Driver A-Pillar Speaker Mount Asm Detailed Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

113

Driver A-Pillar Speaker Mount, Driver APillar Spe \... \Driver A-Pillar Speaker Mount Asm \Driver A-Pillar Speaker Mount, Driver A-Pillar Spe \Driver A-Pillar Speaker Mount Asm Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

114

Driver A-Pillar Speaker Mount, Driver APillar Spe

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

115

Assemble Driver A-Pillar Speaker Mount \... \System Electronics \Driver A-Pillar Speaker Mount Asm \Assemble Driver A-Pillar Speaker Mount

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

116

Assemble Driver A-Pillar Speaker Mount

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

117

Driver A-Pillar Speaker Mount Installation \... \Zone 5 Electronics \System Electronics \Driver A-Pillar Speaker Mount Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

118

Driver A-Pillar Speaker Mount Installation

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

119

Driver A-Pillar Speaker Asm \... \Zone 5 Electronics \System Electronics \Driver A-Pillar Speaker Asm

Assembly Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

120

Driver A-Pillar Speaker Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

121

Driver A-Pillar Speaker Asm Detailed Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

122

Driver A-Pillar Speaker Mount, Driver APillar Spe \... \Driver A-Pillar Speaker Asm \Driver A-Pillar Speaker Mount, Driver A-Pillar Spe \Driver A-Pillar Speaker Mount Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

123

Driver A-Pillar Speaker Mount, Driver APillar Spe

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

124

Assemble Driver A-Pillar Speaker \... \System Electronics \Driver A-Pillar Speaker Asm \Assemble Driver A-Pillar Speaker

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

125

Assemble Driver A-Pillar Speaker

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

126

Driver A-Pillar Speaker Installation \... \Zone 5 Electronics \System Electronics \Driver A-Pillar Speaker Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

127

Driver A-Pillar Speaker Installation

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

128

Back-up Antenna Installation \... \Zone 5 Electronics \System Electronics \Back-up Antenna Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

129

Back-up Antenna Installation

Click Here for TechInsights Electronics Report on Back-Up Antenna Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

130

Horn and EDME Mounting Bracket Asm \... \Zone 5 Electronics \System Electronics \Horn and EDME Mounting Bracket Asm

Assembly Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

131

Horn and EDME Mounting Bracket Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

132

Horn and EDME Mounting Bracket Asm Detailed Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

133

EDME Mounting Bracke \... \Horn and EDME Mounting Bracket Asm \ EDME Mounting Bracke \ EDME Mounting Bracket Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

134

EDME Mounting Bracke

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

135

EDME and Horn Installation \... \Zone 5 Electronics \System Electronics \EDME and Horn Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

136

EDME and Horn Installation

Click Here for TechInsights Electronics Report on Electrical Digital Motor Asm 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

137

KAFAS and Controller Mounting Bracket Asm \... \System Electronics \KAFAS and Controller Mounting Bracket Asm \KAFAS and Conroller Mtg Bracket Asm Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

138

KAFAS and Controller Mounting Bracket Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

139

KAFAS and Controller Installation \... \Zone 5 Electronics \System Electronics \KAFAS and Controller Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

140

KAFAS and Controller Installation

Click Here for TechInsights Electronics Report on Hybrid Pressure Refueling ECU Click Here for TechInsights Electronics Report on Driver Support System 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

141

Remote Control Receiver and Bracket Installation \... \Zone 5 Electronics \System Electronics \Remote Control Receiver and Bracket Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

142

Remote Control Receiver and Bracket Installation

Click Here for TechInsights Electronics Report on Remote Control Receiver Asm 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

143

Side Wave Traps and Filter Installation \... \Zone 5 Electronics \System Electronics \Side Wave Traps and Filter Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

144

Side Wave Traps and Filter Installation

Click Here for TechInsights Electronics Report on Wave Trap Click Here for TechInsights Electronics Report on Interference Suppression Filter Asm 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

145

Telematic Communication Box and Bracket Asm \... \Zone 5 Electronics \System Electronics \Telematic Communication Box and Bracket Asm

Assembly Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

146

Telematic Communication Box and Bracket Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

147

Telematic Communication Box and Bracket Asm Detailed Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

148

Mounting Bracket Asm, Telematic Communication Box \... \System Electronics \Telematic Communication Box and Bracket Asm \Mounting Bracket Asm, Telematic Communication Box

Assembly Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

149

Mounting Bracket Asm, Telematic Communication Box

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

150

Mounting Bracket Asm, Telematic Communication Box Detailed Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

151

Mounting Bracket, Mounting Bracket Asm \... \Mounting Bracket Asm, Telematic Communication Box \Mounting Bracket, Mounting Bracket Asm \Mounting Bracket Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

152

Mounting Bracket, Mounting Bracket Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

153

Assemble Mounting Bracket \... \Telematic Communication Box and Bracket Asm \Mounting Bracket Asm, Telematic Communication Box \Assemble Mounting Bracket

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

154

Assemble Mounting Bracket

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

155

Fan Mounting Bracket, Mounting Bracket Asm \... \Mounting Bracket Asm, Telematic Communication Box \Fan Mounting Bracket, Mounting Bracket Asm \Fan Mounting Bracket Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

156

Fan Mounting Bracket, Mounting Bracket Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

157

Assemble Fan Mounting Bracket \... \Telematic Communication Box and Bracket Asm \Mounting Bracket Asm, Telematic Communication Box \Assemble Fan Mounting Bracket

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

158

Assemble Fan Mounting Bracket

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

159

Telematic Communication Asm, Telematic Communicati \... \System Electronics \Telematic Communication Box and Bracket Asm \Telematic Communication Asm, Telematic Communicati Assembly Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

160

Telematic Communication Asm, Telematic Communicati

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

161

Telematic Communication Asm, Telematic Communicati Detailed Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

162

Telematic Communication Box, Telematic Communicati \... \Telematic Communication Asm, Telematic Communicati \Telematic Communication Box, Telematic Communicati \Telematic Communication Box Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

163

Telematic Communication Box, Telematic Communicati

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

164

Battery Asm, Telematic Communication Box Asm \... \Telematic Communication Box and Bracket Asm \Telematic Communication Asm, Telematic Communicati \Battery Asm, Telematic Communication Box Asm

Assembly Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

165

Battery Asm, Telematic Communication Box Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

166

Battery Asm, Telematic Communication Box Asm Detailed Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

167

Battery Process \... \Telematic Communication Asm, Telematic Communicati \Battery Asm, Telematic Communication Box Asm \Battery Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

168

Battery Process

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

169

Assemble Telematic Communication Box Battery \... \Telematic Communication Box and Bracket Asm \Telematic Communication Asm, Telematic Communicati \Assemble Telematic Communication Box Battery

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

170

Assemble Telematic Communication Box Battery

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

171

Telematic Communication Box Lid, Telematic Communi \... \Telematic Communication Asm, Telematic Communicati \Telematic Communication Box Lid, Telematic Communi \Telematic Communication Box Lid Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

172

Telematic Communication Box Lid, Telematic Communi

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

173

Assemble Telematic Communication Box Lid \... \Telematic Communication Box and Bracket Asm \Telematic Communication Asm, Telematic Communicati \Assemble Telematic Communication Box Lid

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

174

Assemble Telematic Communication Box Lid

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

175

Assemble Telematic Communication Printed Circuit \... \Telematic Communication Box and Bracket Asm \Telematic Communication Asm, Telematic Communicati \Assemble Telematic Communication Printed Circuit

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

176

Assemble Telematic Communication Printed Circuit

Click Here for TechInsights Electronics Report on Telematics Communication Boards 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

177

Telematic Communication Box Mounting Bracket, Tele \... \Telematic Communication Asm, Telematic Communicati \Telematic Communication Box Mounting Bracket, Tele \Telematic Communication Box Mtg Bracket Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

178

Telematic Communication Box Mounting Bracket, Tele

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

179

Assemble Telematic Communication Mounting Bracket \... \Telematic Communication Box and Bracket Asm \Telematic Communication Asm, Telematic Communicati \Assemble Telematic Communication Mounting Bracket

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

180

Assemble Telematic Communication Mounting Bracket

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

181

Assemble Telematic Communication Box to Bracket \... \System Electronics \Telematic Communication Box and Bracket Asm \Assemble Telematic Communication Box to Bracket

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

182

Assemble Telematic Communication Box to Bracket

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

183

Assemble Fan \... \System Electronics \Telematic Communication Box and Bracket Asm \Assemble Fan

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

184

Assemble Fan

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

185

Bracket Installation \... \Zone 5 Electronics \System Electronics \Bracket Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

186

Bracket Installation

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

187

Touch Box Control Unit Installation \... \Zone 5 Electronics \System Electronics \Touch Box Control Unit Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

188

Touch Box Control Unit Installation

Click Here for TechInsights Electronics Report on Touch Controller

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

189

Proximity Sensor Installation \... \Zone 5 Electronics \System Electronics \Proximity Sensor Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

190

Proximity Sensor Installation

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

191

Parking Maneuvering Assistant Installation \... \Zone 5 Electronics \System Electronics \Parking Maneuvering Assistant Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

192

Parking Maneuvering Assistant Installation

Click Here for TechInsights Electronics Report on Parking Assist Module

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

193

Antenna Amplifier Asm \... \Zone 5 Electronics \System Electronics \Antenna Amplifier Asm

Assembly Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

194

Antenna Amplifier Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

195

Antenna Amplifier Asm Detailed Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

196

Assemble Antenna Amplifier Circuit \... \System Electronics \Antenna Amplifier Asm \Assemble Antenna Amplifier Circuit

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

197

Assemble Antenna Amplifier Circuit

Click Here for TechInsights Electronics Report on Antenna Amplifier Board 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

198

Upper Housing, Antenna Amplifier \... \Antenna Amplifier Asm \Upper Housing, Antenna Amplifier \Upper Housing, Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

199

Upper Housing, Antenna Amplifier

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

200

Lower Housing, Antenna Amplifier \... \Antenna Amplifier Asm \Lower Housing, Antenna Amplifier \Lower Housing, Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

201

Lower Housing, Antenna Amplifier

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

202

Assemble Antenna Amplifier Housing \... \System Electronics \Antenna Amplifier Asm \Assemble Antenna Amplifier Housing

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

203

Assemble Antenna Amplifier Housing

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

204

Assemble Screw \... \System Electronics \Antenna Amplifier Asm \Assemble Screw

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

205

Assemble Screw

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

206

Assemble Antenna Amplifier \... \Zone 5 Electronics \System Electronics \Assemble Antenna Amplifier

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

207

Assemble Antenna Amplifier

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

208

Body Wire Harnesses Overview The body wiring group contains the 12 volt vehicle electrical wiring harnesses, 12 volt battery and the body controller/power distribution box. The harnesses consist of two primary parts the in vehicle harness (body harness) and the chassis mounted harness (underbody harness). The group also contains various ground straps and the 12 volt battery cable. The 12 volt battery is mounted in a stamped steel mounting bracket. The body domain controller includes the electronics control as well as circuit protection (fuse box). All major components were costed in detail, while prices were applied to commodity items (i.e. seals, fasteners, latches, and seat belts). Estimates are based on actual parts. Photos: Background on 100mm grid paper.

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

209

Body Wire Harnesses Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

210

Body Domain Controller and Bracket Asm \... \Zone 5 Electronics \Body Wire Harnesses \Body Domain Controller and Bracket Asm

Assembly Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

211

Body Domain Controller and Bracket Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

212

Body Domain Controller and Bracket Asm Detailed Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

213

Bracket Asm, Body Domain Controller and Bracket \... \Body Wire Harnesses \Body Domain Controller and Bracket Asm \Bracket Asm, Body Domain Controller and Bracket

Assembly Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

214

Bracket Asm, Body Domain Controller and Bracket

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

215

Bracket Asm, Body Domain Controller and Bracket Detailed Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

216

Bracket, Bracket Asm \... \Bracket Asm, Body Domain Controller and Bracket \Bracket, Bracket Asm \Bracket Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

217

Bracket, Bracket Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

218

Assemble Compression Sleeve \... \Body Domain Controller and Bracket Asm \Bracket Asm, Body Domain Controller and Bracket \Assemble Compression Sleeve

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

219

Assemble Compression Sleeve

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

220

Assemble Felt Tape \... \Body Domain Controller and Bracket Asm \Bracket Asm, Body Domain Controller and Bracket \Assemble Felt Tape

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

221

Assemble Felt Tape

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

222

Isolator Cap, Body Mounting Isolator Asm \... \Body Domain Controller and Bracket Asm \Isolator Cap, Body Mounting Isolator Asm \Isolator Cap Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

223

Isolator Cap, Body Mounting Isolator Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

224

Assemble Body Mounting Isolator \... \Body Wire Harnesses \Body Domain Controller and Bracket Asm \Assemble Body Mounting Isolator

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

225

Assemble Body Mounting Isolator

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

226

Connector Asm, Body Domain Controller and Bracket \... \Body Wire Harnesses \Body Domain Controller and Bracket Asm \Connector Asm, Body Domain Controller and Bracket

Assembly Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

227

Connector Asm, Body Domain Controller and Bracket

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

228

Connector Asm, Body Domain Controller and Bracket Detailed Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

229

Connector Upper Housing Asm, Connector Asm \... \Body Domain Controller and Bracket Asm \Connector Asm, Body Domain Controller and Bracket \Connector Upper Housing Asm, Connector Asm

Assembly Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

230

Connector Upper Housing Asm, Connector Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

231

Connector Upper Housing Asm, Connector Asm Detailed Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

232

Connector Upper Housing, Connector Asm \... \Connector Upper Housing Asm, Connector Asm \Connector Upper Housing, Connector Asm \Connector Upper Housing Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

233

Connector Upper Housing, Connector Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

234

Assemble Connector Upper Housing \... \Connector Asm, Body Domain Controller and Bracket \Connector Upper Housing Asm, Connector Asm \Assemble Connector Upper Housing

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

235

Assemble Connector Upper Housing

Click Here for TechInsights Electronics Report on Single Termination Board, Connector Asm 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

236

Connector Lower Housing, Connector Asm \... \Connector Asm, Body Domain Controller and Bracket \Connector Lower Housing, Connector Asm \Connector Lower Housing Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

237

Connector Lower Housing, Connector Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

238

Assemble Connector Lower Housing \... \Body Domain Controller and Bracket Asm \Connector Asm, Body Domain Controller and Bracket \Assemble Connector Lower Housing

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

239

Assemble Connector Lower Housing

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

240

Assemble Connector \... \Body Wire Harnesses \Body Domain Controller and Bracket Asm \Assemble Connector

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

241

Assemble Connector

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

242

Body Domain Controller, Body Domain Controller and \... \Body Wire Harnesses \Body Domain Controller and Bracket Asm \Body Domain Controller, Body Domain Controller and

Assembly Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

243

Body Domain Controller, Body Domain Controller and

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

244

Body Domain Controller, Body Domain Controller and Detailed Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

245

Upper Housing Body Domain Controller, Body Domain \... \Body Domain Controller, Body Domain Controller and \Upper Housing Body Domain Controller, Body Domain \Upper Housing Body Domain Controller Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

246

Upper Housing Body Domain Controller, Body Domain

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

247

Assemble Upper Housing and Printed Circuit Board \... \Body Domain Controller and Bracket Asm \Body Domain Controller, Body Domain Controller and \Assemble Upper Housing and Printed Circuit Board

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

248

Assemble Upper Housing and Printed Circuit Board

Click Here for TechInsights Electronics Report on Body Domain Controller 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

249

Lower Housing Body Domain Controller \... \Body Domain Controller, Body Domain Controller and \Lower Housing Body Domain Controller \Lower Housing Body Domain Controller Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

250

Lower Housing Body Domain Controller

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

251

Assemble Lower Housing \... \Body Domain Controller and Bracket Asm \Body Domain Controller, Body Domain Controller and \Assemble Lower Housing

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

252

Assemble Lower Housing

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

253

Assemble Body Domain Controller and Bracket Asm \... \Body Wire Harnesses \Body Domain Controller and Bracket Asm \Assemble Body Domain Controller and Bracket Asm

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

254

Assemble Body Domain Controller and Bracket Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

255

Fuse Box Installation \... \Zone 5 Electronics \Body Wire Harnesses \Fuse Box Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

256

Fuse Box Installation

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

257

PDC Mounting Tray Asm \... \Zone 5 Electronics \Body Wire Harnesses \PDC Mounting Tray Asm

Assembly Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

258

PDC Mounting Tray Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

259

PDC Mounting Tray Asm Detailed Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

260

PDC Mounting Tray \... \PDC Mounting Tray Asm \PDC Mounting Tray \PDC Mounting Tray Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

261

PDC Mounting Tray

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

262

Assemble Body Domain Controller and Bracket \... \Body Wire Harnesses \PDC Mounting Tray Asm \Assemble Body Domain Controller and Bracket

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

263

Assemble Body Domain Controller and Bracket

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

264

PDC Mounting Tray Installation \... \Zone 5 Electronics \Body Wire Harnesses \PDC Mounting Tray Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

265

PDC Mounting Tray Installation

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

266

Fuse Box Bracket Asm \... \Zone 5 Electronics \Body Wire Harnesses \Fuse Box Bracket Asm

Assembly Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

267

Fuse Box Bracket Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

268

Fuse Box Bracket Asm Detailed Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

269

Stamping, Fuse Box Bracket Asm \... \Fuse Box Bracket Asm \Stamping, Fuse Box Bracket Asm \Stamping, Fuse Box Bracket Asm Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

270

Stamping, Fuse Box Bracket Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

271

Assemble Fuse Box Bracket \... \Body Wire Harnesses \Fuse Box Bracket Asm \Assemble Fuse Box Bracket

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

272

Assemble Fuse Box Bracket

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

273

Fuse Box Bracket Installation \... \Zone 5 Electronics \Body Wire Harnesses \Fuse Box Bracket Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

274

Fuse Box Bracket Installation

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

275

Power Distribution Center Asm \... \Zone 5 Electronics \Body Wire Harnesses \Power Distribution Center Asm

Assembly Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

276

Power Distribution Center Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

277

Power Distribution Center Asm Detailed Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

278

Housing, Power Distribution Box \... \Power Distribution Center Asm \Housing, Power Distribution Box \Housing, Power Distribution Center Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

279

Housing, Power Distribution Box

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

280

Fuse Panel, Power Distribution \... \Body Wire Harnesses \Power Distribution Center Asm \Fuse Panel, Power Distribution

Assembly Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

281

Fuse Panel, Power Distribution

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

282

Fuse Panel, Power Distribution Detailed Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

283

Fuse Panel Buss Bar \... \Fuse Panel, Power Distribution \Fuse Panel Buss Bar \Fuse Panel Buss Bar Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

284

Fuse Panel Buss Bar

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

285

Assemble Fuse Panel \... \Power Distribution Center Asm \Fuse Panel, Power Distribution \Assemble Fuse Panel

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

286

Assemble Fuse Panel

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

287

Isolator, Power Distribution Box \... \Power Distribution Center Asm \Isolator, Power Distribution Box \Housing, Power Distribution Center Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

288

Isolator, Power Distribution Box

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

289

Assemble Power Distribution Box \... \Body Wire Harnesses \Power Distribution Center Asm \Assemble Power Distribution Box

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

290

Assemble Power Distribution Box

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

291

Cover, Power Distribution Center \... \Body Wire Harnesses \Cover, Power Distribution Center \Cover, Power Distribution Center Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

292

Cover, Power Distribution Center

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

293

Main Wire Harness Installation \... \Zone 5 Electronics \Body Wire Harnesses \Main Wire Harness Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

294

Main Wire Harness Installation

Click Here for Munro & Associates Wire Harness Report on Main Wire Harness 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

295

Driver Underbody Wire Harness Installation \... \Zone 5 Electronics \Body Wire Harnesses \Driver Underbody Wire Harness Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

296

Driver Underbody Wire Harness Installation

Click Here for Munro & Associates Wire Harness Report on Driver Underbody Wire Harness 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

297

12V Battery and Bracket Asm \... \Zone 5 Electronics \Body Wire Harnesses \12V Battery and Bracket Asm

Assembly Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

298

12V Battery and Bracket Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

299

12V Battery and Bracket Asm Detailed Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

300

12V Battery Tray Asm \... \Body Wire Harnesses \12V Battery and Bracket Asm \12V Battery Tray Asm

Assembly Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

301

12V Battery Tray Asm

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

302

12V Battery Tray Asm Detailed Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

303

12V Battery Tray Part-A \... \12V Battery Tray Asm \12V Battery Tray Part-A \12V Battery Tray Part-A Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

304

12V Battery Tray Part-A

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

305

12V Battery Tray Part-B \... \12V Battery Tray Asm \12V Battery Tray Part-B \12V Battery Tray Part-B Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

306

12V Battery Tray Part-B

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

307

12V Battery Tray Part-C \... \12V Battery Tray Asm \12V Battery Tray Part-C \12V Battery Tray Part-C Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

308

12V Battery Tray Part-C

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

309

12V Battery Tray Part-D \... \12V Battery Tray Asm \12V Battery Tray Part-D \12V Battery Tray Part-D Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

310

12V Battery Tray Part-D

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

311

Assemble Battery Tray \... \12V Battery and Bracket Asm \12V Battery Tray Asm \Assemble Battery Tray

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

312

Assemble Battery Tray

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

313

12V Battery Hold Down \... \12V Battery and Bracket Asm \12V Battery Hold Down \12V Battery Hold Down Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

314

12V Battery Hold Down

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

315

12V N Battery Terminal \... \12V Battery and Bracket Asm \12V N Battery Terminal \12V N Battery Terminal Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

316

12V N Battery Terminal

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

317

12V P Battery Terminal \... \12V Battery and Bracket Asm \12V P Battery Terminal \12V P Battery Terminal Process

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

318

12V P Battery Terminal

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

319

Assemble 12V Battery & Tray \... \Body Wire Harnesses \12V Battery and Bracket Asm \Assemble 12V Battery & Tray

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

320

Assemble 12V Battery & Tray

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

321

12V Battery and Bracket Installation \... \Zone 5 Electronics \Body Wire Harnesses \12V Battery and Bracket Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

322

12V Battery and Bracket Installation

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

323

Positive Battery Cable Wire Harness Installation \... \Zone 5 Electronics \Body Wire Harnesses \Positive Battery Cable Wire Harness Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

324

Positive Battery Cable Wire Harness Installation

Click Here for Munro & Associates Wire Harness Report on Positive Battery Cable Wire Harness Asm 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

325

Negative Battery Cable Installation \... \Zone 5 Electronics \Body Wire Harnesses \Negative Battery Cable Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

326

Negative Battery Cable Installation

Click Here for Munro & Associates Wire Harness Report on Negative Battery Cable Asm 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

327

Ground, Chassis to Power Module Installation \... \Zone 5 Electronics \Body Wire Harnesses \Ground, Chassis to Power Module Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

328

Ground, Chassis to Power Module Installation

Click Here for Munro & Associates Wire Harness Report on Ground, Chassis to Power Module Asm 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

329

Ground, Motor Asm to Power Module Installation \... \Zone 5 Electronics \Body Wire Harnesses \Ground, Motor Asm to Power Module Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

330

Ground, Motor Asm to Power Module Installation

Click Here for Munro & Associates Wire Harness Report on Ground, Motor Asm to Power Module Asm 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

331

Ground, Power Module to Chassis Installation \... \Zone 5 Electronics \Body Wire Harnesses \Ground, Power Module to Chassis Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

332

Ground, Power Module to Chassis Installation

Click Here for Munro & Associates Wire Harness Report on Ground, Power Module to Chassis 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

333

Ground, Rear X Brace To Heat Shield Installation \... \Zone 5 Electronics \Body Wire Harnesses \Ground, Rear X Brace To Heat Shield Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

334

Ground, Rear X Brace To Heat Shield Installation

Click Here for Munro & Associates Wire Harness Report on Ground, Rear X Brace To Heat Shield Asm 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

335

Ground, Chassis to Exhaust Heat Shield Installatio \... \Zone 5 Electronics \Body Wire Harnesses \Ground, Chassis to Exhaust Heat Shield Installatio

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

336

Ground, Chassis to Exhaust Heat Shield Installatio

Click Here for Munro & Associates Wire Harness Report on Ground, Chassis To Exhaust Heat Shield 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

337

Ground, Chassis to Engine Installation \... \Zone 5 Electronics \Body Wire Harnesses \Ground, Chassis to Engine Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

338

Ground, Chassis to Engine Installation

Click Here for Munro & Associates Wire Harness Report on Ground, Chassis to Engine 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

339

Ground, AC Compressor To Motor Installation \... \Zone 5 Electronics \Body Wire Harnesses \Ground, AC Compressor To Motor Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

340

Ground, AC Compressor To Motor Installation

Click Here for Munro & Associates Wire Harness Report on Ground, AC Compressor To Motor 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

341

Ground, Chassis to Motor Installation \... \Zone 5 Electronics \Body Wire Harnesses \Ground, Chassis to Motor Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

342

Ground, Chassis to Motor Installation

Click Here for Munro & Associates Wire Harness Report on Ground, Chassis to Motor 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

343

Steering Column Ground Strap Installation \... \Zone 5 Electronics \Body Wire Harnesses \Steering Column Ground Strap Installation

Process Summary

* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

344

Steering Column Ground Strap Installation

Click Here for Munro & Associates Wire Harness Report on Steering Column Ground Strap Asm 7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

345

Appendix Reports

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

346

Appendix

TechInsights Electronics Reports

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

347

Deep Dive Report

BMW i3 Digital Radio Module HBB125 Satellite Radio, WiFi 802.11a/b/g, Bluetooth 3.0 Report #15200-150210-RBb

Product Description The HBB125 is the digital radio module included in models of the BMW i3. Along with the ubiquitous AM / FM radio, the HBB125 adds a 200 GB hard drive and Sirius / XM radio. Connectivity is provided via GPS, WiFi 802.11 a/b/g and Bluetooth 3.0, with CAN and USB 2.0 protocols also present in this device, but not user accessible. At its core are three different processors: Intel E660T "Atom" processor, Texas Instruments Jacinto Automotive Applications processor and Nvidia GeForce 8 (G-98) Graphics processor. In addition, over 9.8 GB of system memory has been implemented in the form of SDRAM, Flash and EEPROM from companies that include Micron, Spansion, STMicroelectronics, Microchip, Atmel and ISSI.

DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information. Copyright © 2015, TechInsights. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of TechInsights.

www.teardown.com [email protected]

Product Overview Product Description

Integrated Circuit Metrics

Product Type

Automotive

IC Die Count**

119

Brand

BMW (Harman)

IC Package Count**

117

Product Name & Model #

i3 Digital Radio Module, HBB125

Official Release Date

5/2/2014

Weight (grams)

1790

Retail Price

Dimensions (mm)

230 x 190 x 116

Total Manufacturing Cost

$558.65

Electronics Cost**

$435.39

Cost Metrics

Product Features

$2,700.00

Manufacturing Cost Breakdown

Connectivity

AM/FM Radio, Satellite Radio, WiFi 802.11a/b/g, Bluetooth 3.0, GPS

Processors

(1) (2) (3) (4) (5) (6)

Intel E660T 1.3 GHz Atom Processor Texas Instruments Jacinto Automotive Applications Processor NXP Semi SAF3560 Terrestrial Digital Radio Processor NXP Semi SAF7741 Car Radio Digital Signal Processor UBlox UBX-G6000 GPS Baseband Processor Nvidia EMP9 (G-98) Graphics Processor

Storage

200 GB Hard Drive 9.8 GB Total Solid-State Storage (not user-accessible)

Interface

None (User interface located elsewhere in the vehicle)

Sensors

Temperature

Integrated Circuits

$273.32

48.9%

Modules, Discretes & Connectors

$83.23

14.9%

Substrates

$18.72

3.4%

Component Insertion

$17.89

3.2%

$8.74

1.6%

Hard Drive*

$29.14

5.2%

Sirius XM Radio Module

$48.03

8.6%

Non-Electronic Parts

$57.31

10.3%

Final Assembly & Test

$22.27

4.0%

Card Test

Total

$558.65 100.0%

*Line Item Cost Only **Including Subsystems

Key Subsystems Sirius XM Radio Module

STMicroelectronics STA280BB Baseband Processor & STA210N3A Satellite Radio Tuner

Drives

Hard Drive: Automotive-Grade 2.5" 200 GB SATA, 8 MB Cache, 4200 RPM

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 349

Block Diagram 9 - Avago #AFBR-2012S Optical Receiver

Fan 31 - Maxim #MAX6414UK31 Microprocessor Reset Circuit

29 - Microchip #OS81060AM Intelligent Network Interface Controller

8 - Avago #AFBR-1012S Optical Transmitter

11 - Atmel #ATmega169P 8-Bit Microcontroller w/ 16 KB Flash 1 - NXP Semiconductor #TDA8579 Differential Line Receiver

2 - AKM Semiconductor #AK4628A Multichannel Audio CODEC

4 - STMicroelectronics #TDA7569BLVPD 4 x 50 W Audio Power Amplifier

Mother Board

3 - Analog Devices #ADV7180 SDTV Video Decoder

6 - Atmel #ATtiny261 8-Bit Microcontroller w/ Flash

Radio Board

Power Board

35 - AKM Semiconductor #AK5359 Stereo A/D Converter

32 - Maxim #MAX3221EEAE+ RS-232 Transceiver

12 - Micron #MT48LC16M16A2 SDR SDRAM Memory - 32 MB

26 - Micron #MT48LC16M16A2 SDR SDRAM Memory - 32 MB

37 - Texas Instruments #DRH443HSBIZDU Jacinto Automotive Applications Processor

16 - NXP Semiconductor #TJA1041 CAN Transceiver

25 - Spansion #S29GL512S10DHA02 NOR Flash Memory - 64 MB

Main Board Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 350

Block Diagram WiFi Antenna Coaxial Connector Mauve

Beige

Blue

46 - Marvell Semiconductor #88W8688 Single-Chip Bluetooth 3.0 / WiFi 802.11a/b/g

45 - Microchip #25LC080 EEPROM Memory - 1 KB

51 - UBlox #UBX-G6000 GPS Baseband Processor

Interconnect Board

50 - UBlox #BX-G0010-QA GPS Front-End

64 - Skyworks #AS179 SPDT GaAs Switch

47 - Microsemi #LX5511 2.4 GHz WiFi Power Amplifier

Hard Drive

GPS Antenna Coaxial Connector

Bluetooth Antenna Coaxial Connector

52 - Micron #M29W400FT NOR Flash Memory - 512 KB

USB3

Main Board

USB2

USB1

53 - Micron #M25PX32-VZM6FBA Serial NOR Flash Memory - 4 MB

APIX

65 - Inova Semiconductor #INAP375T Automotive Pixel Link Transmitter

54 - Xilinx #XA6SLX45T Spartan-6 Automotive FPGA

67 - NVIDIA #EMP9 (G-98) Graphics Processor

69 - Maxim #MAX6649 Temperature Sensor

Copyright © 2015, TechInsights

7 June 2017

49 - Renesas #R5H30201D Microcontroller

44 - Micron #MT47H64M16HR-25E AIT - Micron DDR2 SDRAM44 Memory - 128 MB #MT47H64M16HR-25E AIT DDR2 SDRAM Memory - 128 MB

68 - Micron #MT47H64M16HR-25E AIT - Micron DDR2 SDRAM68 Memory - 128 MB #MT47H64M16HR-25E AIT DDR2 SDRAM Memory - 128 MB

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

Daughter Board

Mother Board BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 351

Block Diagram 85 - Micron #M25PX32-VMP6FBA Serial NOR Flash Memory - 4 MB

76 - Micron #MT47H128M8CF-25E 76 - Micron AIT:H DDR2 SDRAM Memory - 128AIT:H MB #MT47H128M8CF-25E 76 - Micron DDR2 SDRAM Memory - 128AIT:H MB #MT47H128M8CF-25E 76 - Micron DDR2 SDRAM Memory - 128AIT:H MB #MT47H128M8CF-25E DDR2 SDRAM Memory - 128 MB

84 - Micron #MT47H128M8CF-25E 84 - Micron AIT:H DDR2 SDRAM Memory - 128AIT:H MB #MT47H128M8CF-25E 84 - Micron DDR2 SDRAM Memory - 128AIT:H MB #MT47H128M8CF-25E 84 - Micron DDR2 SDRAM Memory - 128AIT:H MB #MT47H128M8CF-25E DDR2 SDRAM Memory - 128 MB 80 - Intel #E660T 1.30 GHz Atom Processor

79 - STMicroelectronics #STA2X11 I/O Controller Hub

78 - Micrel #KSZ8041NL Ethernet Transceiver

77 - Micron #MTFC8GLGDM-AIT Z Multichip Memory - 8 GB MLC NAND Flash, Memory Controller (eMMC)

83 - Rohm #BD9592AMWV Power Management

81 - Rohm #BU7336MWV Clock Generator

Mother Board

Daughter Board Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 352

Block Diagram AM/FM1 Antenna Coaxial Connector

FM2 Antenna Coaxial Connector

Black

Satellite Radio Antenna Coaxial Connector

White

94 - NXP Semiconductor #TEF7000HN Digital Radio Front-End

Pink

Sirius/XM Radio Module

95 - NXP Semiconductor #TEF7000HN Digital Radio Front-End

DIPL

99 - STMicroelectronics #STA210N3A Satellite Radio Tuner

FM

91 - Silicon Labs #Si4761 AM/FM Radio Receiver & HD Radio Tuner

AM

90 - NXP Semiconductor #SAF7741 Car Radio Digital Signal Processor

88 - NXP Semiconductor #SAF3560 Terrestrial Digital Radio Processor

100 - Spansion #S29GL032N90BF104 NOR Flash Memory - 4 MB 102 - ISSI #IS46LR16320B-6BLA1 DDR SDRAM Memory - 64 MB

101 - STMicroelectronics #STA280BB Baseband Processor

98 - Micron #M25P80 Serial NOR Flash Memory - 1 MB

96 - Atmel #AT24C64A-10TU Serial EEPROM Memory - 8 KB

89 - Micron #MT48LC8M16A2P-6A AIT:L Automotive SDR SDRAM - 16 MB 93 - Silicon Labs #Si4749 FM RDS / RBDS Data Receiver / Alternate Frequency Scanner

Main Board

Radio Board Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 353

Product Labels

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 354

Product Labels

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 355

Exterior Features

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 356

Exterior Features APIX Bluetooth Antenna USB3 USB2 USB1

WiFi Antenna Vehicle Wiring Harness GPS Antenna AM/FM1 Antenna FM2 Antenna

Satellite Radio Antenna

Fiber Optic Cables

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 357

Major Components (Side 1)

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 358

Major Components (Side 2)

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 359

Component Arrangement

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 360

Teardown Sequence

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 361

Teardown Sequence

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 362

Teardown Sequence

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 363

Teardown Sequence

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 364

Teardown Sequence

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 365

Teardown Sequence

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 366

Teardown Sequence

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 367

Teardown Sequence

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 368

Teardown Sequence

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 369

Teardown Sequence

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 370

Teardown Sequence

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 371

Teardown Sequence

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 372

Teardown Sequence

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 373

Teardown Sequence

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 374

Teardown Sequence Removal of material in these areas was required in order to separate the three PC boards.

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 375

Teardown Sequence

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 376

Hard Drive Subsystem Hard Drive Brand Part Number Module Dimensions Weight (grams) Estimated Module Line Item Price

Toshiba MK2060GSC 100 x 69.6 x 9.5 88.40 $29.14

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 377

Sirius XM Radio Module Sirius XM Radio Module as assembled on side 2 of the Radio Board.

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 378

Sirius XM Radio Board (Side 1) 99 - STMicroelectronics #STA210N3A Satellite Radio Tuner

100 - Spansion #S29GL032N90BF104 NOR Flash Memory - 4 MB

101 - STMicroelectronics #STA280BB Baseband Processor

102 - ISSI #IS46LR16320B-6BLA1 DDR SDRAM Memory - 64 MB

103 - Texas Instruments #SN74LVC1G17 Single Schmitt-Trigger Buffer

104 - Texas Instruments #LP3907 Dual DC/DC & Dual Linear Regulators

Radio Board

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 379

Sirius XM Radio Board (Side 2)

105 - Texas Instruments #LMC7101Q-Q1 Operational Amplifier

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 380

Sirius XM Radio Module Sirius XM Radio Module Brand Part Number Module Dimensions Weight (grams)

Estimated Costs

Electronic Parts Non-Electronic Parts Assembly Test Gross Margin

Estimated Module Price

Sirius 91UMSR5H.GB3AG 71.5 x 45.3 x 10.3 41.50 $31.65 $0.10 $1.52 $0.35 $14.41 $48.03

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 381

Main Board (Side 1) Power Board

Radio Board

Heat Sink Fan

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Not Used Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 382

Main Board (Side 1)

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 383

Main Board (Side 1 IC Identification) 1 - NXP Semiconductor #TDA8579 Differential Line Receiver

2 - AKM Semiconductor #AK4628A Multichannel Audio CODEC

3 - Analog Devices #ADV7180 SDTV Video Decoder

17 - Infineon #TLE4276DV 400 mA Adjustable LDO Regulator

4 - STMicroelectronics #TDA7569BLVPD 4 x 50 W Audio Power Amplifier

16 - NXP Semiconductor #TJA1041 CAN Transceiver

15 - Intersil #ISL78213ARZ 3 A DC-DC Converter

5 - NXP Semiconductor #74LVC14APW Hex Inverting Schmitt Trigger 6 - Atmel #ATtiny261 8-Bit Microcontroller w/ Flash

13 - Texas Instruments #SN74LVC1G08DCK 2-Input Positive-AND Gate

7 - Texas Instruments #SN74LVC125APW Quad Buffer

12 - Micron #MT48LC16M16A2 SDR SDRAM Memory - 32 MB

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

11 - Atmel #ATmega169P 8-Bit Microcontroller w/ 16 KB Flash

10 - Intersil #ISL78310 1 A LDO Regulator

Copyright © Munro & Associates, Inc. 2015

9 - Avago #AFBR-2012S Optical Receiver

www.LeanDesign.com

8 - Avago #AFBR-1012S Optical Transmitter BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 384

Main Board (Side 1 IC Identification) 18 - Texas Instruments #SN74HC4066PW Quad Bilateral Switch

19 - Texas Instruments #SN74LVC1G08IDCK 2-Input Positive-AND Gate

24 - Maxim #MAX4835ETT18BD2+T 250 mA / 1.8 V LDO Regulator

20 - Texas Instruments #SN74LVC2G125-Q1 Dual Bus Buffer

21 - NXP Semiconductor #74LVC1G14GW Single Schmitt-Trigger Inverter

13 - Texas Instruments #SN74LVC1G08DCK 2-Input Positive-AND Gate

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 385

Main Board (Side 2) Mother Board

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 386

Main Board (Side 2 IC Identification) 27 - Texas Instruments #SN74LVC125APW Quad Buffer

28 - NXP Semiconductor #74LVC08A Quad 2-Input AND Gate

26 - Micron #MT48LC16M16A2 SDR SDRAM Memory - 32 MB

29 - Microchip #OS81060AM Intelligent Network Interface Controller

30 - STMicroelectronics #L5973D 2 A DC-DC Converter

25 - Spansion #S29GL512S10DHA02 NOR Flash Memory - 64 MB

31 - Maxim #MAX6414UK31 Microprocessor Reset Circuit 32 - Maxim #MAX3221EEAE+ RS-232 Transceiver

37 - Texas Instruments #DRH443HSBIZDU Jacinto Automotive Applications Processor

33 - Linear Technology #LTC3859 DC/DC Converter 36 - Infineon #TLF4277 200 mA LDO Regulator

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

34 - Intersil #ISL78310 1 A LDO Regulator

30 - STMicroelectronics #L5973D 2 A DC-DC Converter

35 - AKM Semiconductor #AK5359 Stereo A/D Converter

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 387

Main Board (Side 2 IC Identification)

38 - Texas Instruments #SN74LVC1G08IDCK 2-Input Positive-AND Gate

42 - Analog Devices #ADA4851-2WYRMZ-R7 Operational Amplifier

41 - Infineon #TLE4266 150 mA / 5 V LDO Regulator

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 388

Main Board Cross-Section

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 389

Mother Board (Side 1) Not Used

Interconnect Board

Main Board

APIX Grid = 1 cm

Bluetooth Antenna

Copyright © 2015, TechInsights

7 June 2017

WiFi Antenna USB3 USB2 USB1

Copyright © Munro & Associates, Inc. 2015

GPS Antenna

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 390

Mother Board (Side 1 IC Identification) 43 - Intersil #ISL78214ARZ 4 A DC-DC Converter

55 - Intersil #ISL78213ARZ 3 A DC-DC Converter

44 - Micron #MT47H64M16HR-25E AIT DDR2 SDRAM Memory - 128 MB

54 - Xilinx #XA6SLX45T Spartan-6 Automotive FPGA

53 - Micron #M25PX32-VZM6FBA Serial NOR Flash Memory - 4 MB

45 - Microchip #25LC080 EEPROM Memory - 1 KB

46 - Marvell Semiconductor #88W8688 Single-Chip Bluetooth 3.0 / WiFi 802.11a/b/g

52 - Micron #M29W400FT NOR Flash Memory - 512 KB

47 - Microsemi #LX5511 2.4 GHz WiFi Power Amplifier

51 - UBlox #UBX-G6000 GPS Baseband Processor 50 - UBlox #BX-G0010-QA GPS Front-End

48 - Texas Instruments #LM2903D Dual Comparator

49 - Renesas #R5H30201D Microcontroller

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 391

Mother Board (Side 1 IC Identification)

63 - Texas Instruments #SN74LVC1G08DCK 2-Input Positive-AND Gate

56 - Intersil #ISL78310 1 A LDO Regulator

62 - NXP Semiconductor #74LVC14APW Hex Inverting Schmitt Trigger

57 - STMicroelectronics #TL431AIYD Programmable Voltage Reference

58 - Maxim #MAX4835ETT18BD2+T 250 mA / 1.8 V LDO Regulator

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 392

Mother Board (Side 2)

Daughter Board

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 393

Mother Board (Side 2 IC Identification)

64 - Skyworks #AS179 SPDT GaAs Switch

65 - Inova Semiconductor #INAP375T Automotive Pixel Link Transmitter 66 - STMicroelectronics #L5973D 2 A DC-DC Converter

66 - STMicroelectronics #L5973D 2 A DC-DC Converter

71 - Texas Instruments #SN74LVC1G08DCK 2-Input Positive-AND Gate

67 - NVIDIA #EMP9 (G-98) Graphics Processor 68 - Micron #MT47H64M16HR-25E AIT DDR2 SDRAM Memory - 128 MB

73 - Texas Instruments #SN74CBTD3384PW Bus Switch

72 - Maxim #MAX8517 1 A LDO Regulator 69 - Maxim #MAX6649 Temperature Sensor 70 - Intersil #ISL78210 DC-DC Converter

71 - Texas Instruments #SN74LVC1G08DCK 2-Input Positive-AND Gate

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 394

Mother Board (Side 2 IC Identification) 74 - Unknown #E8 ? ESD Protection ?

75 - Unknown #HSA ? EMI Filter ?

? = Unconfirmed

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 395

Mother Board (Cross-Section)

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 396

Daughter Board (Side 1)

Mother Board

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 397

Daughter Board (Side 1 IC Identification) 76 - Micron #MT47H128M8CF-25E AIT:H DDR2 SDRAM Memory - 128 MB

77 - Micron #MTFC8GLGDM-AIT Z Multichip Memory - 8 GB MLC NAND Flash, Memory Controller (eMMC) (3-Die Pkg.)

78 - Micrel #KSZ8041NL Ethernet Transceiver

79 - STMicroelectronics #STA2X11 I/O Controller Hub

82 - Texas Instruments #SN74LVC1G125DBV Single Buffer

83 - Rohm #BD9592AMWV Power Management

80 - Intel #E660T 1.30 GHz Atom Processor

81 - Rohm #BU7336MWV Clock Generator

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 398

Daughter Board (Side 1 X-Rays)

77.1 - Micron #L73A MLC NAND Flash Memory - 4 GB Die Size: 10.3 x 8.8 mm

77.2 - Micron #PS8200 Memory Controller Die Size: 4.7 x 1.8 mm

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

77 - Micron #MTFC8GLGDM-AIT Z Multichip Memory - 8 GB MLC NAND Flash, Memory Controller (eMMC) (3-Die Pkg.) Pkg Size: 13 x 11.5 mm BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 399

Daughter Board (Side 1 X-Rays)

77.1 - Micron #L73A MLC NAND Flash Memory - 4 GB Die Size: 10.3 x 8.8 mm

77.2 - Micron #PS8200 Memory Controller Die Size: 4.7 x 1.8 mm

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

77 - Micron #MTFC8GLUDM-AIT Multichip Memory - 8 GB MLC NAND Flash, Memory Controller (eMMC) (3-Die Pkg.) Pkg Size: 13 x 11.5 mm BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 400

Daughter Board (Side 2)

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 401

Daughter Board (Side 2 IC Identification) 84 - Micron #MT47H128M8CF-25E AIT:H DDR2 SDRAM Memory - 128 MB

85 - Micron #M25PX32-VMP6FBA Serial NOR Flash Memory - 4 MB

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 402

Daughter Board (Cross-Section)

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 403

Radio Board (Side 1) Not Used

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 404

Radio Board (Side 1 IC Identification) 87 - Texas Instruments #LM1117IMP-ADJ/NOPB 800 mA Adjustable LDO Regulator

88 - NXP Semiconductor #SAF3560 Terrestrial Digital Radio Processor

89 - Micron #MT48LC8M16A2P-6A AIT:L Automotive SDR SDRAM - 16 MB

91 - Silicon Labs #Si4761 AM/FM Radio Receiver & HD Radio Tuner

90 - NXP Semiconductor #SAF7741 Car Radio Digital Signal Processor

92 - Texas Instruments #LMV331M5 Comparator

93 - Silicon Labs #Si4749 FM RDS / RBDS Data Receiver / Alternate Frequency Scanner

94 - NXP Semiconductor #TEF7000HN Digital Radio Front-End

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 405

Radio Board (Side 2) Main Board AM/FM 1 Antenna

Sirius XM Radio Module FM 2 Antenna

Satellite Radio Antenna

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 406

Radio Board (Side 2 IC Identification) 95 - NXP Semiconductor #TEF7000HN Digital Radio Front-End

96 - Atmel #AT24C64A-10TU Serial EEPROM Memory - 8 KB

97 - Infineon #TLF4277 200 mA LDO Regulator

98 - Micron #M25P80 Serial NOR Flash Memory - 1 MB

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 407

Power Board with Connector (Side 1)

To Vehicle Wiring Harness

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 408

Power Board (Side 1)

Vehicle Wiring Harness Connector removed

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Main Board

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 409

Power Board (Side 2)

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 410

Interconnect Board Mother Board

Hard Drive

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 411

Substrate Data Substrates Assembly Name Daughter Board Interconnect Board Main Board Mother Board Power Board Radio Board

Manufactur er

AT&S FR4 CircuiTech Precision FR4 Electronics Compeq FR4 AT&S FR4 Compeq FR4 Denka FR4

Copyright © 2015, TechInsights

7 June 2017

Core Material

Mfg. Technology

8 Layer buildup FR4 / HF 4 Layer conventional FR4 / HF 6 Layer conventional FR4 / HF 8 Layer conventional FR4 / HF 6 Layer conventional FR4 / HF 6 Layer conventional FR4 / HF

Area (cm²)

Layers

8 4 6 8 6 6

87.1 41.1 223.0 219.0 81.4 107.1

Min. Trace Pitch (mm) 0.25 0.20 0.20 0.25 0.40 0.30

Min. Trace Width (mm) 0.10 0.10 0.10 0.10 0.15 0.10

Copyright © Munro & Associates, Inc. 2015

ThruVia Land Dia (mm)

ThruVia Hole Dia (mm)

BlindVia Land Dia (mm) 0.30

0.60 0.60 0.40 0.70 0.50

0.45 0.25 0.20 0.40 0.30

www.LeanDesign.com

BlindVia Hole Dia (mm) 0.05

Thickness (mm) 1.3 1.4 1.4 1.3 1.5 1.6

Routing Density 39.5 19.3 21.6 31.6 9.8 20.3

Estimated Costs $ $ $ $ $ $

5.21 0.76 3.57 5.15 1.82 2.21

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 412

Integrated Circuit Components Package Info

Estimated Costs

Die Info

Location Pkg Ref. #

Pkg Qty

Brand Name

Main Board, Side 1

1 2 3 4 5 6 7 8 9 10 11 12 13 15 16 17 18 19 20 21 24

1 1 1 1 1 1 1 1 1 1 1 1 3 1 1 1 1 1 1 1 1

NXP Semiconductor AKM Semiconductor Analog Devices STMicroelectronics NXP Semiconductor Atmel Texas Instruments Avago Avago Intersil Atmel Micron Texas Instruments Intersil NXP Semiconductor Infineon Texas Instruments Texas Instruments Texas Instruments NXP Semiconductor Maxim

TDA8579 AK4628A ADV7180 TDA7569BLVPD 74LVC14APW ATtiny261 SN74LVC125APW AFBR-1012S AFBR-2012S ISL78310 ATmega169P MT48LC16M16A2 SN74LVC1G08DCK ISL78213ARZ TJA1041 TLE4276DV SN74HC4066PW SN74LVC1G08IDCK SN74LVC2G125-Q1 74LVC1G14GW MAX4835ETT18BD2+T

Main Board, Side 2

25 26 27 28 29 30 31 32 33 34 35 36 37 38 41 42

1 1 1 1 1 2 1 1 1 1 1 2 1 1 1 1

Spansion Micron Texas Instruments NXP Semiconductor Microchip STMicroelectronics Maxim Maxim Linear Technology Intersil AKM Semiconductor Infineon Texas Instruments Texas Instruments Infineon Analog Devices

S29GL512S10DHA02 MT48LC16M16A2 SN74LVC125APW 74LVC08A OS81060AM L5973D MAX6414UK31 MAX3221EEAE+ LTC3859 ISL78310 AK5359 TLF4277 DRH443HSBIZDU SN74LVC1G08IDCK TLE4266 ADA4851-2WYRMZ-R7

Part Number

Form

Pin Count

Length (mm)

Width (mm)

Height (mm)

Die Ref #

Die Qty

Differential Line Receiver Multichannel Audio CODEC SDTV Video Decoder 4 x 50 W Audio Power Amplifier Hex Inverting Schmitt Trigger 8-Bit Microcontroller w/ Flash Quad Buffer Optical Transmitter Optical Receiver 1 A LDO Regulator 8-Bit Microcontroller w/ 16 KB Flash SDR SDRAM Memory - 32 MB 2-Input Positive-AND Gate 3 A DC-DC Converter CAN Transceiver 400 mA Adjustable LDO Regulator Quad Bilateral Switch 2-Input Positive-AND Gate Dual Bus Buffer Single Schmitt-Trigger Inverter 250 mA / 1.8 V LDO Regulator

SOP QFP QFP SOP SOP QFN SOP TO TO DFN QFP TSOP SOP QFN SOP TO SOP SOP SOP SOP DFN

8 44 48 36 14 32 14 4 4 10 64 54 5 16 14 5 14 5 8 5 6

4.90 10.00 6.80 15.90 5.00 5.00 5.00 7.10 7.10 3.00 13.80 22.30 2.10 4.00 8.80 6.50 5.20 2.10 2.30 2.10 3.00

3.90 9.90 6.80 11.20 4.40 5.00 4.40 5.60 5.60 3.00 13.80 10.00 1.20 4.00 3.90 6.10 4.40 1.20 2.00 1.20 3.00

1.60 1.50 1.60 3.40 1.10 1.00 1.00 2.70 2.70 1.00 1.10 1.20 1.00 1.00 1.70 2.40 1.00 1.00 0.80 1.00 0.80

1.1 2.1 3.1 4.1 5.1 6.1 7.1 8.1 9.1 10.1 11.1 12.1 13.1 15.1 16.1 17.1 18.1 19.1 20.1 21.1 24.1

1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1

NXP Semiconductor AKM Semiconductor Analog Devices STMicroelectronics NXP Semiconductor Atmel Texas Instruments Avago Avago Intersil Atmel Micron Texas Instruments Intersil NXP Semiconductor Infineon Texas Instruments Texas Instruments Texas Instruments NXP Semiconductor Maxim

TDA8579 5616 TV718_D UK75AA C5181 AT35462 LVC125K M1293012 M1384 53698A01 AT35504 T36 L08E 53609A01 cF1142A TLE4276DV LC705E L08E L2G125D CP32 A524Z-S

NOR Flash Memory - 64 MB SDR SDRAM Memory - 32 MB Quad Buffer Quad 2-Input AND Gate Intelligent Network Interface Controller 2 A DC-DC Converter Microprocessor Reset Circuit RS-232 Transceiver DC/DC Converter 1 A LDO Regulator Stereo A/D Converter 200 mA LDO Regulator Jacinto Automotive Applications Processor 2-Input Positive-AND Gate 150 mA / 5 V LDO Regulator Operational Amplifier

BGA TSOP SOP SOP QFN SOP SOP SOP QFN DFN TSOP SOP BGA SOP SOP SOP

64 54 14 14 40 8 5 16 38 10 16 14 352 5 4 8

9.00 22.30 5.00 5.00 5.70 5.00 3.00 6.10 7.00 3.00 5.00 5.10 23.00 2.10 6.40 2.90

9.00 10.00 4.40 4.40 5.70 3.80 1.60 5.10 5.00 3.00 4.30 3.90 23.00 1.20 3.40 2.90

1.00 1.20 1.00 1.00 0.90 1.60 1.30 1.90 0.80 1.00 1.00 1.40 1.90 1.00 1.60 1.00

25.1 26.1 27.1 28.1 29.1 30.1 31.1 32.1 33.1 34.1 35.1 36.1 37.1 38.1 41.1 42.1

1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1

Spansion Micron Texas Instruments NXP Semiconductor Microchip STMicroelectronics Maxim Maxim Linear Technology Intersil AKM Semiconductor Infineon Texas Instruments Texas Instruments Infineon Analog Devices

98290A T36 LVC125K PS70D7 OS87260 CUD73E M560Z-2 R560V -1 BF3859 53698A01 5841 TLF4277 F761977B L08E TLE4266 ADA4851_2R1

Pkg Description

Brand Name

Part Number

Length (mm)

Width (mm)

Differential Line Receiver Multichannel Audio CODEC SDTV Video Decoder 4 x 50 W Audio Power Amplifier Hex Inverting Schmitt Trigger 8-Bit Microcontroller w/ Flash Quad Buffer Optical Transmitter Optical Receiver 1 A LDO Regulator 8-Bit Microcontroller w/ 16 KB Flash SDR SDRAM Memory - 32 MB 2-Input Positive-AND Gate 3 A DC-DC Converter CAN Transceiver 400 mA Adjustable LDO Regulator Quad Bilateral Switch 2-Input Positive-AND Gate Dual Bus Buffer Single Schmitt-Trigger Inverter 250 mA / 1.8 V LDO Regulator

2.10 3.60 3.40 6.50 0.66 2.10 1.00 1.50 1.70 1.30 3.90 5.40 0.50 2.00 3.20 2.10 0.90 0.50 0.80 0.40 2.30

1.80 3.20 3.30 5.00 0.55 1.90 0.80 1.00 1.00 1.10 3.60 3.20 0.50 2.00 1.90 1.80 0.90 0.50 0.60 0.30 1.10

$ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $

0.253 2.559 2.973 6.181 0.107 1.303 0.126 0.775 0.808 0.129 4.196 2.054 0.042 0.294 1.211 0.233 0.127 0.042 0.072 0.037 0.164

$ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $

0.253 2.559 2.973 6.181 0.107 1.303 0.126 0.775 0.808 0.129 4.196 2.054 0.127 0.294 1.211 0.233 0.127 0.042 0.072 0.037 0.164

NOR Flash Memory - 64 MB SDR SDRAM Memory - 32 MB Quad Buffer Quad 2-Input AND Gate Intelligent Network Interface Controller 2 A DC-DC Converter Microprocessor Reset Circuit RS-232 Transceiver DC/DC Converter 1 A LDO Regulator Stereo A/D Converter 200 mA LDO Regulator Automotive Applications Processor 2-Input Positive-AND Gate 150 mA / 5 V LDO Regulator Operational Amplifier

6.70 5.40 1.00 0.60 2.90 2.70 0.90 4.00 2.60 1.30 2.10 2.50 7.00 0.50 1.60 1.10

4.90 3.20 0.80 0.50 2.50 1.90 0.90 2.30 1.50 1.10 1.70 2.10 6.80 0.50 1.30 0.80

$ 3.275 $ 2.054 $ 0.126 $ 0.105 $ 1.793 $ 0.292 $ 0.069 $ 1.467 $ 0.390 $ 0.129 $ 0.798 $ 0.324 $ 29.371 $ 0.042 $ 0.133 $ 0.093

$ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $

3.275 2.054 0.126 0.105 1.793 0.585 0.069 1.467 0.390 0.129 0.798 0.648 29.371 0.042 0.133 0.093

Description

Each

Total

Note: Continued on next page... Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 413

Integrated Circuit Components -Continued Package Info

Estimated Costs

Die Info

Location Pkg Ref. #

Pkg Qty

Brand Name

Mother Board, Side 1

43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 62 63

2 2 1 1 1 1 1 1 1 1 1 1 1 2 1 1 1 1

Intersil Micron Microchip Marvell Semiconductor Microsemi Texas Instruments Renesas UBlox UBlox Micron Micron Xilinx Intersil Intersil STMicroelectronics Maxim NXP Semiconductor Texas Instruments

ISL78214ARZ MT47H64M16HR-25E AIT 25LC080 88W8688 LX5511 LM2903D R5H30201D BX-G0010-QA UBX-G6000 M29W400FT M25PX32-VZM6FBA XA6SLX45T ISL78213ARZ ISL78310 TL431AIYD MAX4835ETT18BD2+T 74LVC14APW SN74LVC1G08DCK

4 A DC-DC Converter DDR2 SDRAM Memory - 128 MB EEPROM Memory - 1 KB Single-Chip Bluetooth 3.0 / WiFi 802.11a/b/g 2.4 GHz WiFi Power Amplifier Dual Comparator Microcontroller GPS Front-End GPS Baseband Processor NOR Flash Memory - 512 KB Serial NOR Flash Memory - 4 MB Spartan-6 Automotive FPGA 3 A DC-DC Converter 1 A LDO Regulator Programmable Voltage Reference 250 mA / 1.8 V LDO Regulator Hex Inverting Schmitt Trigger 2-Input Positive-AND Gate

Mother Board, Side 2

64 65 66 67 68 69 70 71 72 73 74 75

1 1 2 1 2 1 1 2 1 1 6 1

Skyworks Inova Semiconductor STMicroelectronics NVIDIA Micron Maxim Intersil Texas Instruments Maxim Texas Instruments Unknown Unknown

AS179 INAP375T L5973D EMP9 (G-98) MT47H64M16HR-25E AIT MAX6649 ISL78210 SN74LVC1G08DCK MAX8517 SN74CBTD3384PW E8 ? HSA ?

SPDT GaAs Switch Automotive Pixel Link Transmitter 2 A DC-DC Converter Graphics Processor DDR2 SDRAM Memory - 128 MB Temperature Sensor DC-DC Converter 2-Input Positive-AND Gate 1 A LDO Regulator Bus Switch ESD Protection ? EMI Filter ?

76

4

Micron

MT47H128M8CF-25E AIT:H

DDR2 SDRAM Memory - 128 MB

77

1

Micron

MTFC8GLGDM-AIT Z

Multichip Memory - 8 GB MLC NAND Flash, Memory BGA Controller Stacked(eMMC) 2+1

78 79 80 81 82 83

1 1 1 1 1 1

Micrel STMicroelectronics Intel Rohm Texas Instruments Rohm

KSZ8041NL STA2X11 E660T BU7336MWV SN74LVC1G125DBV BD9592AMWV

Ethernet Transceiver I/O Controller Hub 1.30 GHz Atom Processor Clock Generator Single Buffer Power Management

QFN BGA BGA QFN SOP QFN

32 361 676 64 5 88

Daughter Board, Side 2

84 85

4 1

Micron Micron

MT47H128M8CF-25E AIT:H M25PX32-VMP6FBA

DDR2 SDRAM Memory - 128 MB Serial NOR Flash Memory - 4 MB

BGA QFN

Radio Board, Side 1

87 88 89 90 91 92 93 94

1 1 1 1 1 1 1 1

Texas Instruments NXP Semiconductor Micron NXP Semiconductor Silicon Labs Texas Instruments Silicon Labs NXP Semiconductor

LM1117IMP-ADJ/NOPB SAF3560 MT48LC8M16A2P-6A AIT:L SAF7741 Si4761 LMV331M5 Si4749 TEF7000HN

800 mA Adjustable LDO Regulator SOP Terrestrial Digital Radio Processor QFN Automotive SDR SDRAM - 16 MB SOP Car Radio Digital Signal Processor QFN AM/FM Radio Receiver & HD Radio Tuner QFN Comparator SOP FM RDS / RBDS Data Receiver / Alternate Frequency Scanner QFN Digital Radio Front-End QFN

Radio Board, Side 2

95 96 97 98

1 1 1 1

NXP Semiconductor Atmel Infineon Micron

TEF7000HN AT24C64A-10TU TLF4277 M25P80

Digital Radio Front-End Serial EEPROM Memory - 8 KB 200 mA LDO Regulator Serial NOR Flash Memory - 1 MB

Daughter Board, Side 1

Totals

110

Part Number

Pkg Description

Form

Pin Count

Length (mm)

Width (mm)

Height (mm)

Die Ref #

Die Qty

QFN BGA SOP BGA QFN SOP SOP QFN BGA BGA BGA BGA QFN DFN SOP DFN SOP SOP

16 84 8 152 16 8 8 24 100 48 24 484 16 10 8 6 14 5

4.00 12.60 3.00 10.00 3.00 5.00 5.00 4.00 9.00 8.00 8.00 23.00 4.00 3.00 5.10 3.00 5.00 2.10

4.00 8.00 2.90 6.00 3.00 3.90 3.80 4.00 9.00 6.00 6.00 23.00 4.00 3.00 4.10 3.00 4.40 1.20

1.00 1.00 1.00 0.74 1.00 1.50 1.50 0.90 0.70 0.80 0.80 2.30 1.00 1.00 1.50 0.80 0.90 1.00

43.1 44.1 45.1 46.1 47.1 48.1 49.1 50.1 51.1 52.1 53.1 54.1 55.1 56.1 57.1 58.1 62.1 63.1

1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1

Intersil Micron Microchip Marvell Semiconductor Microsemi Texas Instruments Renesas UBlox UBlox Micron Micron Xilinx Intersil Intersil STMicroelectronics Maxim NXP Semiconductor Texas Instruments

SOP QFN SOP BGA BGA SOP QFN SOP TSOP SOP DFN DFN

6 100 8 969 84 8 16 5 10 24 4 10

2.00 13.90 5.00 29.10 12.60 3.00 2.60 2.10 3.00 7.90 1.20 2.60

1.20 13.80 3.80 29.10 8.00 3.00 1.80 1.20 3.00 4.40 0.80 1.10

0.90 1.40 1.60 3.00 1.00 0.90 0.60 1.00 1.00 1.00 0.40 0.50

64.1 65.1 66.1 67.1 68.1 69.1 70.1 71.1 72.1 73.1 74.1 75.1

1 1 1 1 1 1 1 1 1 1 1 1

60

10.00

8.00

0.90

153

13.00

11.50

0.90

5.00 16.00 22.00 8.00 3.00 10.00

5.00 16.00 22.00 8.00 1.70 10.00

0.90 1.30 2.30 1.00 1.20 1.00

76.1 77.1 77.2 78.1 79.1 80.1 81.1 82.1 83.1

60 8

10.00 5.90

8.00 5.00

0.90 0.90

4 144 54 144 40 5 24 48

6.50 19.90 22.30 19.90 6.00 3.00 4.00 7.00

3.60 19.80 10.10 19.90 6.00 1.60 4.00 7.00

1.60 1.50 1.00 1.50 0.90 1.00 0.90 1.00

48 8 14 8

7.00 4.50 5.10 5.00

7.00 3.00 3.90 3.80

1.00 0.90 1.40 1.50

BGA

QFN TSOP SOP SOP

6014

Description

Length (mm)

Width (mm)

ISL8012 MT47H64M16HR-25E AIT I4 B00 B5 C5 BB5 141E LX5511 TLM393B R5H30201D G010 UBX-5100 P3JC M5JF1 X9633 53609A01 53698A01 CCB 431 A524Z-S C5181 L08E

4 A DC-DC Converter DDR2 SDRAM Memory - 128 MB EEPROM Memory - 1 KB Single-Chip Bluetooth 3.0 / WiFi 802.11a/b/g 2.4 GHz WiFi Power Amplifier Dual Comparator Microcontroller GPS Front-End GPS Baseband Processor NOR Flash Memory - 512 KB Serial NOR Flash Memory - 4 MB Spartan-6 Automotive FPGA 3 A DC-DC Converter 1 A LDO Regulator Programmable Voltage Reference 250 mA / 1.8 V LDO Regulator Hex Inverting Schmitt Trigger 2-Input Positive-AND Gate

2.00 7.50 1.70 8.10 0.93 0.80 2.50 2.20 4.00 3.30 3.80 7.50 2.00 1.30 1.40 2.30 0.66 0.50

2.00 5.50 1.30 4.00 0.64 0.70 2.40 1.80 3.00 1.60 3.30 7.20 2.00 1.10 1.10 1.10 0.55 0.50

$ 0.300 $ 2.413 $ 0.312 $ 7.809 $ 0.198 $ 0.082 $ 1.027 $ 1.198 $ 4.018 $ 0.379 $ 0.397 $ 31.790 $ 0.294 $ 0.129 $ 0.124 $ 0.164 $ 0.107 $ 0.042

$ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $

0.600 4.827 0.312 7.809 0.198 0.082 1.027 1.198 4.018 0.379 0.397 31.790 0.294 0.257 0.124 0.164 0.107 0.042

Skyworks Inova Semiconductor STMicroelectronics NVIDIA Micron Maxim Intersil Texas Instruments Maxim Texas Instruments Unknown Unknown

AS179 INAP375T CUD73E G-98 MT47H64M16HR-25E AIT T547X-2 ISL78210 L08E PM63Y CBTD3384D E8 ? HSA ?

SPDT GaAs Switch Automotive Pixel Link Transmitter 2 A DC-DC Converter Graphics Processor DDR2 SDRAM Memory - 128 MB Temperature Sensor DC-DC Converter 2-Input Positive-AND Gate 1 A LDO Regulator Bus Switch ESD Protection ? EMI Filter ?

0.40 3.00 2.70 9.60 7.50 2.10 2.00 0.50 1.60 1.90 0.20 0.70

0.30 2.80 1.90 9.10 5.50 1.50 1.20 0.50 1.50 1.50 0.20 0.50

$ 0.303 $ 3.444 $ 0.292 $ 30.753 $ 2.413 $ 0.590 $ 0.191 $ 0.042 $ 0.175 $ 0.277 $ 0.040 $ 0.065

$ $ $ $ $ $ $ $ $ $ $ $

0.303 3.444 0.585 30.753 4.827 0.590 0.191 0.085 0.175 0.277 0.240 0.065

1 2 1 1 1 1 1 1 1

Micron Micron Micron Micrel STMicroelectronics Intel Rohm Texas Instruments Rohm

MT47H128M8CF-25E AIT:H L73A PS8200 KS8041 V710CA 8PTCCB PC505 L125D VZ422

DDR2 SDRAM Memory - 128 MB MLC NAND Flash Memory - 4 GB Memory Controller Ethernet Transceiver I/O Controller Hub 1.30 GHz Atom Processor Clock Generator Single Buffer Power Management

7.50 10.30 4.70 1.60 5.30 12.80 3.20 0.50 5.80

5.40 8.80 1.80 1.40 5.20 7.50 3.10 0.50 5.80

$ 1.189 $ 5.971 $ 1.664 $ 0.763 $ 10.607 $ 38.532 $ 2.328 $ 0.048 $ 6.613

$ $ $ $ $ $ $ $ $

4.758 11.942 1.664 0.763 10.607 38.532 2.328 0.048 6.613

84.1 85.1

1 1

Micron Micron

MT47H128M8CF-25E AIT:H M5JF1

DDR2 SDRAM Memory - 128 MB Serial NOR Flash Memory - 4 MB

7.50 3.80

5.40 3.30

$ $

1.189 0.354

$ $

4.758 0.354

87.1 88.1 89.1 90.1 91.1 92.1 93.1 94.1

1 1 1 1 1 1 1 1

Texas Instruments NXP Semiconductor Micron NXP Semiconductor Silicon Labs Texas Instruments Silicon Labs NXP Semiconductor

UK6 TV123181C T55a tV0073501F Si4750A5 LMV331 Si4720 V0045501.F6

800 mA Adjustable LDO Regulator 2.00 1.20 Terrestrial Digital Radio Processor 3.60 3.60 Automotive SDR SDRAM - 16 MB 5.40 3.20 Car Radio Digital Signal Processor 5.10 5.00 AM/FM Radio Receiver & HD Radio Tuner 2.90 2.70 Comparator 0.40 0.40 FM RDS / RBDS Data Receiver / Alternate Frequency 2.00 Scanner 1.80 Digital Radio Front-End 3.60 3.40

$ $ $ $ $ $ $ $

0.150 8.645 2.058 9.625 1.973 0.043 1.118 3.319

$ $ $ $ $ $ $ $

0.150 8.645 2.058 9.625 1.973 0.043 1.118 3.319

95.1 96.1 97.1 98.1

1 1 1 1

NXP Semiconductor Atmel Infineon Micron

V0045501.F6 AT355 TLF4277 M3JB1

Digital Radio Front-End Serial EEPROM Memory - 8 KB 200 mA LDO Regulator Serial NOR Flash Memory - 1 MB

$ $ $ $

3.319 0.194 0.324 0.175

$ $ $ $

3.319 0.194 0.324 0.175

Brand Name

Part Number

112

3.60 1.60 2.50 3.40

3.40 1.60 2.10 1.50

Each

Total

$273.32

Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 414

Subsystem IC Components Note: The ICs listed below are for reference only. Their costs are integrated into the cost of the individual subsystems. Package Info

Estimated Costs

Die Info

Location Pkg Ref. #

Sirius XM Radio Module: Sirius XM Radio Board

Totals

99 100 101 102 103 104 105

Pkg Qty 1 1 1 1 1 1 1

7

Brand Name STMicroelectronics Spansion STMicroelectronics ISSI Texas Instruments Texas Instruments Texas Instruments

Part Number STA210N3A S29GL032N90BF104 STA280BB IS46LR16320B-6BLA1 SN74LVC1G17 LP3907 LMC7101Q-Q1

Pkg Description Satellite Radio Tuner NOR Flash Memory - 4 MB Baseband Processor DDR SDRAM Memory - 64 MB Single Schmitt-Trigger Buffer Dual DC/DC & Dual Linear Regulators Operational Amplifier

Form

Pin Count

Length (mm)

QFN BGA BGA BGA SOP QFN SOP

68 48 289 60 5 24 5

9.60 8.20 15.00 10.00 1.90 4.00 3.00

Width (mm)

Height (mm)

Die Ref #

Die Qty

9.60 6.20 15.00 8.00 1.20 4.00 1.60

0.90 0.90 1.10 0.60 0.90 0.80 1.00

99.1 100.1 101.1 102.1 103.1 104.1 105.1

1 1 1 1 1 1 1

499

Brand Name STMicroelectronics Spansion STMicroelectronics ISSI Texas Instruments Texas Instruments Texas Instruments

7

Part Number A195AA 98M68B V587B K056MP1F L17D 320C LM7101C

Description

Length (mm)

Satellite Radio Tuner 5.30 NOR Flash Memory - 4 MB 4.60 Baseband Processor 5.70 DDR SDRAM Memory - 64 MB 8.30 Single Schmitt-Trigger Buffer 0.50 Dual DC/DC & Dual Linear Regulators 2.50 Operational Amplifier 1.10

Width (mm) 3.30 3.40 5.10 6.60 0.50 2.50 0.90

Each $ 5.484 $ 1.446 $ 12.024 $ 3.316 $ 0.042 $ 1.230 $ 0.078

Total $ $ $ $ $ $ $

5.484 1.446 12.024 3.316 0.042 1.230 0.078

$23.62

Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 415

Modular Components Estimated Costs

Package Location

Qty

Brand Name

Part Number

Description

Pin Count

Length (mm)

Width (mm)

Each

Total $ $ $ $ $

Main Board, Side 1

1 1 1 1 1

NDK Delta Electronics Unknown NDK Pulse

NX5032GA AUB0412HD 7534/1809131 C NX8045GB HX1188NL

Crystal: Ceramic - 28.636 NDK Fan: Large - Heat Sink Shielding: Large - Main Connector Crystal: Ceramic - 24.000 NDK Transformer: Transformer - LAN

2 3 4 2 16

5.00 40.00 51.30 8.00 12.70

3.20 40.00 41.00 4.50 6.80

$ $ $ $ $

Main Board, Side 2

1 1

NDK TDK-EPC

NX8045GB B82789C513N2

Crystal: Ceramic - 16.934 NDK Transformer: CAN

2 4

8.00 5.00

4.50 3.70

$ 0.200 $ 0.200 $ 0.500 $ 0.500

Radio Board, Side 1

1 1 1

Unknown NDK NDK

Unknown Unknown Unknown

Shielding: Large - Digital Radio FE Crystal: Ceramic - 36.400 NDK Crystal: Ceramic - 41.600 NDK

1 4 4

43.00 3.20 3.20

42.30 2.50 2.50

$ 0.040 $ 0.040 $ 0.200 $ 0.200 $ 0.200 $ 0.200

Radio Board, Side 2

1 2 1

NDK Unknown Unknown

Unknown Unknown Unknown

Crystal: Ceramic - 28.224 NDK Shielding / Bracket - Antenna Connectors Shielding: Large - Digital Radio FE

2 1 1

7.90 25.00 43.00

4.50 11.50 42.30

$ 0.200 $ 0.200 $ 0.020 $ 0.040 $ 0.040 $ 0.040

Mother Board, Side 1

1 1 1 1 1 1

Unknown NDK NDK NDK Unknown Murata

A3ZPL Unknown Unknown Unknown 26000 K343YS XNCHH

Crystal: Ceramic - A3ZPL Crystal: Ceramic - T10.000 NDK Crystal: Ceramic - 27.000 NDK Crystal: Ceramic - 26.000 NDK Crystal: Ceramic - 26000 Oscillator: TCXO

2 4 4 4 4 6

3.20 5.00 3.20 3.20 3.20 2.50

1.50 3.20 2.50 2.50 2.50 2.00

$ $ $ $ $ $

Mother Board, Side 2

1

NDK

Unknown

Crystal: Ceramic - T66.000 NDK

4

5.00

3.20

$ 0.200 $ 0.200

Daughter Board, Side 1

1

NDK

Unknown

Crystal: Ceramic - 25.000 NDK

4

2.50

2.00

$ 0.200 $ 0.200

Daughter Board, Side 2

2

Unknown

4L00

Crystal: Metal

2

6.40

3.00

$ 0.170 $ 0.340

TOTALS

Copyright © 2015, TechInsights

7 June 2017

24

83

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

0.200 2.530 0.040 0.200 2.000

0.200 0.200 0.200 0.200 0.200 0.620

$ $ $ $ $ $

0.200 2.530 0.040 0.200 2.000

0.200 0.200 0.200 0.200 0.200 0.620

$8.75

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 416

Active Discrete Components Package Location

Qty

Form

Main Board, Side 1

2 7 2 4 1 7 7 1 1 5 1

Small Active Small Active Small Active Small Active Small Active Small Active Small Active Small Active Small Active Small Active Small Active

MOSFET - Si4453 Transistor, Small - 3N WUs MOSFET - SQJ848 Diode, SMT Diode, SMT - Y Transistor, Small Transistor, Small Transistor, Small - TE Transistor, Small - 3S WNs Transistor, Small - Dt3 MOSFET - uPA1816

Main Board, Side 2

5 2 8 1 4 15 3 6 1 1 1 2 2

Small Active Small Active Small Active Small Active Small Active Small Active Small Active Small Active Small Active Small Active Small Active Small Active Small Active

Transistor, Small - Dt3 Diode, SMT MOSFET - SQJ848 MOSFET - SQ4401EY Transistor, Small Transistor, Small Diode, SMT Diode, SMT Transistor, Large Transistor, Small - BC847BS Transistor, Large - FZT651 Transistor, Small - 3N WUs Transistor, Small - TF

Radio Board, Side 1

1

Small Active

MOSFET - PHK04P02T

Radio Board, Side 2

1

Small Active

Transistor, Small

Power Board, Side 1

4 1

Small Active Small Active

Diode, SMT - MELF TVS Diode, SMT - SM6A27

Mother Board, Side 1

1 2 2 8 1

Small Active Small Active Small Active Small Active Small Active

MOSFET - Si4453 Diode, SMT - SSC54 Transistor, Small - TE, TF Transistor, Small Diode, SMT - MELF

Mother Board, Side 2

2 1 7 1 2 2 2 2 5

Small Active Small Active Small Active Small Active Small Active Small Active Small Active Small Active Small Active

MOSFET - SQ4840 MOSFET - uPA1816 Transistor, Small Transistor, Small Diode, SMT - SSC54 Transistor, Small - Ht9 Transistor, Small - 3Ft Transistor, Small - Dt3 Transistor, Small

Daughter Board, Side 1

1 3

Small Active Small Active

MOSFET - uPA1760 Diode, SMT

Daughter Board, Side 2

1 2 1 2 1 2 1

Small Active Small Active Small Active Small Active Small Active Small Active Small Active

Transistor, Small - BC847BS Diode, SMT Transistor, Small Transistor, Small Transistor, Small - TE LED, Single MOSFET - uPA1760

TOTALS

Copyright © 2015, TechInsights

7 June 2017

Estimated Costs

Functional Description Top Marking

Pin Count

Length (mm)

Width (mm)

4453 AB W43B 3N WUs QJ848 CK W42M S6 Y 1GW 3d, A COKS, 1 KS 42, 5CW 41 38 WNS, 39 A4S, t08, t06 TE 3S WNs Dt3 A1816 412

8 6 4 2 2 3 3 6 6 6 8

4.90 2.10 4.80 1.67 1.60 2.90 2.00 2.90 2.10 2.10 4.40

3.90 1.20 4.30 1.37 1.10 1.30 1.20 1.50 1.20 1.20 3.00

$0.500 $0.030 $0.360 $0.015 $0.015 $0.030 $0.030 $0.030 $0.030 $0.030 $0.260

$1.000 $0.209 $0.720 $0.060 $0.015 $0.209 $0.209 $0.030 $0.030 $0.150 $0.260

Dt3 EO S4 QJ848 BF W41M Q4401E AT W43B t06, 1Gt, t30, 39 A4 s 8P T, 1GW 3d, A7W 3d, t16 3d, 21 Z12 V3, tAN 3o BK W39, HU AN S6, 44, L2 AM W41 1Ft FZT 651 3N WUs TF

6 2 4 8 3 3 2 2 4 6 4 6 6

2.10 2.80 4.80 4.90 2.00 2.90 2.50 1.67 4.40 2.10 6.50 2.10 2.90

1.20 1.80 4.30 3.90 1.20 1.30 1.50 1.37 2.40 1.20 3.50 1.20 1.50

$0.030 $0.015 $0.360 $0.500 $0.030 $0.030 $0.015 $0.015 $0.150 $0.030 $0.180 $0.030 $0.030

$0.150 $0.030 $2.880 $0.500 $0.120 $0.449 $0.045 $0.089 $0.150 $0.030 $0.180 $0.060 $0.060

K04P02T NXP 26 06 n1412

8

5.00

4.14

$0.180

$0.180

A7W 3d

3

2.90

1.30

$0.030

$0.030

None SM6A27 1405

2 2

3.34 13.30

1.71 8.40

$0.030 $1.410

$0.120 $1.410

4453 AR W39B S54 44 TE, TF M8W 3d, A7W 3d, 1GW 3d, WOs 36 None

8 2 6 3 2

5.00 6.80 2.90 2.90 3.10

4.00 5.90 1.50 1.30 1.50

$0.500 $0.170 $0.030 $0.030 $0.030

$0.500 $0.340 $0.060 $0.239 $0.030

Q4840 AJ W39B A1816 351 t30, t06, 13t TF S54 44 Ht9 3Ft Dt3 1GW 3d, M8W 3d

8 8 3 6 2 6 6 6 3

5.00 4.40 2.10 2.90 6.80 2.10 2.10 2.10 2.90

3.80 3.00 1.20 1.50 5.90 1.20 1.20 1.20 1.30

$0.090 $0.090 $0.030 $0.030 $0.170 $0.030 $0.030 $0.030 $0.030

$0.180 $0.090 $0.209 $0.030 $0.340 $0.060 $0.060 $0.060 $0.150

A1760 344 S6

8 2

5.00 1.67

4.30 1.37

$0.090 $0.015

$0.090 $0.045

1Ft S6 XMs 3N 3N SWs, t30 TE None A1760 344

6 2 3 3 6 2 8

2.10 1.67 2.90 2.10 2.90 1.20 5.00

1.20 1.37 1.30 1.20 1.50 0.80 4.30

$0.090 $0.015 $0.030 $0.030 $0.030 $0.050 $0.090

$0.090 $0.030 $0.030 $0.060 $0.030 $0.100 $0.090

148

583

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

Each

Total

$12.28

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 417

Passive Discrete Components Package Location

Qty

Form

Each

Total

Main Board, Side 1

Capacitor Capacitor Capacitor Coil Coil Coil Coil Coil Coil Capacitor Small Passive

Poly Small SM Electrolytic, Medium - 47uF Electrolytic, Large - 470uF SMT, Large - 2R0ML M3N2 SMT, Small - M3D2 SMT, Large - 200uH SMT, Large - Shielded SMT, Small - Shielded SMT, Small - 1uH Tantalum / Niobium, Large Cap, Res, Ferrite

2 2 2 3 2 4 2 2 2 2 2

$0.070 $0.040 $0.130 $0.580 $0.290 $0.900 $0.400 $0.360 $0.250 $0.150 $0.004

$0.070 $0.240 $1.040 $0.580 $0.580 $0.900 $0.800 $0.360 $0.250 $0.300 $1.960

Main Board, Side 2

1 459 4

Coil Small Passive Coil

SMT, Small Cap, Res, Ferrite SMT, Small

2 2 2

$0.050 $0.004 $0.250

$0.050 $1.836 $1.000

Radio Board, Side 1

159 1 6 3 1

Small Passive Capacitor Small Passive Coil Small Passive

Cap, Res, Ferrite Electrolytic, Medium - 47uF Coil, Inductor SMT, Small Ferrite Array

2 2 2 2 8

$0.004 $0.040 $0.008 $0.050 $0.007

$0.636 $0.040 $0.048 $0.150 $0.007

Radio Board, Side 2

9 204 1 4

Coil Small Passive Small Passive Small Passive

SMT, Small Cap, Res, Ferrite Ferrite Array Coil, Inductor

2 2 8 2

$0.250 $0.004 $0.007 $0.008

$2.250 $0.816 $0.007 $0.032

Power Board, Side 1

39 3 2 2

Small Passive Capacitor Coil Small Passive

Cap, Res, Ferrite Electrolytic, Large - 470uF SMT, Large - 200uH Resistor - 1R1

2 2 4 2

$0.004 $0.130 $0.900 $0.004

$0.156 $0.390 $1.800 $0.008

Mother Board, Side 1

3 2 8 6 1 3 510

Coil Filter Small Passive Coil Coil Capacitor Small Passive

SMT, Large - 1.5uH Ceramic, Small Coil, Inductor SMT, Small SMT, Small - M3D2 Electrolytic, Medium Cap, Res, Ferrite

2 6 2 2 2 2 2

$0.400 $0.065 $0.008 $0.250 $0.290 $0.040 $0.004

$1.200 $0.130 $0.064 $1.500 $0.290 $0.120 $2.040

Mother Board, Side 2

3 3 2 1 395

Capacitor Coil Small Passive Filter Small Passive

Tantalum / Niobium, Small SMT, Small Coil, Inductor Ceramic, Small Cap, Res, Ferrite

2 2 2 2 2

$0.050 $0.250 $0.008 $0.065 $0.004

$0.150 $0.750 $0.016 $0.065 $1.580

Daughter Board, Side 1

318 2

Small Passive Coil

Cap, Res, Ferrite SMT, Small - 1R2 YL

2 2

$0.004 $0.250

$1.272 $0.500

Daughter Board, Side 2

382 2 6

Small Passive Capacitor Coil

Cap, Res, Ferrite Tantalum / Niobium, Small SMT, Small

2 2 2

$0.004 $0.050 $0.250

$1.528 $0.100 $1.500

1

Small Passive

Resistor

2

$0.004

Interconnect Board, Side 1

7 June 2017

Pin Count

1 6 8 1 2 1 2 1 1 2 490

TOTALS

Copyright © 2015, TechInsights

Estimated Costs

Functional Description

3061

Copyright © Munro & Associates, Inc. 2015

6149

www.LeanDesign.com

$0.004

$29.12

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 418

Connectors Estimated Costs

Package Location

Qty

Form

Pin Count

Length (mm)

Width (mm)

Each

Total

Interconnect Board, Side 1

1 2 1

Bd to Bd: Female - Hard Drive Connector: Threaded Insert, Gnd Bd to Bd: Male - Mother Brd

29 1 60

45.70 13.20 31.50

5.50 13.20 6.20

$1.530 $0.020 $1.730

$1.530 $0.040 $1.730

Main Board, Side 1

1

Bd to Bd: Male - Heat Sink Fan

3

9.90

5.00

$0.060

$0.060

Main Board, Side 2

1 1

Bd to Bd: Male - Mother Board16 Bd to Bd: Female - Mother Board120

16 120

23.80 35.00

9.80 7.50

$1.190 $2.100

$1.190 $2.100

Mother Board, Side 1

1 2 1 1 1 3 3

Connector: Accessory - APIX Connector: Gnd Pin / Standoff Bd to Bd: Male - Main120 Bd to Bd: Female - Main16 Bd to Bd: Male - Interconnect Connector: USB - USB1 - 3 Connector: Antenna Coax - BT, WLAN, GPS

6 1 120 16 60 4 1

27.40 12.50 35.00 23.80 33.10 32.90 24.00

14.10 8.10 7.50 9.80 7.80 11.00 9.50

$1.240 $0.140 $2.100 $1.190 $1.730 $1.140 $1.140

$1.240 $0.280 $2.100 $1.190 $1.730 $3.420 $3.420

Mother Board, Side 2

1

Connector: Edge - Daughter Brd

230

75.80

10.70

$4.890

$4.890

Power Board, Side 1

1 1 1

Connector: Vehicle Wiring Harness Bd to Bd: Male - Header, Main32 Bd to Bd: Male - Header, Main40

40 32 40

49.70 32.20 38.50

43.00 4.20 4.20

$2.450 $0.460 $0.910

$2.450 $0.460 $0.910

Radio Board, Side 2

1 1 3

Bd to Bd: Male - Header, Main36 Bd to Bd: Male - Header, Main32 Connector: Antenna Coax - AM/FM1, FM2, Sat Radio

36 32 1

36.00 32.30 27.00

4.60 4.60 8.90

$0.460 $0.460 $1.140

$0.460 $0.460 $3.420

TOTALS

Copyright © 2015, TechInsights

7 June 2017

28

862

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

$33.08

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 419

Electronic Assembly Metrics

Assembly Weight (grams)

5289.4

40.9

Avg. Pin Count

46

39.5 19.3 21.6 31.6 9.8 20.3

Connection Density (Connections/sq.cm)

784.6

Routing Density (cm of routing per sq.cm of substrate)

696.8 164.4 1338.0 1752.0 488.4 642.6 5082.2 207.2 207.2

Component Density (Components/sq.cm)

System Totals

8 4 6 8 6 6 38 8 8

Number of Connections

Sirius XM Radio Module: Sirius XM Radio Board

87.1 41.1 223.0 219.0 81.4 107.1 758.7 25.9 25.9

Number of Components

Daughter Board Interconnect Board Main Board Mother Board Power Board Radio Board

Circuit Area (sq.cm)

Main Electronics Main Electronics Main Electronics Main Electronics Main Electronics Main Electronics Main Electronics Totals Subsystem Electronics Subsystem Electronics Totals

Assembly Name

Metal Layers

General Area

Substrate Area (sq.cm)

Electronic Assembly Metrics by Assembly

743 5 1119 1036 54 414 3371 279 279

3346 93 3592 5017 218 1425 13691 1158 1158

8.5 0.1 5.0 4.7 0.7 3.9 4.4 10.8 10.8

38.4 2.3 16.1 22.9 2.7 13.3 18.0 44.7 44.7

4.5 18.6 3.2 4.8 4.0 3.4 4.1 4.2 4.2

43.00 19.80 262.60 173.10 115.80 152.10 766.40 41.50 41.50

3650

14849

4.7

18.9

4.1

807.90

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 420

Electronic Assembly Metrics

Daughter Board Interconnect Board Main Board Mother Board Power Board Radio Board Hard Drive Sirius XM Radio Module System Totals

Card Test

Insertion

Substrates

Connector Components

Passive Components

Assembly Name

Total

Main Electronics Main Electronics Main Electronics Main Electronics Main Electronics Main Electronics Main Electronics Totals Subsystem Electronics Subsystem Electronics Subsystem Electronics Totals

Modular & Odd Form Components

Integrated Circuits

General Area

Small Active Components

Electronics Costs by Assembly

$ $ $ $ $ $ $ $ $ $

99.45 4.50 102.68 138.75 10.74 45.77 401.89 33.49 33.49

$ $ $ $ $ $ $ $ $ $

82.37 64.85 95.16 30.94 273.32 23.62 23.62

$ $ $ $ $ $ $ $ $ $

0.54 5.67 1.82 0.72 8.75 5.43 5.43

$ $ $ $ $ $ $ $ $ $

0.56 7.63 2.35 1.53 0.21 12.28 0.21 0.21

$ $ $ $ $ $ $ $ $ $

4.90 0.00 9.97 7.90 2.35 3.99 29.12 1.26 1.26

$ $ $ $ $ $ $ $ $ $

3.30 3.35 18.27 3.82 4.34 33.08 0.19 0.19

$ $ $ $ $ $ $ $ $ $

5.21 0.76 3.57 5.15 1.82 2.21 18.72 0.95 0.95

$ $ $ $ $ $ $ $ $ $

3.89 0.05 5.86 5.54 0.31 2.25 17.89 1.49 1.49

$ $ $ $ $ $ $ $ $ $

1.98 0.38 1.79 2.57 0.91 1.11 8.74 0.35 0.35

$

435.39

$

296.93

$

14.18

$

12.49

$

30.38

$

33.26

$

19.67

$

19.38

$

9.09

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 421

Electronic Assembly Metrics Small Active Component Connections

Passive Components

Passive Component Connections

Connectors

Connector Connections

Subsystem IOs

Opportunities

System Totals

Small Active Components

Hard Drive Sirius XM Radio Module

Modular/Odd Form Component Connections

Daughter Board Interconnect Board Main Board Mother Board Power Board Radio Board

Modular/Odd Form Components

Main Electronics Main Electronics Main Electronics Main Electronics Main Electronics Main Electronics Main Electronics Totals Subsystem Electronics Subsystem Electronics Subsystem Electronics Totals

Assembly Name

IC Connections

General Area

IC Package Count

Counts by Assembly

16 0 41 41 0 12 110 0 7 7

1867 0 1104 2502 0 541 6014 0 499 499

3 0 7 7 0 7 24 0 6 6

8 0 33 28 0 14 83 0 52 52

14 0 89 38 5 2 148 0 12 12

51 0 355 156 10 11 583 0 26 26

710 1 979 937 46 388 3061 0 253 253

1420 2 1961 1882 96 788 6149 0 548 548

0 4 3 13 3 5 28 0 1 1

0 91 139 449 112 71 862 0 33 33

0 0 0 0 0 0 0 26 33 59

4089 98 4711 6053 272 1839 17062 26 1470 1496

117

6513

30

135

160

609

3314

6697

29

895

59

18558

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 422

Electronic Assembly Metrics

Sirius XM Radio Module System Totals

119

117

6513

1627.5

Non-Volatile Memory (KBytes)

695.9 267.9 432.1 107.1 1503.0 124.5 124.5

Volatile Memory (KBytes)

1867 1104 2502 541 6014 499 499

Package Connections per sq.cm of Package Area

16 41 41 12 110 7 7

Die Area/Package Area Ratio

Daughter Board Main Board Mother Board Radio Board

Package Area (sq.mm)

Die Area (sq.mm)

18 41 41 12 112 7 7

Assembly Name

1753.1 2173.8 2512.0 1245.9 7684.7 471.1 471.1

0.40 0.12 0.17 0.09 0.20 0.26 0.26

106.5 50.8 99.6 43.4 78.3 1.1 105.9

1048576 65536 524288 16384 1654784 65536 65536

8392704 65536 4609 1032 8463881 4096 4096

8155.8

0.20

79.9

1720320

8467977

Substrate Tiling Density (die area / substrate area)

Number of Package Connections

Main Electronics Main Electronics Main Electronics Main Electronics Main Electronics Totals Subsystems Subsystem Electronics Totals

IC Package Count

General Area

IC Die Count

IC Metrics

0.08 0.01 0.02 0.01

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 423

Electronic Costs Breakdown Estimated Cost of Electronics

(Includes XM Radio Subsystem Electronics, but not Hard Drive)

$435.39

Substrates 5%

Insertion 4%

Card Test 2%

Connector Components 8% Passive Components 7%

Small Active Components 3% Integrated Circuits 68% Modular & Odd Components 3%

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 424

Vendor IC Cost Distribution Pkg. Brand Micron Intel STMicroelectronics Texas Instruments Xilinx NVIDIA

* Includes Subsystem Vendors & Associated Costs

Cost $40.25 $38.53 $35.59 $32.11 $31.79 $30.75

Other NXP Semiconductor Rohm Marvell Semiconductor Atmel UBlox Spansion Inova Semiconductor AKM Semiconductor ISSI Silicon Labs Analog Devices

$26.73 $8.94 $7.81 $5.69 $5.22 $4.72 $3.44 $3.36 $3.32 $3.09 $3.07

Intel 13% Micron 14%

Other 29%

NVIDIA 10%

STMicro 12% Xilinx 11%

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

Texas Instruments 11%

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 425

Non-Electronic Cost Estimate Subsystem

Part ID No.

Qty

Heat Sink

15 16 17 18 19

1 1 1 1 1

Housing, Heat Sink / Fan Enclosure, Fan Heat Sink Clip, Heat Sink Compound, Heat Sink

Molded Molded Extruded + Cut Stamped + Formed

PA 66 = Polyamide Rubber Aluminum Steel

116.3 x 103.2 44.8 x 42.7 44.7 x 43 21.7 x 15

Housing

1 2 3 4 6 7 8 9 10 11 12 13 14

1 1 1 1 1 1 1 1 1 1 1 1 1

Housing, Main Housing, Lower Housing, Cover Bracket, Hard Drive Bracket, Main Connector Bracket, Antenna Connectors Bracket, Power Board Bracket, Sirus / XM Module Bracket, Fiber Optic Cable Guide, Fiber Optic Cable Retainer, Fiber Optic Cable Retainer, FB Cable @ Main Connector Guide, FB Cable

Cast + Machined + Tapped Cast + Tapped Cast Stamped + Formed Stamped + Formed Stamped + Formed Stamped + Formed + Tapped Stamped + Formed Stamped + Formed Molded Stamped + Formed Stamped + Formed Molded

AZ91D = Magnesium Alloy AZ91D = Magnesium Alloy AZ91D = Magnesium Alloy Steel Steel Steel Steel Steel Steel Plastic Steel Steel Rubber

229 x 157 x 98 180 x 143 x 33 153.7 x 142.7 x 27.8 101.4 x 94.9 x 16.8 96.6 x 75.6 x 12.5 96.6 x 30.7 x 8.3 109.9 x 82 x 21.4 74.1 x 43.8 x 27.1 25 x 6.2 x 9.3 23.3 x 9 x 8.4 22.9 x 11.1 x 8 16.6 x 11 x 3.6 12 x 10.8 x 9.2

Misc

20 21 22 23 24 25 26 27 28 29 30 31

12 2 1 2 1 4 44 1 1 2 10 1

Thermal Pads Slide Strain Relief Fiber Optic Cables Seal RTV Screws Tape, Kapton Label, Main Label, Large Label, Small Tape, White

Die-Cut Molded Molded Extruded + Coated Dispensed Dispensed Extruded + Threaded Die-Cut Die-Cut + Printed Die-Cut + Printed Die-Cut + Printed Die-Cut

Silicon Plastic POM Glass Conductive Foam Silicon Steel Polyimide + Adhesive Paper + Adhesive Plastic + Adhesive Plastic + Adhesive Plastic + Adhesive

Total

Fabrication Process

Material

Dimensions (mm) x x x x

35.9 22.1 25.1 10.4 x

x 24.7 x 11.3 x 5.9 33.8 x 30 x 18.1 185 x 3.8 x 1.5 x x x 23 x 13.2 x 0.05 130 x 110 x 0.07 50.1 x 20.4 x 0.05 x 52 x 10.3 x 0.07

Weight Est'd Cost Est'd (grams) Each Extended Cost 19.40 5.60 58.20 2.20 1.00 397.20 205.90 102.90 60.40 21.90 6.60 70.40 27.50 1.40 0.50 0.70 0.30 0.40 0.00 1.40 3.30 1.40 1.50 4.00 0.00 0.01 1.10 0.20 0.00 0.01

1.440 0.170 2.070 0.090 0.030

1.440 0.170 2.070 0.090 0.030

28.090 10.850 6.030 1.740 0.920 0.290 2.070 1.080 0.060 0.020 0.040 0.030 0.020

28.090 10.850 6.030 1.740 0.920 0.290 2.070 1.080 0.060 0.020 0.040 0.030 0.020

0.040 0.020 0.120 0.240 0.080 0.010 0.010 0.020 0.260 0.050 0.020 0.010

0.480 0.040 0.120 0.480 0.080 0.040 0.440 0.020 0.260 0.100 0.200 0.010

Estimated Cost

99

Copyright © 2015, TechInsights

7 June 2017

Description

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

$57.31

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 426

Final Ass’y Labor & Test Cost Estimate

Final Assembly & Test Made in Number of parts Est'd number of steps Est'd time (seconds)

Est'd final assembly cost Est'd final test cost

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

Germany 114 422 1645 $ $

21.02 1.25

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 427

Cost Summary Estimated Cost Totals Main Electronic Assemblies Hard Drive & Sirius XM subsystems Non-Electronic Parts Final Assembly & Test

Total

$ $ $ $

401.89 77.17 57.31 22.27

Cost Total Notes: Estimated final assembly cost includes labor only. Total cost does not include Non-recurring, R&D, G&A, IP licensing fees/royalties, software, sales & marketing, distribution. Assumes fully scaled production.

$ 558.65 Non-Electronic Parts 10%

Final Assembly & Test 4%

Hard Drive & Sirius XM Subsystems 14%

Main Electronic Assemblies 72%

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 428

Cost Estimation Process (Overview & Discussion) Cost modeling is tricky business. Multiple variables affect the actual production costs a manufacturer will experience, including development expenses, unit volumes, supply-and-demand in component markets, die yield-curve maturity, OEM purchasing power, and even variations in accounting practices. Different cost modeling methods employ different assumptions about how to handle these and other variables, but we can identify two basic approaches: that which seeks to track short-term variations in the inputs to the production process, and that which strives to maintain comparability of the output of the model across product families and over time. TechInsights’ philosophy in cost modeling is to emphasize consistency across products and comparability over time, rather than to track short-term fluctuations. During the past eight years, we have developed an estimation process that, while necessarily lacking an insider’s knowledge of the cost factors that impact any one manufacturer, is reasonably accurate in its prediction of unit costs in high-volume production environments. We do not claim that the model will produce the “right” answer for your firm’s environment. However, TechInsights does give customers a key analytical tool with a complete set of data in our Bill of Materials (BOM). The BOM allows readers to 1) scrutinize the assumptions behind our cost model and 2) modify the results based on substitution of their own component cost estimates where they have better information based on inside knowledge. Our estimation process decomposes overall system cost into three major categories: Electronics, Mechanical, and Final Assembly. We begin by creating a complete electronics bill-of-materials (BOM). Each component from the largest ASIC to the smallest discrete resistor is entered into a BOM table with identifying attributes such as size, pitch, I/O count, package type, manufacturer, part number, estimated placement cost, and die size (if the component is an IC). Integrated circuit costs are calculated from measured die area. Using assumptions for wafer size, process type, number of die per wafer, defect density, and profit margin in combination with die area, an estimate of semiconductor cost is derived. Costs for discrete components and interconnect are derived from assumption tables which relate BOM line items to specific cost estimates by component type and estimates for part placement costs are included. For LCD display costs, we employ a model which tabulates expected cost from measurements of glass area, LCD type, and total pixel resolution. When market costs are available from alternative sources, LCD panel costs are taken from and referenced to these sources. Costs of non-electronic components such as molded plastic enclosures and metallic components are measured in terms of weight, size, thickness, type of material, and complexity to arrive at their estimated cost. Other system items such as optics, antennae, batteries and displays are costed from a set of assumption tables derived from a combination of industry data, average high volume costs, and external sources. For final assembly, we re-build the torn-down product, tabulating stepwise assembly times as the reconstruction proceeds, to reach a total assembly time. Using a labor rate assumption for the country of origin, we then calculate final assembly cost. The three major categories for system cost contributors can be broken down into the subcategories of ICs, other electronics parts, displays, batteries (as appropriate), camera modules, electronics assembly, non-electronic elements, and final assembly. By adding the cost estimates for each of these subcategories, an overall estimated cost is derived for the system under evaluation. Product packaging and accessories (CDs, cables, etc.) are also documented and estimated for their contribution to total cost as appropriate. We believe our cost estimates generally fall within 15 percent of the “right answer,” which itself can vary depending on the market and OEM-specific factors mentioned earlier. While the TechInsights cost model is imperfect, it yields important insights into technology and business dynamics along with good first-order contributions to system cost by component type. Additionally, the consistency of approach and gradual modification to assumptions (smoothing out frequently-shifting pricing factors) hopefully yields a credible, but user-modifiable, view of OEM high volume cost-to-produce. Please feel free to contact us at [email protected] with any comments, questions, or proposed corrections with respect to our cost estimates. We welcome your input. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 429

Metrics (Overview & Discussion) In our product teardowns, we gather a series of metrics for product profiling and comparison. Some metrics focus on system characteristics such as total silicon area, total system semiconductor storage capacity, and total connection count. Other metrics reflect more subtle aspects of electronics assembly such as connection density, average component I/O count, and silicon tiling density. Taken as a whole, the metrics allow deeper comparison and benchmarking across multiple disciplines and multiple products. Key metrics we gather on products are described below along with their definitions and what they tend to say about the system under study. Most metrics can be used both in comparing similar products for benchmarking purposes or for quantifying differences in levels of complexity between dissimilar product types. Data fall into two categories; either “raw” measured data or ratios of these measured data sets. Total Silicon Area : This metric describes the total area of silicon as measured from X-ray or direct measurement of ICs. The area is an expression of the enclosed bare die area and excludes packaging area. The aggregate silicon area is a good benchmark to show how integrated a design might be when making comparisons to similar systems. Total silicon area also reflects the major cost driver for most systems we examine. Silicon Tiling Density : Ratio of Total Silicon Area to total printed circuit board “projected” area (i.e. the simple board area and not the cumulative surface area of both sides of the board). This metric directly reflects the level of efficiency and aggressiveness in integrated circuit packing and placement. Single digit Silicon Tiling Density is typical but silicon coverage of 10% - 20% has been seen in some of the most advanced products we have examined. Higher Tiling Densities often correspond with the use of chip scale packaging (CSPs) or other small form-factor IC packaging technologies. High density circuit boards are also often a supporting technology. Number of Parts : Total component count including ICs, passives, modules, connectors, etc., each separated out in our reporting. Number of Connections : The total number of connections corresponds to the total number of interconnects introduced by the aggregate component set and reflects any electrical connection observed (solder joints, adhesive interconnect, or connector terminal interfaces). Opportunity Count : Opportunity Count is the total number of parts plus the total number of connections; the name reflects that each of these constituent elements represents an opportunity for failure. A high opportunity count means more complex and riskier electronics assembly. Average Pin Count (APC) : Ratio of total number of component terminals to total number of parts, at the system level. This metric reflects the ‘average’ terminal complexity of the components and often provide a signature of integration level and/or “digital-ness” of the overall product. Low APCs reflect a high number of discretes or other low-pincount devices often characteristic of analog circuitry. Conversely, high APCs are characteristic of highly integrated, high-pincount assemblies, often those composed largely of digital integrated circuits. Connection Density : This metric is a ratio of the total Number of Connections to total printed circuit board assembly area, in units of connections per sq. inch. The metric provides data related to the Silicon Tiling Density above, but with an emphasis on complexity of I/O interconnect. For example, with a fixed Connection Density, high tiling density of low-pincount memory chips is more readily achieved than comparable silicon tiling of high pincount logic. Part Density : This metric is a ratio of the total Number of Parts to total printed circuit board assembly area, in units of components per sq. inch. The metric provides data related to the Silicon Tiling Density and Connection Density as described above, but with an emphasis on density and complexity of component packing efficiency. For example, low Part Density of high-pincount devices can pose an equal challenge in Connection Density to high Part Density of low-pincount devices. High Part Density does reflect challenges in surface mount assembly in terms of (typically) precision of placement, number of placements, and engineering of part clearances. Routing Density (heuristic estimate) = 3*(Average Pin Count)*√Part Density. The Routing Density metric is an empirically derived relationship that characterizes the wiring density of the interconnect used to support the interconnection of components in a planar electronic assembly (i.e. the circuit board). Architectural issues such as bussing or other factors affecting the regularity of wiring impact the actual Routing Density needed to support a given application, but the metric provides a ready measure of wiring complexity. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 430

Appendix

Click Here to Return to Cost Analysis Page 53

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

431

Deep Dive Report BMW i3 Optional Equipment Board 5567

Report #15900-141205-SBb

Product Description This Optional Equipment Board is used to take input from sensors on the 2014 BMW i3 for the appropriate processing. Key ICs include an STMicroelectronics #SPC56EL70L5 32-bit auto architecture microcontroller, (2) Infineon #BTS5180 Dual-channel smart high-side power switches, and two transceivers. It is possible, but unconfirmed, that this board processes data from the Steering Angle Sensor or Ride Height Sensors.

DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information. Copyright © 2015, TechInsights. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of TechInsights.

www.teardown.com [email protected]

Product Overview Product Description

Integrated Circuit Metrics

Product Type

Custom

IC Die Count

7

Brand

BMW

IC Package Count

7

Product Name & Model # i3 Optional Equipment Board Official Release Date

5/2/2014

Weight (grams) Product Dimensions (mm)

55.4 (Measured) 122.06 x 91.43 x 17.7 mm (Measured at Longest/Widest/Thickest Points)

Product Features Processor

STMicroelectronics #SPC56EL70L5 32-Bit Auto Architecture Microcontroller

Communications

Infineon #TLE6250GV33 CAN & NXP #TJA1082 FlexRay Transceivers

Power

Infineon #TLE8760 Power Management IC

Cost Metrics Retail Price Total Manufacturing Cost

$31.89

Electronics Cost

$31.89

Manufacturing Cost Breakdown Integrated Circuits

$16.47

51.6%

Modules, Discretes & Connectors

$11.72

36.8%

Substrates

$1.46

4.6%

Component Insertion

$1.51

4.7%

Card Test

$0.73

2.3%

Total $31.89 100.0%

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Optional Equipment Board #15900-141205-SBb – Page 433

Block Diagram

2 - STMicroelectronics #SPC56EL70L5 32-Bit Auto Architecture Microcontroller 1 - ON Semiconductor #LM2901VDG Quad Comparator

3 - Infineon #TLE6250GV33 CAN Transceiver

4 - NXP Semiconductor #TJA1082 FlexRay Transceiver

5 - Infineon #TLE8760 Power Management

Connector

6 - Infineon #BTS5180 6 - Infineon Dual-Channel #BTS5180 High-Side Power Switch Dual-Channel High-Side Power Switch

Estimated block diagram based on observation of this specific product implementation, manufacturer’s data sheets where available, and best engineering judgment. Certain details of the interface circuitry are not reflected in this block diagram. Partitioning and connectivity are speculative.

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Optional Equipment Board #15900-141205-SBb – Page 434

Exterior Features

Front Side of Board Connector

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Optional Equipment Board #15900-141205-SBb – Page 435

Exterior Features

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Optional Equipment Board #15900-141205-SBb – Page 436

Main Board (Side 1 IC Identification)

1 - ON Semiconductor #LM2901VDG Quad Comparator

2 - STMicroelectronics #SPC56EL70L5 32-Bit Auto Architecture Microcontroller

5 - Infineon #TLE8760 Power Management 3 - Infineon #TLE6250GV33 CAN Transceiver

4 - NXP Semiconductor #TJA1082 FlexRay Transceiver

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Optional Equipment Board #15900-141205-SBb – Page 437

Main Board (Side 2 IC Identification)

6 - Infineon #BTS5180 Dual-Channel High-Side Power Switch

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Optional Equipment Board #15900-141205-SBb – Page 438

Main Board Cross-Section

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Optional Equipment Board #15900-141205-SBb – Page 439

Substrate Data Substrates Assembly Name Main Board

Manufacturer

Unknown

Core Material

FR4

Copyright © 2015, TechInsights

7 June 2017

Mfg. Technology

4 Layer Conventional FR4 / HF

Area (cm²)

Layers

4

93.9

Min. Trace Pitch (mm) 0.48

Min. Trace Width (mm) 0.22

Copyright © Munro & Associates, Inc. 2015

ThruVia Land Dia (mm) 0.62

ThruVia Hole Dia (mm)

BlindVia Land Dia (mm)

0.36

www.LeanDesign.com

BlindVia Hole Dia (mm)

Thickness (mm) 1.5

Routing Density

Estimated Costs

16.2 $

1.46

BMW i3 Optional Equipment Board #15900-141205-SBb – Page 440

Integrated Circuit Components Package Info

Estimated Costs

Die Info

Location Pkg Ref. #

Pkg Qty

Brand Name

Main Board, Side 1

1 2 3 4 5

1 1 1 1 1

ON Semiconductor STMicroelectronics Infineon NXP Semiconductor Infineon

Main Board, Side 2

6

2

Infineon

Totals

7

Part Number

Pkg Description

Form

Pin Count

Length (mm)

Width (mm)

Height (mm)

Die Ref #

Die Qty

SOP QFP SOP TSOP QFP

14 144 8 14 48

8.60 20.00 5.00 5.10 6.50

3.80 20.00 3.50 4.40 6.50

1.30 1.50 1.50 0.95 1.00

1.1 2.1 3.1 4.1 5.1

1 1 1 1 1

ON Semiconductor STMicroelectronics Infineon NXP Semiconductor Infineon

139 (M) FL62X2 S0964 ? CF1401B S1234A25

Quad Comparator 32-Bit Microcontroller CAN Transceiver FlexRay Transceiver Power Management

14

8.65

2.65

1.70

6.1

1

Infineon

L8303B1

Dual-Channel High-Side Power 2.38Switch 1.73

LM2901VDG SPC56EL70L5 TLE6250GV33 TJA1082 TLE8760

Quad Comparator 32-Bit Microcontroller CAN Transceiver FlexRay Transceiver Power Management

BTS5180

Dual-Channel High-Side Power Switch SOP

256

Brand Name

Part Number

7

Description

Length (mm)

Width (mm)

1.29 7.51 2.08 2.54 3.96

1.17 6.53 2.00 1.94 3.66

Each

Total

$ 0.150 $ 0.150 $ 12.320 $ 12.320 $ 0.273 $ 0.273 $ 0.342 $ 0.342 $ 2.786 $ 2.786 $

0.298 $

0.596

$16.47

Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Optional Equipment Board #15900-141205-SBb – Page 441

Modular Components Estimated Costs

Package Location

Main Board, Side 1

TOTALS

Copyright © 2015, TechInsights

7 June 2017

Qty

1

Brand Name

Unknown

Part Number

Unknown

Description

Crystal: Metal

1

Pin Count

Length (mm)

Width (mm)

4

3.00

2.50

4

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

Each

Total

$ 0.170

$ 0.170

$0.17

BMW i3 Optional Equipment Board #15900-141205-SBb – Page 442

Active Discrete Components Package Location

Qty

Estimated Costs

Functional Description Form

Top Marking

Pin Count

Length (mm)

Width (mm)

Each

Total

Main Board, Side 1

3 1 1

Small Active Small Active Small Active

Diode, SMT MOSFET MOSFET

SG 43 (graphic) CD S44 4P03L11 GSB416 (Infineon logo)

3 2 2

4.11 4.00 6.50

2.96 2.50 6.00

$0.060 $0.090 $0.350

$0.180 $0.090 $0.350

Main Board, Side 2

5 1 1 2 1 4 2

Small Active Small Active Small Active Small Active Small Active Small Active Small Active

Transistor, Small Transistor, Small Transistor, Large MOSFET MOSFET Diode, SMT Diode, SMT

R1t 8C F S 1415 16 BCP55 2N06L65 GRJ413 (Infineon logo) BUK9277 55A 1895 PEm1403C1 MS9 44 (graphic) SG 43 (graphic)

6 3 3 8 4 2 2

2.00 2.50 6.00 5.50 6.50 4.50 4.00

1.00 1.50 3.00 5.00 5.50 3.00 2.50

$0.030 $0.030 $0.150 $0.310 $0.350 $0.060 $0.060

$0.150 $0.030 $0.150 $0.620 $0.350 $0.240 $0.120

TOTALS

21

Copyright © 2015, TechInsights

7 June 2017

81

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

$2.28

BMW i3 Optional Equipment Board #15900-141205-SBb – Page 443

Passive Discrete Components Estimated Costs

Package Location

Qty

Functional Description Form

Main Board, Side 1

5 2 1 5 104 2

Main Board, Side 2

143 Small Passive

TOTALS

Copyright © 2015, TechInsights

7 June 2017

Coil Coil Capacitor Capacitor Small Passive Coil

Pin Count

Each

Total

SMT, Small SMT, Large Electrolytic, Medium Electrolytic, Small Cap, Res, Ferrite SMT, CMC

2 2 2 2 2 4

$0.250 $1.350 $0.320 $0.080 $0.004 $0.690

$1.250 $2.700 $0.320 $0.400 $0.416 $1.380

Cap, Res, Ferrite

2

$0.004

$0.572

262

Copyright © Munro & Associates, Inc. 2015

528

www.LeanDesign.com

$7.04

BMW i3 Optional Equipment Board #15900-141205-SBb – Page 444

Connectors Estimated Costs

Package Location

Qty

Main Board, Side 1

TOTALS

Copyright © 2015, TechInsights

7 June 2017

1

1

Form

Connector: Vehicle Wiring

Pin Count

Length (mm)

Width (mm)

Each

Total

26

48.38

15.88

$2.240

$2.240

26

Copyright © Munro & Associates, Inc. 2015

$2.24

www.LeanDesign.com

BMW i3 Optional Equipment Board #15900-141205-SBb – Page 445

Electronic Assembly Metrics

375.76

Assembly Weight (grams)

375.8

4

Avg. Pin Count

4

93.9

Connection Density (Connections/sq.cm)

Circuit Area (sq.cm)

93.9

System Totals

Component Density (Components/sq.cm)

Metal Layers

Main Board

Number of Connections

Substrate Area (sq.cm)

Main Electronics

Assembly Name

Number of Components

General Area

Routing Density (cm of routing per sq.cm of substrate)

Electronic Assembly Metrics by Assembly

16.2

292

895

3.1

9.5

3.1

54.80

292

895

3.1

9.5

3.1

54.80

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Optional Equipment Board #15900-141205-SBb – Page 446

Electronic Assembly Metrics

Card Test

Insertion

Substrates

Connector Components

Passive Components

Assembly Name

Total

Main Electronics

Modular & Odd Form Components

Integrated Circuits

General Area

Small Active Components

Electronics Costs by Assembly

Main Board

$

31.89

$

16.47

$

0.17

$

2.28

$

7.04

$

2.24

$

1.46

$

1.51

$

0.73

System Totals

$

31.89

$

16.47

$

0.17

$

2.28

$

7.04

$

2.24

$

1.46

$

1.51

$

0.73

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Optional Equipment Board #15900-141205-SBb – Page 447

Electronic Assembly Metrics

IC Package Count

IC Connections

Modular/Odd Form Components

Modular/Odd Form Component Connections

Small Active Components

Small Active Component Connections

Passive Components

Passive Component Connections

Connectors

Connector Connections

Opportunities

Counts by Assembly

Main Board

7

256

1

4

21

81

262

528

1

26

1187

System Totals

7

256

1

4

21

81

262

528

1

26

1187

General Area

Main Electronics

Assembly Name

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Optional Equipment Board #15900-141205-SBb – Page 448

Electronic Assembly Metrics

82.4

256

82.4

Non-Volatile Memory (KBytes)

256

7

Volatile Memory (KBytes)

7

7

Package Connections per sq.cm of Package Area

Die Area (sq.mm)

7

System Totals

Die Area/Package Area Ratio

Number of Package Connections

Main Electronics

Assembly Name

Package Area (sq.mm)

IC Package Count

Main Board

General Area

Substrate Tiling Density (die area / substrate area)

IC Die Count

IC Metrics

0.01

560.7

0.15

45.7

0

0

560.7

0.15

45.7

0

0

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Optional Equipment Board #15900-141205-SBb – Page 449

Electronic Costs Breakdown Estimated Cost of Electronics $31.89 Connector Components 7%

Substrates 5%

Insertion 5% Card Test 2%

Passive Components 22%

Integrated Circuits 51% Small Active Components 7%

Modular & Odd Components 1%

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Optional Equipment Board #15900-141205-SBb – Page 450

Vendor IC Cost Distribution Pkg. Brand STMicroelectronics Infineon NXP Semiconductor ON Semiconductor

Cost $12.32 $3.66 $0.34 $0.15

NXP Semi 2%

ON Semi 1%

Infineon 22%

STMicroelectronics 75%

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Optional Equipment Board #15900-141205-SBb – Page 451

Cost Summary Estimated Cost Totals Main Electronic Assemblies

Total

$

31.89

$ 31.89

Cost Total Notes: Estimated final assembly cost includes labor only. Total cost does not include Non-recurring, R&D, G&A, IP licensing fees/royalties, software, sales & marketing, distribution. Assumes fully scaled production.

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Optional Equipment Board #15900-141205-SBb – Page 452

Cost Estimation Process (Overview & Discussion) Cost modeling is tricky business. Multiple variables affect the actual production costs a manufacturer will experience, including development expenses, unit volumes, supply-and-demand in component markets, die yield-curve maturity, OEM purchasing power, and even variations in accounting practices. Different cost modeling methods employ different assumptions about how to handle these and other variables, but we can identify two basic approaches: that which seeks to track short-term variations in the inputs to the production process, and that which strives to maintain comparability of the output of the model across product families and over time. TechInsights’ philosophy in cost modeling is to emphasize consistency across products and comparability over time, rather than to track short-term fluctuations. During the past eight years, we have developed an estimation process that, while necessarily lacking an insider’s knowledge of the cost factors that impact any one manufacturer, is reasonably accurate in its prediction of unit costs in high-volume production environments. We do not claim that the model will produce the “right” answer for your firm’s environment. However, TechInsights does give customers a key analytical tool with a complete set of data in our Bill of Materials (BOM). The BOM allows readers to 1) scrutinize the assumptions behind our cost model and 2) modify the results based on substitution of their own component cost estimates where they have better information based on inside knowledge. Our estimation process decomposes overall system cost into three major categories: Electronics, Mechanical, and Final Assembly. We begin by creating a complete electronics bill-of-materials (BOM). Each component from the largest ASIC to the smallest discrete resistor is entered into a BOM table with identifying attributes such as size, pitch, I/O count, package type, manufacturer, part number, estimated placement cost, and die size (if the component is an IC). Integrated circuit costs are calculated from measured die area. Using assumptions for wafer size, process type, number of die per wafer, defect density, and profit margin in combination with die area, an estimate of semiconductor cost is derived. Costs for discrete components and interconnect are derived from assumption tables which relate BOM line items to specific cost estimates by component type and estimates for part placement costs are included. For LCD display costs, we employ a model which tabulates expected cost from measurements of glass area, LCD type, and total pixel resolution. When market costs are available from alternative sources, LCD panel costs are taken from and referenced to these sources. Costs of non-electronic components such as molded plastic enclosures and metallic components are measured in terms of weight, size, thickness, type of material, and complexity to arrive at their estimated cost. Other system items such as optics, antennae, batteries and displays are costed from a set of assumption tables derived from a combination of industry data, average high volume costs, and external sources. For final assembly, we re-build the torn-down product, tabulating stepwise assembly times as the reconstruction proceeds, to reach a total assembly time. Using a labor rate assumption for the country of origin, we then calculate final assembly cost. The three major categories for system cost contributors can be broken down into the subcategories of ICs, other electronics parts, displays, batteries (as appropriate), camera modules, electronics assembly, non-electronic elements, and final assembly. By adding the cost estimates for each of these subcategories, an overall estimated cost is derived for the system under evaluation. Product packaging and accessories (CDs, cables, etc.) are also documented and estimated for their contribution to total cost as appropriate. We believe our cost estimates generally fall within 15 percent of the “right answer,” which itself can vary depending on the market and OEM-specific factors mentioned earlier. While the TechInsights cost model is imperfect, it yields important insights into technology and business dynamics along with good first-order contributions to system cost by component type. Additionally, the consistency of approach and gradual modification to assumptions (smoothing out frequently-shifting pricing factors) hopefully yields a credible, but user-modifiable, view of OEM high volume cost-to-produce. Please feel free to contact us at [email protected] with any comments, questions, or proposed corrections with respect to our cost estimates. We welcome your input. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Optional Equipment Board #15900-141205-SBb – Page 453

Metrics (Overview & Discussion) In our product teardowns, we gather a series of metrics for product profiling and comparison. Some metrics focus on system characteristics such as total silicon area, total system semiconductor storage capacity, and total connection count. Other metrics reflect more subtle aspects of electronics assembly such as connection density, average component I/O count, and silicon tiling density. Taken as a whole, the metrics allow deeper comparison and benchmarking across multiple disciplines and multiple products. Key metrics we gather on products are described below along with their definitions and what they tend to say about the system under study. Most metrics can be used both in comparing similar products for benchmarking purposes or for quantifying differences in levels of complexity between dissimilar product types. Data fall into two categories; either “raw” measured data or ratios of these measured data sets. Total Silicon Area : This metric describes the total area of silicon as measured from X-ray or direct measurement of ICs. The area is an expression of the enclosed bare die area and excludes packaging area. The aggregate silicon area is a good benchmark to show how integrated a design might be when making comparisons to similar systems. Total silicon area also reflects the major cost driver for most systems we examine. Silicon Tiling Density : Ratio of Total Silicon Area to total printed circuit board “projected” area (i.e. the simple board area and not the cumulative surface area of both sides of the board). This metric directly reflects the level of efficiency and aggressiveness in integrated circuit packing and placement. Single digit Silicon Tiling Density is typical but silicon coverage of 10% - 20% has been seen in some of the most advanced products we have examined. Higher Tiling Densities often correspond with the use of chip scale packaging (CSPs) or other small form-factor IC packaging technologies. High density circuit boards are also often a supporting technology. Number of Parts : Total component count including ICs, passives, modules, connectors, etc., each separated out in our reporting. Number of Connections : The total number of connections corresponds to the total number of interconnects introduced by the aggregate component set and reflects any electrical connection observed (solder joints, adhesive interconnect, or connector terminal interfaces). Opportunity Count : Opportunity Count is the total number of parts plus the total number of connections; the name reflects that each of these constituent elements represents an opportunity for failure. A high opportunity count means more complex and riskier electronics assembly. Average Pin Count (APC) : Ratio of total number of component terminals to total number of parts, at the system level. This metric reflects the ‘average’ terminal complexity of the components and often provide a signature of integration level and/or “digital-ness” of the overall product. Low APCs reflect a high number of discretes or other low-pincount devices often characteristic of analog circuitry. Conversely, high APCs are characteristic of highly integrated, high-pincount assemblies, often those composed largely of digital integrated circuits. Connection Density : This metric is a ratio of the total Number of Connections to total printed circuit board assembly area, in units of connections per sq. inch. The metric provides data related to the Silicon Tiling Density above, but with an emphasis on complexity of I/O interconnect. For example, with a fixed Connection Density, high tiling density of low-pincount memory chips is more readily achieved than comparable silicon tiling of high pincount logic. Part Density : This metric is a ratio of the total Number of Parts to total printed circuit board assembly area, in units of components per sq. inch. The metric provides data related to the Silicon Tiling Density and Connection Density as described above, but with an emphasis on density and complexity of component packing efficiency. For example, low Part Density of high-pincount devices can pose an equal challenge in Connection Density to high Part Density of low-pincount devices. High Part Density does reflect challenges in surface mount assembly in terms of (typically) precision of placement, number of placements, and engineering of part clearances. Routing Density (heuristic estimate) = 3*(Average Pin Count)*√Part Density. The Routing Density metric is an empirically derived relationship that characterizes the wiring density of the interconnect used to support the interconnection of components in a planar electronic assembly (i.e. the circuit board). Architectural issues such as bussing or other factors affecting the regularity of wiring impact the actual Routing Density needed to support a given application, but the metric provides a ready measure of wiring complexity. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Optional Equipment Board #15900-141205-SBb – Page 454

Appendix

Click Here to Return to Cost Analysis Page 60

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

455

Deep Dive Report CMI BMW i3 10.2” Infotainment Display 2113 / 9306743-04 Report #15900-141006-RBc

Product Description Model 9306743-04 is a 10.2" LCD display manufactured for BMW by CMI (Chi Mei Innolux) and included in 2014 i3 models equipped with the optional Technology + Driving Assistant Package. This package provides drivers with real-time navigation and traffic information during trips as well as access to BMW Online (business, stock, weather updates) and BMW Apps. The device uses a Fujitsu “Indigo-L” MB88F333BA graphics controller to drive a TFT-LCD display featuring 1280 x 480 resolution, 16M colors, and Himax PA3271A and PA6538C display drivers. Communication protocols used are the Automotive PIXel (APIX) link and Serial Peripheral Interface (SPI).

DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information. Copyright © 2015, TechInsights. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of TechInsights.

www.teardown.com [email protected]

Product Overview Product Description

Integrated Circuit Metrics

Product Type

Automotive

IC Die Count**

10

Brand

BMW, manufactured by CMI (Chi Mei Innolux)

IC Package Count**

10

Product Name & Model #

i3 Infotainment Display, 9306743-04

Official Release Date

5/21/2014 ?

Weight (grams)

908.8 (Measured)

Retail Price

Product Dimensions (mm)

286.5 x 131.0 x 57.3 (Measured)

Total Manufacturing Cost Electronics Cost**

Product Features Communications

Graphics Controller

Cost Metrics

Synchronous Serial I/F (SPI) Automotive PIXel (APIX) Link

Integrated Circuits

Fujitsu "Indigo-L" MB88F333BA

$18.43

14.2%

Modules, Discretes & Connectors

$4.75

3.7%

Substrates

$1.25

1.0%

Component Insertion

$1.66

1.3%

Card Test

$0.63

0.5%

None

$93.77

72.5%

Non-Electronic Parts

$8.31

6.4%

Final Assembly & Test

$0.54

0.4%

$129.34

100.0%

Total User Interface

$59.11

Manufacturing Cost Breakdown

Display Subsystem Connectivity

$129.34

None

**Including Subsystems

Key Subsystems Display

Copyright © 2014, TechInsights

7 June 2017

10.2" TFT-LCD, 1280 x 480 Pixels, 16M Colors

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 457

TFT Panel

7 - Himax #PA3271A TFT-LCD Display Driver

Backlight Flex

Backlight Flex

Block Diagram

8 - Himax #PA6538C TFT-LCD Display Driver

1 - Maxim #MAX16838A 2-Channel LED Driver Vehicle Wiring Harness 6 - Semtech #SRV05-4A ESD Protection

3 - Fujitsu #MB88F333BA "Indigo-L" Graphics Controller

4 - Maxim #MAX16927 Automotive TFT-LCD Power Supply 5 - Rohm #BD87A29 2.9V Voltage Detector w/ Watchdog Timer

2 - Rohm #BD00KA5W 500 mA Adjustable LDO Regulator

Estimated block diagram based on observation of this specific product implementation, manufacturer’s data sheets where available, and best engineering judgment. Certain details of the interface circuitry are not reflected in this block diagram. Partitioning and connectivity are speculative.

Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 458

Product Labels

Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 459

Exterior Features

TFT-LCD Display

Mounting Holes

Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 460

Exterior Features

Vehicle Wiring Harness

Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 461

Major Components (Side 1)

Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 462

Major Components (Side 2)

Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 463

Component Arrangement

Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 464

Teardown Sequence

Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 465

Teardown Sequence

Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 466

Teardown Sequence

Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 467

Teardown Sequence

Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 468

Display Subsystem

Shown with polarizers attached. Grid = 1 cm Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 469

Display Subsystem 7 - Himax #PA3271A TFT-LCD Display Driver

8 - Himax #PA6538C TFT-LCD Display Driver

Shown with polarizers attached. Grid = 1 cm Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 470

Display Subsystem

Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 471

Display Subsystem 7-Backlight LEDs

Main Board

Two identical Backlight Flex assemblies are included in the display module.

Grid = 1 cm Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 472

Display Subsystem Display Module Brand Part Number Module Dimensions Weight (grams)

Panel Metrics

View Size (mm) Type Colors Rows / Columns Backlighting Scheme

Estimated Costs

Panel(s) Electronic Parts Circuit Assembly Non-Electronic Parts Final Assembly Test Gross Margin

Estimated Module Price

Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

Unknown Unknown 264 x 109.3 x 18.1 499.60 92 x 244 TFT w/Chip-in-Glass 16777216 480 / 1280 Edge lit - 2-flexes, 7 white LEDs ea $14.04 $31.60 $0.55 $14.51 $0.00 $0.25 $32.82 $93.77

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 473

Main Board (Side 1)

Vehicle Wiring Harness Display Flex

Backlight Flexes Grid = 1 cm Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 474

Main Board (Side 1 IC Identification) 2 - Rohm #BD00KA5W 500 mA Adjustable LDO Regulator

3 - Fujitsu #MB88F333BA "Indigo-L" Graphics Controller

1 - Maxim #MAX16838A 2-Channel LED Driver

4 - Maxim #MAX16927 Automotive TFT-LCD Power Supply

5 - Rohm #BD87A29 2.9V Voltage Detector w/ Watchdog Timer

6 - Semtech #SRV05-4A ESD Protection

Grid = 1 cm Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 475

Main Board (Side 2)

Grid = 1 cm Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 476

Main Board Cross-Section

Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 477

Substrate Data Substrates Assembly Name Main Brd

Manufacturer

Shenzhen Kinwong Electronic Co LTD

Copyright © 2014, TechInsights

7 June 2017

Core Material

FR4

Mfg. Technology

4 Layer conventional FR4 / HF

Layers

4

Area (cm²) 75.6

Min. Trace Pitch (mm) 0.60

Copyright © Munro & Associates, Inc. 2015

Min. Trace Width (mm) 0.30

ThruVia Land Dia (mm) 0.60

ThruVia Hole Dia (mm)

BlindVia Land Dia (mm)

0.35

www.LeanDesign.com

BlindVia Hole Dia (mm)

Thickness (mm) 1.6

Routing Density

Estimated Costs

18.7 $

1.25

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 478

Integrated Circuit Components Package Info

Estimated Costs

Die Info

Location Pkg Ref. #

Pkg Qty

Brand Name

1 2 3 4 5 6

1 1 1 1 1 1

Maxim Rohm Fujitsu Maxim Rohm Semtech

Main Brd, Side 1

Totals

6

Part Number MAX16838A BD00KA5W MB88F333BA MAX16927 BD87A29 SRV05-4A

Pkg Description 2-Channel LED Driver 500 mA Adjustable LDO Regulator "Indigo-L" Graphics Controller Automotive TFT-LCD Power Supply 2.9V Voltage Detector w/ Watchdog Timer ESD Protection

Form

Pin Count

Length (mm)

Width (mm)

Height (mm)

Die Ref #

Die Qty

QFN TO QFP QFN SOP SOP

20 5 176 48 8 6

4.00 6.70 24.00 7.00 3.00 3.10

4.00 5.50 24.00 7.00 2.70 1.50

0.85 2.40 1.40 0.80 0.80 1.10

1.1 2.1 3.1 4.1 5.1 6.1

1 1 1 1 1 1

263

Brand Name Maxim Rohm Fujitsu Maxim Rohm Semtech

Part Number 5P22Z CU102 MB88F333 AP14Z CL476 SRV05-4A

6

Description 2-Channel LED Driver 500 mA Adjustable LDO Regulator "Indigo-L" Graphics Controller Automotive TFT-LCD Power Supply Voltage Detector w/ Watchdog Timer ESD Protection

Length (mm)

Width (mm)

2.20 1.50 6.70 3.50 1.50 1.40

1.90 1.50 6.70 2.90 1.40 0.70

Each $ 1.500 $ 0.171 $ 12.100 $ 4.130 $ 0.440 $ 0.087

Total $ 1.500 $ 0.171 $ 12.100 $ 4.130 $ 0.440 $ 0.087

$18.43

Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.

Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 479

Subsystem IC Components Note: The ICs listed below are for reference only. Their costs are integrated into the cost of the individual subsystems. Package Info

Estimated Costs

Die Info

Location Pkg Ref. # Display Module: Display Flex

Totals

7 8

Pkg Qty

Brand Name

1 3

4

Himax Himax

Part Number PA3271A PA6538C

Pkg Description TFT-LCD Display Driver TFT-LCD Display Driver

Form Flip Chip, Adhesive Flip Chip, Adhesive

Pin Count

Length (mm)

Width (mm)

Height (mm)

Die Ref #

662 1495

13.60 25.00

1.00 1.40

0.25 0.23

7.1 8.1

5147

Die Qty 1 1

Brand Name Himax Himax

Part Number PA3271A PA6538C

4

Description TFT-LCD Display Driver TFT-LCD Display Driver

Length (mm)

Width (mm)

13.60 25.00

1.00 1.40

Each $ 2.270 $ 5.500

Total $ $

2.270 16.500

$18.77

Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.

Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 480

Modular Components Estimated Costs

Package Location

Main Brd, Side 1

TOTALS

Qty

1 1

Brand Name

KDS Daishinku Unknown

DSX151GAL 471 WE

Description

Resonator: Resonator Transformer: Transformer

2

Copyright © 2014, TechInsights

7 June 2017

Part Number

Pin Count

Length (mm)

Width (mm)

2 4

11.80 10.00

5.50 8.70

6

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

Each

Total

$ 0.180 $ 1.890

$ 0.180 $ 1.890

$2.07

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 481

Active Discrete Components Package Location

Main Brd, Side 1

TOTALS

Qty

7 2 1 1 1

Functional Description

Small Small Small Small Small

Active Active Active Active Active

Form

Top Marking

Pin Count

Length (mm)

Width (mm)

Transistor, Small Diode, SMT Diode, SMT Diode, SMT Diode, SMT

A7W 3d, 6BW 3o, WM9 3d, WJ3 42 B5 t3d A3 t3 ON C52 1BL3. AD46 SS14

3 2 2 2 2

2.80 2.70 3.70 4.20 4.30

1.30 1.70 2.60 3.60 2.70

12

Copyright © 2014, TechInsights

7 June 2017

Estimated Costs

31

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

Each $0.030 $0.015 $0.015 $0.015 $0.015

Total $0.209 $0.030 $0.015 $0.015 $0.015

$0.28

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 482

Passive Discrete Components Estimated Costs

Package Location

Qty

1 2 5 Main Brd, Side 1 3 1 1 279

TOTALS

Capacitor Small Passive Coil Capacitor Small Passive Small Passive Small Passive

Form

Pin Count

Electrolytic, Small Coil, Inductor SMT, Small Electrolytic, Small Res Array - 472 Res - R180 Cap, Res, Ferrite

2 4 2 2 8 2 2

292

Copyright © 2014, TechInsights

7 June 2017

Functional Description

594

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

Each $0.040 $0.008 $0.050 $0.040 $0.007 $0.004 $0.004

Total $0.040 $0.016 $0.250 $0.120 $0.007 $0.004 $1.116

$1.55

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 483

Connectors Estimated Costs

Package Location

Qty

Main Brd, Side 1

2 1 1

TOTALS

4

Copyright © 2014, TechInsights

7 June 2017

Form

Connector: ZIF - Backlight Flexes Connector: ZIF - Display Flex Connector: Vehicle Wiring Harness

Pin Count

Length (mm)

Width (mm)

Each

Total

6 50 6

10.60 30.70 27.50

4.60 5.40 15.60

$0.092 $0.400 $0.250

$0.184 $0.400 $0.250

68

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

$0.83

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 484

Electronic Assembly Metrics

Connection Density (Connections/sq.cm)

Avg. Pin Count

Assembly Weight (grams)

302.4

Component Density (Components/sq.cm)

302.4

4

Number of Connections

4

75.6

Number of Components

75.6

Routing Density (cm of routing per sq.cm of substrate)

Main Brd

Main Electronics Totals

Circuit Area (sq.cm)

Main Electronics

Assembly Name

Metal Layers

General Area

Substrate Area (sq.cm)

Electronic Assembly Metrics by Assembly

18.7

316

962

4.2

12.7

3.0

47.60

316

962

4.2

12.7

3.0

47.60

Subsystem Electronics

Display Module: Backlight Flex1

8.4

2

16.8

5.9

8

16

1.0

1.9

2.0

0.30

Subsystem Electronics

Display Module: Backlight Flex2

8.4

2

16.8

5.9

8

16

1.0

1.9

2.0

0.30

Subsystem Electronics

Display Module: Display Flex

56.5

2

113.0

272.6

59

5257

1.0

93.0

89.1

3.20

73.3

6

146.6

75

5289

1.0

72.2

70.5

3.80

148.9

10

449

391

6251

2.6

42.0

16.0

51.40

Subsystem Electronics Totals System Totals

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 485

Electronic Assembly Metrics

Main Brd Display Module System Totals

Card Test

Insertion

Substrates

Connector Components

Passive Components

Assembly Name

Total Main Electronics Main Electronics Totals Subsystem Electronics Subsystem Electronics Totals

Modular & Odd Form Components

Integrated Circuits

General Area

Small Active Components

Electronics Costs by Assembly

$ $ $ $

26.71 26.71 32.40 32.40

$ $ $ $

18.43 18.43 18.77 18.77

$ $ $ $

2.07 2.07 -

$ $ $ $

0.28 0.28 0.75 0.75

$ $ $ $

1.55 1.55 0.22 0.22

$ $ $ $

0.83 0.83 -

$ $ $ $

1.25 1.25 11.87 11.87

$ $ $ $

1.66 1.66 0.55 0.55

$ $ $ $

0.63 0.63 0.25 0.25

$

59.11

$

37.20

$

2.07

$

1.03

$

1.77

$

0.83

$

13.12

$

2.21

$

0.88

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 486

Electronic Assembly Metrics

Passive Component Connections

Connectors

Connector Connections

Subsystem IOs

Opportunities

System Totals

Passive Components

Subsystem Electronics Totals

Small Active Component Connections

Display Module

Small Active Components

Subsystem Electronics

Modular/Odd Form Component Connections

Main Brd

Main Electronics Totals

Modular/Odd Form Components

Main Electronics

Assembly Name

IC Connections

General Area

IC Package Count

Counts by Assembly

6

263

2

6

12

31

292

594

4

68

0

1278

6

263

2

6

12

31

292

594

4

68

0

1278

4

5147

0

0

17

34

54

108

0

0

50

5414

4

5147

0

0

17

34

54

108

0

0

50

5414

10

5410

2

6

29

65

346

702

4

68

50

6692

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 487

Electronic Assembly Metrics

Die Area (sq.mm)

Substrate Tiling Density (die area / substrate area)

Package Area (sq.mm)

Die Area/Package Area Ratio

Package Connections per sq.cm of Package Area

Volatile Memory (KBytes)

Non-Volatile Memory (KBytes)

6

6

263

64.6

0.01

690.6

0.09

38.1

0

0

6

6

263

64.6

690.6

0.09

38.1

0

0

4

4

5147

118.6

118.6

1.00

43.4

0

0

4

4

5147

118.6

118.6

1.00

4339.8

0

0

10

10

5410

183.2

809.2

0.23

668.6

0

0

Assembly Name

Main Brd

Main Electronics Totals Subsystems

Number of Package Connections

Main Electronics

IC Package Count

General Area

IC Die Count

IC Metrics

Display Module

Subsystem Electronics Totals System Totals

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 488

Electronic Costs Breakdown Estimated Cost of Electronics

(Includes Subsystem Electronics)

$59.11

Insertion 4%

Card Test 1%

Substrates 22%

Integrated Circuits 63%

Connector Components 1% Passive Components 3% Small Active Components 2%

Modular & Odd Components 4%

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 489

Vendor IC Cost Distribution * Includes Subsystem Vendors & Associated Costs

Pkg. Brand Cost Himax Fujitsu Maxim Rohm Semtech

$18.77 $12.10 $5.63 $0.61 $0.09 Rohm 2%

Semtech 1%

Maxim 15% Himax 50% Fujitsu 32%

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 490

Non-Electronic Cost Estimate Subsystem

Part ID No.

Qty

Housing

1 2 3

1 1 1

Housing, Front Housing, Rear Housing, Inner

Molded Molded Cast

ABS ABS Aluminum

Misc

4 5 6 7 8 9 10 11

2 3 1 1 6 3 2 3

Label, Bar Code - Large Label, Bar Code - Small Tape, Kapton Label, QR Code Pad, Isolation Tape, Black Screw RTV

Die-Cut + Printed Die-Cut + Printed Die-Cut Die-Cut + Printed Die-Cut Die-Cut Extruded + Threaded Dispensed

Paper Paer Kapton Paper Plastic Plastic Steel Silicone

Total

Weight Est'd Cost Est'd (grams) Each Extended Cost

Fabrication Process Material Dimensions (mm) 290 x 127.8 x 13.9 286 x 127.5 x 54.3 271 x 115 x 44

24.00 110.00 221.20

1.080 2.070 4.680

1.080 2.070 4.680

69.8 x 19.8 x 0.06 37.9 x 5.5 x 0.06 32.9 x 7.1 x 0.02 9.7 x 7.8 x 0.06 14 x 14 x 0.3 39.5 x 13.2 x 0.07 13.5 x 4.1 x 2.6 x

0.30 0.15 0.03 0.02 0.60 0.03 0.60 3.00

0.060 0.050 0.020 0.030 0.010 0.010 0.020 0.010

0.120 0.150 0.020 0.030 0.060 0.030 0.040 0.030

Estimated Cost

24

Copyright © 2014, TechInsights

7 June 2017

Description

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

$8.31

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 491

Final Ass’y Labor & Test Cost Estimate

Final Assembly & Test Made in Number of parts Est'd number of steps Est'd time (seconds)

Est'd final assembly cost Est'd final test cost

Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

China 29 93 316 $

0.24

$

0.30

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 492

Cost Summary Estimated Cost Totals Main Electronic Assemblies Display(s) Non-Electronic Parts Final Assembly & Test

Total

$ $ $ $

26.71 93.77 8.31 0.54

$ 129.34

Non-Electronic Parts 8%

Final Assembly & Test 1%

Main Electronic Assemblies 14%

Display Subsystem 77%

Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 493

Cost Estimation Process (Overview & Discussion) Cost modeling is tricky business. Multiple variables affect the actual production costs a manufacturer will experience, including development expenses, unit volumes, supply-and-demand in component markets, die yield-curve maturity, OEM purchasing power, and even variations in accounting practices. Different cost modeling methods employ different assumptions about how to handle these and other variables, but we can identify two basic approaches: that which seeks to track short-term variations in the inputs to the production process, and that which strives to maintain comparability of the output of the model across product families and over time. TechInsights’ philosophy in cost modeling is to emphasize consistency across products and comparability over time, rather than to track short-term fluctuations. During the past eight years, we have developed an estimation process that, while necessarily lacking an insider’s knowledge of the cost factors that impact any one manufacturer, is reasonably accurate in its prediction of unit costs in high-volume production environments. We do not claim that the model will produce the “right” answer for your firm’s environment. However, TechInsights does give customers a key analytical tool with a complete set of data in our Bill of Materials (BOM). The BOM allows readers to 1) scrutinize the assumptions behind our cost model and 2) modify the results based on substitution of their own component cost estimates where they have better information based on inside knowledge. Our estimation process decomposes overall system cost into three major categories: Electronics, Mechanical, and Final Assembly. We begin by creating a complete electronics bill-of-materials (BOM). Each component from the largest ASIC to the smallest discrete resistor is entered into a BOM table with identifying attributes such as size, pitch, I/O count, package type, manufacturer, part number, estimated placement cost, and die size (if the component is an IC). Integrated circuit costs are calculated from measured die area. Using assumptions for wafer size, process type, number of die per wafer, defect density, and profit margin in combination with die area, an estimate of semiconductor cost is derived. Costs for discrete components and interconnect are derived from assumption tables which relate BOM line items to specific cost estimates by component type and estimates for part placement costs are included. For LCD display costs, we employ a model which tabulates expected cost from measurements of glass area, LCD type, and total pixel resolution. When market costs are available from alternative sources, LCD panel costs are taken from and referenced to these sources. Costs of non-electronic components such as molded plastic enclosures and metallic components are measured in terms of weight, size, thickness, type of material, and complexity to arrive at their estimated cost. Other system items such as optics, antennae, batteries and displays are costed from a set of assumption tables derived from a combination of industry data, average high volume costs, and external sources. For final assembly, we re-build the torn-down product, tabulating stepwise assembly times as the reconstruction proceeds, to reach a total assembly time. Using a labor rate assumption for the country of origin, we then calculate final assembly cost. The three major categories for system cost contributors can be broken down into the subcategories of ICs, other electronics parts, displays, batteries (as appropriate), camera modules, electronics assembly, non-electronic elements, and final assembly. By adding the cost estimates for each of these subcategories, an overall estimated cost is derived for the system under evaluation. Product packaging and accessories (CDs, cables, etc.) are also documented and estimated for their contribution to total cost as appropriate. We believe our cost estimates generally fall within 15 percent of the “right answer,” which itself can vary depending on the market and OEM-specific factors mentioned earlier. While the TechInsights cost model is imperfect, it yields important insights into technology and business dynamics along with good first-order contributions to system cost by component type. Additionally, the consistency of approach and gradual modification to assumptions (smoothing out frequently-shifting pricing factors) hopefully yields a credible, but user-modifiable, view of OEM high volume cost-to-produce. Please feel free to contact us at [email protected] with any comments, questions, or proposed corrections with respect to our cost estimates. We welcome your input. Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 494

Metrics (Overview & Discussion) In our product teardowns, we gather a series of metrics for product profiling and comparison. Some metrics focus on system characteristics such as total silicon area, total system semiconductor storage capacity, and total connection count. Other metrics reflect more subtle aspects of electronics assembly such as connection density, average component I/O count, and silicon tiling density. Taken as a whole, the metrics allow deeper comparison and benchmarking across multiple disciplines and multiple products. Key metrics we gather on products are described below along with their definitions and what they tend to say about the system under study. Most metrics can be used both in comparing similar products for benchmarking purposes or for quantifying differences in levels of complexity between dissimilar product types. Data fall into two categories; either “raw” measured data or ratios of these measured data sets. Total Silicon Area : This metric describes the total area of silicon as measured from X-ray or direct measurement of ICs. The area is an expression of the enclosed bare die area and excludes packaging area. The aggregate silicon area is a good benchmark to show how integrated a design might be when making comparisons to similar systems. Total silicon area also reflects the major cost driver for most systems we examine. Silicon Tiling Density : Ratio of Total Silicon Area to total printed circuit board “projected” area (i.e. the simple board area and not the cumulative surface area of both sides of the board). This metric directly reflects the level of efficiency and aggressiveness in integrated circuit packing and placement. Single digit Silicon Tiling Density is typical but silicon coverage of 10% - 20% has been seen in some of the most advanced products we have examined. Higher Tiling Densities often correspond with the use of chip scale packaging (CSPs) or other small form-factor IC packaging technologies. High density circuit boards are also often a supporting technology. Number of Parts : Total component count including ICs, passives, modules, connectors, etc., each separated out in our reporting. Number of Connections : The total number of connections corresponds to the total number of interconnects introduced by the aggregate component set and reflects any electrical connection observed (solder joints, adhesive interconnect, or connector terminal interfaces). Opportunity Count : Opportunity Count is the total number of parts plus the total number of connections; the name reflects that each of these constituent elements represents an opportunity for failure. A high opportunity count means more complex and riskier electronics assembly. Average Pin Count (APC) : Ratio of total number of component terminals to total number of parts, at the system level. This metric reflects the ‘average’ terminal complexity of the components and often provide a signature of integration level and/or “digital-ness” of the overall product. Low APCs reflect a high number of discretes or other low-pincount devices often characteristic of analog circuitry. Conversely, high APCs are characteristic of highly integrated, high-pincount assemblies, often those composed largely of digital integrated circuits. Connection Density : This metric is a ratio of the total Number of Connections to total printed circuit board assembly area, in units of connections per sq. inch. The metric provides data related to the Silicon Tiling Density above, but with an emphasis on complexity of I/O interconnect. For example, with a fixed Connection Density, high tiling density of low-pincount memory chips is more readily achieved than comparable silicon tiling of high pincount logic. Part Density : This metric is a ratio of the total Number of Parts to total printed circuit board assembly area, in units of components per sq. inch. The metric provides data related to the Silicon Tiling Density and Connection Density as described above, but with an emphasis on density and complexity of component packing efficiency. For example, low Part Density of high-pincount devices can pose an equal challenge in Connection Density to high Part Density of low-pincount devices. High Part Density does reflect challenges in surface mount assembly in terms of (typically) precision of placement, number of placements, and engineering of part clearances. Routing Density (heuristic estimate) = 3*(Average Pin Count)*√Part Density. The Routing Density metric is an empirically derived relationship that characterizes the wiring density of the interconnect used to support the interconnection of components in a planar electronic assembly (i.e. the circuit board). Architectural issues such as bussing or other factors affecting the regularity of wiring impact the actual Routing Density needed to support a given application, but the metric provides a ready measure of wiring complexity. Copyright © 2014, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 495

Appendix

Click Here to Return to Cost Analysis Page 74

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

496

Deep Dive Report BMW i3 Back-up Antenna Assembly 2245

Report #15900-150224-PKb

Product Description This report concerns the Back-up Antenna Assembly for the 2014 BMW i3. This module features a secondary PCB antenna housed in a molded plastic top enclosure and a metal internal support.

DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information. Copyright © 2015, TechInsights. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of TechInsights.

www.teardown.com [email protected]

Product Overview Product Description

Integrated Circuit Metrics

Product Type

Automotive

IC Die Count

0

Brand

BMW

IC Package Count

0

Product Name & Model #

i3 Back-up Antenna Assembly

Official Release Date

5/2/2014

Weight (grams)

8.5 (Measured)

Retail Price

Product Dimensions (mm)

99.4 x 65.0 x 27.0 (Measured at Longest/Widest/Thickest Points)

Total Manufacturing Cost

$5.39

Electronics Cost

$1.35

Product Features

Cost Metrics

Manufacturing Cost Breakdown Discretes

$0.01

0.2%

Connectors

$1.14

21.2%

Substrates

$0.11

2.0%

Component Insertion

$0.03

0.6%

Card Test

$0.06

1.1%

Non-Electronics

$3.76

69.8%

Final Assembly & Test

$0.28

5.2%

Total

Copyright © 2015,

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

$5.39 100.0%

BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 498

Block Diagram

Secondary Antenna

Antenna Connector

Estimated block diagram based on observation of this specific product implementation, manufacturer’s data sheets where available, and best engineering judgment. Certain details of the interface circuitry are not reflected in this block diagram. Partitioning and connectivity are speculative.

Copyright © 2015,

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 499

Product Label

Copyright © 2015,

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 500

Exterior Features

Copyright © 2015,

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 501

Exterior Features

Copyright © 2015,

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 502

Major Components (Side 1)

Copyright © 2015,

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 503

Major Components (Side 2)

Copyright © 2015,

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 504

Teardown Sequence

Copyright © 2015,

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 505

Teardown Sequence

Copyright © 2015,

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 506

Main Board (Side 1)

PCB Antenna

Antenna Connector

Grid = 1 cm

Copyright © 2015,

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 507

Main Board (Side 2)

Grid = 1 cm

Copyright © 2015,

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 508

Main Board Cross-Section

Copyright © 2015,

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 509

Substrate Data Substrates Assembly Name Antenna Board

Manufacturer

Unknown

Core Material

FR4

Copyright © 2015,

7 June 2017

Mfg. Technology

2 Layer conventional FR4 / HF

Area (cm²)

Layers

2

7.6

Min. Trace Pitch (mm) 1.28

Min. Trace Width (mm) 0.65

Copyright © Munro & Associates, Inc. 2015

ThruVia Land Dia (mm) 1.29

ThruVia Hole Dia (mm)

BlindVia Land Dia (mm)

0.81

www.LeanDesign.com

BlindVia Hole Dia (mm)

Thickness (mm) 1.6

Routing Density

Estimated Costs

3.1 $

0.11

BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 510

Passive Discrete Components Estimated Costs

Package Location

Qty

2

TOTALS

Copyright © 2015,

7 June 2017

Functional Description

Small Passive

Form

Pin Count

Cap, Res, Ferrite

2

2

Copyright © Munro & Associates, Inc. 2015

4

www.LeanDesign.com

Each

Total

$0.004

$0.008

$0.01

BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 511

Connectors Estimated Costs

Package Location

Antenna Board, Side 1

TOTALS

Copyright © 2015,

7 June 2017

Qty

1

1

Form

Jack: Antenna

Pin Count

Length (mm)

Width (mm)

1

23.50

8.57

Each

$1.140 $1.140

1

Copyright © Munro & Associates, Inc. 2015

Total

$1.14

www.LeanDesign.com

BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 512

Electronic Assembly Metrics

15.2

Assembly Weight (grams)

15.2

2

Avg. Pin Count

2

7.6

Connection Density (Connections/sq.cm)

Circuit Area (sq.cm)

7.6

System Totals

Component Density (Components/sq.cm)

Metal Layers

Antenna Board

Number of Connections

Substrate Area (sq.cm)

Main Electronics

Assembly Name

Number of Components

General Area

Routing Density (cm of routing per sq.cm of substrate)

Electronic Assembly Metrics by Assembly

3.1

3

5

0.4

0.7

1.7

4.90

3

5

0.4

0.7

1.7

4.90

NOTE: Occasional inconsistencies in totals may be present due to rounding error.

Copyright © 2015,

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 513

Electronic Assembly Metrics

Card Test

Insertion

Substrates

Connector Components

Passive Components

Assembly Name

Total Main Electronics

Modular & Odd Form Components

Integrated Circuits

General Area

Small Active Components

Electronics Costs by Assembly

Antenna Board

$

1.35

$

-

$

-

$

-

$

0.01

$ 1.14

$

0.11

$

0.03

$

0.06

System Totals

$

1.35

$

-

$

-

$

-

$

0.01

$ 1.14

$

0.11

$

0.03

$

0.06

NOTE: Occasional inconsistencies in totals may be present due to rounding error.

Copyright © 2015,

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 514

Electronic Assembly Metrics

IC Package Count

IC Connections

Modular/Odd Form Components

Modular/Odd Form Component Connections

Small Active Components

Small Active Component Connections

Passive Components

Passive Component Connections

Connectors

Connector Connections

Opportunities

Counts by Assembly

Antenna Board

0

0

0

0

0

0

2

4

1

1

8

System Totals

0

0

0

0

0

0

2

4

1

1

8

General Area

Main Electronics

Assembly Name

NOTE: Occasional inconsistencies in totals may be present due to rounding error.

Copyright © 2015,

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 515

Electronic Costs Breakdown Estimated Cost of Electronics

(Includes Subsystem Electronics)

$1.35

Insertion 2%

Card Test 4%

Passive Components 1%

Substrates 8%

Connector Components 85%

NOTE: Occasional inconsistencies in totals may be present due to rounding error.

Copyright © 2015,

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 516

Non-Electronic Cost Estimate Subsystem

Part ID No.

Qty

Miscellaneous

1 2 3 4 5

1 1 1 1 2

Total

Internal Support Cover Medium Label Small Label Screw

Fabrication Process Stamped + Formed Molded Die-Cut + Printed Die-Cut + Printed Cast + Machined

Material Metal PC Plastic Plastic Metal

Dimensions (mm)

Weight Est'd Cost Est'd (grams) Each Extended Cost

83.5 x 63.4 x 21.7 99.4 x 65 x 25.7 25 x 14.41 6.6 x 6.3 7.72 x 4 x 4

55.90 23.60 0.10 0.05 0.36

2.270 1.380 0.050 0.020 0.020

Estimated Cost

6

Copyright © 2015,

7 June 2017

Description

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

2.270 1.380 0.050 0.020 0.040

$3.76

BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 517

Final Ass’y Labor & Test Cost Estimate

Final Assembly & Test Made in Number of parts Est'd number of steps Est'd time (seconds)

Est'd final assembly cost Est'd final test cost

Copyright © 2015,

7 June 2017

Copyright © Munro & Associates, Inc. 2015

Mexico 7 26 96 $ $

0.08 0.20

www.LeanDesign.com

BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 518

Cost Summary Estimated Cost Totals Main Electronic Assemblies Non-Electronic Parts Final Assembly & Test

Total

$ $ $

$

1.35 3.76 0.28

5.39

Cost Total Notes: Estimated final assembly cost includes labor only. Total cost does not include Non-recurring, R&D, G&A, IP licensing fees/royalties, software, sales & marketing, distribution. Assumes fully scaled production.

Final Assembly & Test 5%

Main Electronic Assemblies 25% Non-Electronic Parts 70%

Copyright © 2015,

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 519

Cost Estimation Process (Overview & Discussion) Cost modeling is tricky business. Multiple variables affect the actual production costs a manufacturer will experience, including development expenses, unit volumes, supply-and-demand in component markets, die yield-curve maturity, OEM purchasing power, and even variations in accounting practices. Different cost modeling methods employ different assumptions about how to handle these and other variables, but we can identify two basic approaches: that which seeks to track short-term variations in the inputs to the production process, and that which strives to maintain comparability of the output of the model across product families and over time. TechInsights’ philosophy in cost modeling is to emphasize consistency across products and comparability over time, rather than to track short-term fluctuations. During the past eight years, we have developed an estimation process that, while necessarily lacking an insider’s knowledge of the cost factors that impact any one manufacturer, is reasonably accurate in its prediction of unit costs in high-volume production environments. We do not claim that the model will produce the “right” answer for your firm’s environment. However, TechInsights does give customers a key analytical tool with a complete set of data in our Bill of Materials (BOM). The BOM allows readers to 1) scrutinize the assumptions behind our cost model and 2) modify the results based on substitution of their own component cost estimates where they have better information based on inside knowledge. Our estimation process decomposes overall system cost into three major categories: Electronics, Mechanical, and Final Assembly. We begin by creating a complete electronics bill-of-materials (BOM). Each component from the largest ASIC to the smallest discrete resistor is entered into a BOM table with identifying attributes such as size, pitch, I/O count, package type, manufacturer, part number, estimated placement cost, and die size (if the component is an IC). Integrated circuit costs are calculated from measured die area. Using assumptions for wafer size, process type, number of die per wafer, defect density, and profit margin in combination with die area, an estimate of semiconductor cost is derived. Costs for discrete components and interconnect are derived from assumption tables which relate BOM line items to specific cost estimates by component type and estimates for part placement costs are included. For LCD display costs, we employ a model which tabulates expected cost from measurements of glass area, LCD type, and total pixel resolution. When market costs are available from alternative sources, LCD panel costs are taken from and referenced to these sources. Costs of non-electronic components such as molded plastic enclosures and metallic components are measured in terms of weight, size, thickness, type of material, and complexity to arrive at their estimated cost. Other system items such as optics, antennae, batteries and displays are costed from a set of assumption tables derived from a combination of industry data, average high volume costs, and external sources. For final assembly, we re-build the torn-down product, tabulating stepwise assembly times as the reconstruction proceeds, to reach a total assembly time. Using a labor rate assumption for the country of origin, we then calculate final assembly cost. The three major categories for system cost contributors can be broken down into the subcategories of ICs, other electronics parts, displays, batteries (as appropriate), camera modules, electronics assembly, non-electronic elements, and final assembly. By adding the cost estimates for each of these subcategories, an overall estimated cost is derived for the system under evaluation. Product packaging and accessories (CDs, cables, etc.) are also documented and estimated for their contribution to total cost as appropriate. We believe our cost estimates generally fall within 15 percent of the “right answer,” which itself can vary depending on the market and OEM-specific factors mentioned earlier. While the TechInsights cost model is imperfect, it yields important insights into technology and business dynamics along with good first-order contributions to system cost by component type. Additionally, the consistency of approach and gradual modification to assumptions (smoothing out frequently-shifting pricing factors) hopefully yields a credible, but user-modifiable, view of OEM high volume cost-to-produce. Please feel free to contact us at [email protected] with any comments, questions, or proposed corrections with respect to our cost estimates. We welcome your input.

Copyright © 2015,

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 520

Metrics (Overview & Discussion) In our product teardowns, we gather a series of metrics for product profiling and comparison. Some metrics focus on system characteristics such as total silicon area, total system semiconductor storage capacity, and total connection count. Other metrics reflect more subtle aspects of electronics assembly such as connection density, average component I/O count, and silicon tiling density. Taken as a whole, the metrics allow deeper comparison and benchmarking across multiple disciplines and multiple products. Key metrics we gather on products are described below along with their definitions and what they tend to say about the system under study. Most metrics can be used both in comparing similar products for benchmarking purposes or for quantifying differences in levels of complexity between dissimilar product types. Data fall into two categories; either “raw” measured data or ratios of these measured data sets. Total Silicon Area : This metric describes the total area of silicon as measured from X-ray or direct measurement of ICs. The area is an expression of the enclosed bare die area and excludes packaging area. The aggregate silicon area is a good benchmark to show how integrated a design might be when making comparisons to similar systems. Total silicon area also reflects the major cost driver for most systems we examine. Silicon Tiling Density : Ratio of Total Silicon Area to total printed circuit board “projected” area (i.e. the simple board area and not the cumulative surface area of both sides of the board). This metric directly reflects the level of efficiency and aggressiveness in integrated circuit packing and placement. Single digit Silicon Tiling Density is typical but silicon coverage of 10% - 20% has been seen in some of the most advanced products we have examined. Higher Tiling Densities often correspond with the use of chip scale packaging (CSPs) or other small form-factor IC packaging technologies. High density circuit boards are also often a supporting technology. Number of Parts : Total component count including ICs, passives, modules, connectors, etc., each separated out in our reporting. Number of Connections : The total number of connections corresponds to the total number of interconnects introduced by the aggregate component set and reflects any electrical connection observed (solder joints, adhesive interconnect, or connector terminal interfaces). Opportunity Count : Opportunity Count is the total number of parts plus the total number of connections; the name reflects that each of these constituent elements represents an opportunity for failure. A high opportunity count means more complex and riskier electronics assembly. Average Pin Count (APC) : Ratio of total number of component terminals to total number of parts, at the system level. This metric reflects the ‘average’ terminal complexity of the components and often provide a signature of integration level and/or “digital-ness” of the overall product. Low APCs reflect a high number of discretes or other low-pincount devices often characteristic of analog circuitry. Conversely, high APCs are characteristic of highly integrated, high-pincount assemblies, often those composed largely of digital integrated circuits. Connection Density : This metric is a ratio of the total Number of Connections to total printed circuit board assembly area, in units of connections per sq. inch. The metric provides data related to the Silicon Tiling Density above, but with an emphasis on complexity of I/O interconnect. For example, with a fixed Connection Density, high tiling density of low-pincount memory chips is more readily achieved than comparable silicon tiling of high pincount logic. Part Density : This metric is a ratio of the total Number of Parts to total printed circuit board assembly area, in units of components per sq. inch. The metric provides data related to the Silicon Tiling Density and Connection Density as described above, but with an emphasis on density and complexity of component packing efficiency. For example, low Part Density of high-pincount devices can pose an equal challenge in Connection Density to high Part Density of low-pincount devices. High Part Density does reflect challenges in surface mount assembly in terms of (typically) precision of placement, number of placements, and engineering of part clearances. Routing Density (heuristic estimate) = 3*(Average Pin Count)*√Part Density. The Routing Density metric is an empirically derived relationship that characterizes the wiring density of the interconnect used to support the interconnection of components in a planar electronic assembly (i.e. the circuit board). Architectural issues such as bussing or other factors affecting the regularity of wiring impact the actual Routing Density needed to support a given application, but the metric provides a ready measure of wiring complexity.

Copyright © 2015,

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 521

Appendix

Click Here to Return to Cost Analysis Page 130

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

522

Deep Dive Report BMW i3 Electrical Digital Motor Assembly 2249

Report #15900-150210-SBb

Product Description The Digital Motor Control Assembly is part of the system electronics for the 2014 BMW i3. It is responsible for control of the engine torque, accelerator pedal, shifting, electric fans, power management for the electrical systems, and the vacuum pump. The Digital Motor Control Assembly is connected to the CAN, LIN, and FlexRay busses. The Infineon TC1793 Microcontroller is used to process information going through the NXP Semiconductor CAN, LIN, and FlexRay transceivers.

DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information. Copyright © 2015, TechInsights. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of TechInsights.

www.teardown.com [email protected]

Product Overview Product Description

Integrated Circuit Metrics

Product Type

Automotive

IC Die Count

11

Brand

Delphi

IC Package Count

10

Product Name & Model # Electrical Digital Motor Assembly 28446920

Cost Metrics

Official Release Date

5/2/2014

Weight (grams) Product Dimensions (mm)

283.2

Retail Price

151.07 x 136.3 x 33.37

Total Manufacturing Cost

$47.50

Electronics Cost

$39.10

Product Features

Manufacturing Cost Breakdown

Microcontrollers

Infineon #TC1793 32-Bit Single-Chip Microcontroller, Freescale #Unknown Microcontroller Integrated Circuits

Transceivers

NXP Semiconductor #TJA1021 LIN Transceiver, #TJA1082 FlexRay Node Transceiver, #TJA1042 CAN Transceiver

Communication

CAN, LIN, FlexRay Busses

$27.97

58.9%

Modules, Discretes & Connectors

$7.01

14.8%

Substrates

$1.62

3.4%

Component Insertion

$1.70

3.6%

Card Test

$0.81

1.7%

Non-Electronic Parts

$7.72

16.3%

Final Assembly & Test

$0.67

1.4%

Total $47.50 100.0%

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 524

Block Diagram

1 - Infineon #TC1793 32-Bit Single-Chip Microcontroller

4 - Freescale #MC9S08SG8 8-bit Microcontroller

2 - Unknown #Unknown Power Supply ASIC

11 - NXP Semiconductor #TJA1021 LIN Transceiver

10 - NXP Semiconductor #TJA1082 FlexRay Node Transceiver 3 - Infineon #TLE7233G Four Channel LowSide Relay Switch

6 - Infineon #BTS3410G Low Side Power Switch

Pin Connector Port

9 - NXP Semiconductor 9 - NXP #TJA1021 Semiconductor CAN Transceiver #TJA1042 CAN Transceiver

Estimated block diagram based on observation of this specific product implementation, manufacturer’s data sheets where available, and best engineering judgment. Certain details of the interface circuitry are not reflected in this block diagram. Partitioning and connectivity are speculative.

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 525

Product Labels

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 526

Exterior Features

Pin Connector Port

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 527

Major Components (Side 1)

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 528

Major Components (Side 2)

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 529

Component Arrangement

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 530

Teardown Sequence

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 531

Teardown Sequence

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 532

Teardown Sequence

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 533

Main Board (Side 1)

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 534

Main Board (Side 1 IC Identification) 6 - Infineon #BTS3410G Low Side Power Switch (2-Die Pkg.)

3 - Infineon #TLE7233G Four Channel Low-Side Relay Switch

5 - STMicroelectronics #VNS7NV04PTR-E Fully Autoprotected Power MOSFET

11 - NXP Semiconductor #TJA1021 LIN Transceiver 9 - NXP Semiconductor #TJA1042 ? CAN Transceiver 10 - NXP Semiconductor #TJA1082 FlexRay Node Transceiver 2 - Unknown #Unknown Power Supply ASIC

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

4 - Freescale #MC9S08SG8 8-bit Microcontroller

1 - Infineon #TC1793 32-Bit Single-Chip Microcontroller

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

? = Unconfirmed BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 535

Main Board (Side 2)

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 536

Main Board Cross-Section

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 537

Substrate Data Substrates Assembly Name Main Board

Manufacturer

Unknown

Core Material

FR4

Copyright © 2015, TechInsights

7 June 2017

Mfg. Technology

4 Layer Conventional FR4 / HF

Area (cm²)

Layers

4

108.1

Min. Trace Pitch (mm) 0.48

Min. Trace Width (mm) 0.15

Copyright © Munro & Associates, Inc. 2015

ThruVia Land Dia (mm) 0.62

ThruVia Hole Dia (mm)

BlindVia Land Dia (mm)

0.24

www.LeanDesign.com

BlindVia Hole Dia (mm)

Thickness (mm) 1.4

Routing Density

Estimated Costs

20.2 $

1.62

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 538

Integrated Circuit Components Package Info

Estimated Costs

Die Info

Location Pkg Ref. #

Pkg Qty

Brand Name

1 2 3 4 5

1 1 1 1 1

Infineon Unknown Infineon Freescale STMicroelectronics

6

1

9 10 11

2 1 1

Main Board, Side 1

Totals

Part Number

Pkg Description

TC1793 Unknown TLE7233G MC9S08SG8 VNS7NV04PTR-E

32-Bit Single-Chip Microcontroller Power Supply ASIC Four Channel Low-Side Relay Switch 8-bit Microcontroller Fully Autoprotected Power MOSFET

Infineon

BTS3410G

Low Side Power Switch

NXP Semiconductor NXP Semiconductor NXP Semiconductor

TJA1042 ? TJA1082 TJA1021

CAN Transceiver FlexRay Node Transceiver LIN Transceiver

10

Form

Pin Count

Length (mm)

BGA SOP SOP SOP SOP

416 44 24 16 8

26.98 15.86 8.84 5.21 5.03

26.96 10.78 3.87 4.23 3.96

1.96 3.31 1.88 1.04 1.60

MCP - 2 Chips

8

4.81

3.86

1.94

SOP SOP SOP

8 14 8

5.06 5.14 5.12

4.13 4.31 4.34

1.59 0.99 1.50

Width (mm)

Height (mm)

554

Die Ref #

Die Qty

1.1 2.1 3.1 4.1 5.1 6.1 6.2 9.1 10.1 11.1

1 1 1 1 1 1 1 1 1 1

Brand Name Infineon Unknown Infineon Freescale STMicroelectronics Infineon Infineon NXP Semiconductor NXP Semiconductor NXP Semiconductor

Part Number 2F0?PC12 C2PS_2 IO TLE7233G M84G LQ02 ?25N? ERYO M? NK Cf1361D cF1401B cF1271B

11

Description 32-Bit Single-Chip Microcontroller Power Supply ASIC Four Channel Low-Side Relay Switch 8-bit Microcontroller Fully Autoprotected Power MOSFET Power Switch Power Switch CAN Transceiver FlexRay Node Transceiver LIN Transceiver

Length (mm)

Width (mm)

9.39 5.27 2.20 2.30 2.54 1.58 1.59 2.09 2.52 1.76

7.56 4.07 1.64 2.06 2.10 1.35 1.37 1.46 1.91 1.39

Each

Total

$ 21.090 $ 21.090 $ 4.070 $ 4.070 $ 0.320 $ 0.320 $ 1.133 $ 1.133 $ 0.140 $ 0.140 $ 0.130 $ 0.130 $ 0.130 $ 0.130 $ 0.220 $ 0.440 $ 0.340 $ 0.340 $ 0.180 $ 0.180

$27.97

Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 539

Modular Components Estimated Costs

Package Location

Main Board, Side 1

TOTALS

Qty

1

Unknown

Part Number

None

Description

Crystal: Ceramic

1

Copyright © 2015, TechInsights

7 June 2017

Brand Name

Pin Count

Length (mm)

Width (mm)

4

3.24

2.50

4

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

Each

Total

$ 0.200 $ 0.200

$0.20

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 540

Active Discrete Components Package Location

Qty

Functional Description Form

Main Board, Side 1

1 2 2 2 2 1 2 1 1 1 2 1 2

Small Active Small Active Small Active Small Active Small Active Small Active Small Active Small Active Large Active Small Active Small Active Small Active Small Active

Diode, SMT Diode, SMT Diode, SMT Diode, SMT Diode, SMT Diode, SMT Transistor, Small Transistor, Small Diode, DIODE VARACTOR Transistor, Small MOSFET MOSFET,Dual Transistor, Small

Main Board, Side 2

1 1 1 1 1 1

Small Active Small Active Small Active Small Active Small Active Small Active

MOSFET Diode, SMT Diode, SMT Diode, SMT Transistor, Small MOSFET

TOTALS

Top Marking

Pin Count

Length (mm)

Width (mm)

D5F 98 48 KR 88 41 KQ F2F S5 44 67 90 K0 TAN 43 YBS 30 55 84 KQ A4W 41 .42 1CS FPE3AS FDS 4141 WJS 42

2 2 2 2 2 2 3 3 2 3 6 8 3

2.59 4.31 4.07 2.62 4.20 4.08 2.86 3.01 6.81 2.85 2.06 5.09 2.88

1.69 3.42 2.52 1.65 3.43 2.49 1.11 1.28 5.84 1.20 1.68 3.85 1.28

$0.015 $0.040 $0.040 $0.015 $0.040 $0.040 $0.030 $0.030 $0.390 $0.030 $0.090 $0.090 $0.030

$0.015 $0.080 $0.080 $0.030 $0.080 $0.040 $0.060 $0.030 $0.390 $0.030 $0.180 $0.090 $0.060

.42 WPS 98 48 KR 84 96 KQ F2F Tan 43 K2 80

6 2 2 2 3 1

2.05 4.30 4.12 2.65 2.83 2.94

1.16 3.35 2.58 1.50 1.24 1.89

$0.090 $0.040 $0.040 $0.015 $0.030 $0.090

$0.090 $0.040 $0.040 $0.015 $0.030 $0.090

26

Copyright © 2015, TechInsights

7 June 2017

Estimated Costs

76

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

Each

Total

$1.47

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 541

Passive Discrete Components Estimated Costs

Package Location

Qty

Functional Description Form

Main Board, Side 1

11 138 1 1 1 2 1

Main Board, Side 2

4 Small Passive 129 Small Passive

TOTALS

Copyright © 2015, TechInsights

7 June 2017

Small Passive Small Passive Coil Coil Coil Coil Coil

Pin Count

Each

Total

Inductor Cap, Res, Ferrite SMT, Dual Coil SMT, Dual Coil SMT,Dual Coil SMT, Power Inductor SMT, Power Inductor

2 2 4 4 4 2 2

$0.008 $0.004 $0.080 $0.080 $0.080 $0.400 $0.400

$0.088 $0.552 $0.080 $0.080 $0.080 $0.800 $0.400

Inductor Cap, Res, Ferrite

2 2

$0.008 $0.004

$0.032 $0.516

288

Copyright © Munro & Associates, Inc. 2015

582

www.LeanDesign.com

$2.63

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 542

Connectors Estimated Costs

Package Location

Main Board, Side 1

TOTALS

Copyright © 2015, TechInsights

7 June 2017

Qty

1

1

Form

Connector, Pin Port

Pin Count

Length (mm)

Width (mm)

Each

Total

48

55.25

11.36

$2.700

$2.700

48

Copyright © Munro & Associates, Inc. 2015

$2.70

www.LeanDesign.com

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 543

Electronic Assembly Metrics

Assembly Weight (grams)

432.28

Avg. Pin Count

432.3

4

Connection Density (Connections/sq.cm)

4

108.1

Component Density (Components/sq.cm)

108.1

System Totals

Number of Connections

Circuit Area (sq.cm)

Main Board

Number of Components

Metal Layers

Main Electronics

Assembly Name

Substrate Area (sq.cm)

General Area

Routing Density (cm of routing per sq.cm of substrate)

Electronic Assembly Metrics by Assembly

20.2

326

1264

3.0

11.7

3.9

55.50

326

1264

3.0

11.7

3.9

55.50

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 544

Electronic Assembly Metrics

Card Test

Insertion

Substrates

Connector Components

Passive Components

Assembly Name

Total

Main Electronics

Modular & Odd Form Components

Integrated Circuits

General Area

Small Active Components

Electronics Costs by Assembly

Main Board

$

39.10

$

27.97

$

0.20

$

1.47

$

2.63

$

2.70

$

1.62

$

1.70

$

0.81

System Totals

$

39.10

$

27.97

$

0.20

$

1.47

$

2.63

$

2.70

$

1.62

$

1.70

$

0.81

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 545

Electronic Assembly Metrics

IC Package Count

IC Connections

Modular/Odd Form Components

Modular/Odd Form Component Connections

Small Active Components

Small Active Component Connections

Passive Components

Passive Component Connections

Connectors

Connector Connections

Opportunities

Counts by Assembly

Main Board

10

554

1

4

26

76

288

582

1

48

1590

System Totals

10

554

1

4

26

76

288

582

1

48

1590

General Area

Main Electronics

Assembly Name

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 546

Electronic Assembly Metrics

123.8

554

123.8

Non-Volatile Memory (KBytes)

554

10

Volatile Memory (KBytes)

10

11

Package Connections per sq.cm of Package Area

Die Area (sq.mm)

11

System Totals

Die Area/Package Area Ratio

Number of Package Connections

Main Electronics

Assembly Name

Package Area (sq.mm)

IC Package Count

Main Board

General Area

Substrate Tiling Density (die area / substrate area)

IC Die Count

IC Metrics

0.01

1079.3

0.11

51.3

0

0

1079.3

0.11

51.3

0

0

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 547

Electronic Costs Breakdown Estimated Cost of Electronics

(Includes Subsystem Electronics)

$39.10

Passive Components 7%

Connector Components 7%

Substrates 4%

Insertion 4%

Card Test 2%

Small Active Components 4% Modular & Odd Components 1%

Integrated Circuits 71%

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 548

Vendor IC Cost Distribution Pkg. Brand Infineon Unknown Freescale NXP Semiconductor STMicroelectronics

Cost $21.67 $4.07 $1.13 $0.96 $0.14

Freescale 4%

NXP Semi 3%

STMicro 1%

Unknown 15%

Infineon 77%

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 549

Non-Electronic Cost Estimate Subsystem

Part ID No.

Qty

Enclosures

3 4

1 1

Bottom Aluminum Enclosure Top Enclosure

Cast Molded + Pulls

Aluminum PC + GF30

Miscellaneous

1 2

1 1

Label Label

Die-Cut + Printed Die-Cut + Printed

Plastic + Adhesive Plastic + Adhesive

Total

Fabrication Process

Material

Dimensions (mm) 151.1 x 113.64 x 8.99 132.94 x 113.03 x 25.53 69.82 x 32.32 x 0.07 45.9 x 13.33 x 0.08

Weight Est'd Cost Est'd (grams) Each Extended Cost 116.40 105.10

2.450 5.140

2.450 5.140

0.30 0.10

0.090 0.040

0.090 0.040

Estimated Cost

4

Copyright © 2015, TechInsights

7 June 2017

Description

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

$7.72

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 550

Final Ass’y Labor & Test Cost Estimate

Final Assembly & Test Made in Number of parts Est'd number of steps Est'd time (seconds)

Est'd final assembly cost Est'd final test cost

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

Hungary 6 20 69 $ $

0.17 0.50

www.LeanDesign.com

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 551

Cost Summary Estimated Cost Totals Main Electronic Assemblies Non-Electronic Parts Final Assembly & Test

Total

$ $ $

39.10 7.72 0.67

$ 47.50

Cost Total Notes: Estimated final assembly cost includes labor only. Total cost does not include Non-recurring, R&D, G&A, IP licensing fees/royalties, software, sales & marketing, distribution. Assumes fully scaled production.

Final Assembly & Test 1%

Non-Electronic Parts 16%

Main Electronic Assemblies 83%

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 552

Cost Estimation Process (Overview & Discussion) Cost modeling is tricky business. Multiple variables affect the actual production costs a manufacturer will experience, including development expenses, unit volumes, supply-and-demand in component markets, die yield-curve maturity, OEM purchasing power, and even variations in accounting practices. Different cost modeling methods employ different assumptions about how to handle these and other variables, but we can identify two basic approaches: that which seeks to track short-term variations in the inputs to the production process, and that which strives to maintain comparability of the output of the model across product families and over time. TechInsights’ philosophy in cost modeling is to emphasize consistency across products and comparability over time, rather than to track short-term fluctuations. During the past eight years, we have developed an estimation process that, while necessarily lacking an insider’s knowledge of the cost factors that impact any one manufacturer, is reasonably accurate in its prediction of unit costs in high-volume production environments. We do not claim that the model will produce the “right” answer for your firm’s environment. However, TechInsights does give customers a key analytical tool with a complete set of data in our Bill of Materials (BOM). The BOM allows readers to 1) scrutinize the assumptions behind our cost model and 2) modify the results based on substitution of their own component cost estimates where they have better information based on inside knowledge. Our estimation process decomposes overall system cost into three major categories: Electronics, Mechanical, and Final Assembly. We begin by creating a complete electronics bill-of-materials (BOM). Each component from the largest ASIC to the smallest discrete resistor is entered into a BOM table with identifying attributes such as size, pitch, I/O count, package type, manufacturer, part number, estimated placement cost, and die size (if the component is an IC). Integrated circuit costs are calculated from measured die area. Using assumptions for wafer size, process type, number of die per wafer, defect density, and profit margin in combination with die area, an estimate of semiconductor cost is derived. Costs for discrete components and interconnect are derived from assumption tables which relate BOM line items to specific cost estimates by component type and estimates for part placement costs are included. For LCD display costs, we employ a model which tabulates expected cost from measurements of glass area, LCD type, and total pixel resolution. When market costs are available from alternative sources, LCD panel costs are taken from and referenced to these sources. Costs of non-electronic components such as molded plastic enclosures and metallic components are measured in terms of weight, size, thickness, type of material, and complexity to arrive at their estimated cost. Other system items such as optics, antennae, batteries and displays are costed from a set of assumption tables derived from a combination of industry data, average high volume costs, and external sources. For final assembly, we re-build the torn-down product, tabulating stepwise assembly times as the reconstruction proceeds, to reach a total assembly time. Using a labor rate assumption for the country of origin, we then calculate final assembly cost. The three major categories for system cost contributors can be broken down into the subcategories of ICs, other electronics parts, displays, batteries (as appropriate), camera modules, electronics assembly, non-electronic elements, and final assembly. By adding the cost estimates for each of these subcategories, an overall estimated cost is derived for the system under evaluation. Product packaging and accessories (CDs, cables, etc.) are also documented and estimated for their contribution to total cost as appropriate. We believe our cost estimates generally fall within 15 percent of the “right answer,” which itself can vary depending on the market and OEM-specific factors mentioned earlier. While the TechInsights cost model is imperfect, it yields important insights into technology and business dynamics along with good first-order contributions to system cost by component type. Additionally, the consistency of approach and gradual modification to assumptions (smoothing out frequently-shifting pricing factors) hopefully yields a credible, but user-modifiable, view of OEM high volume cost-to-produce. Please feel free to contact us at [email protected] with any comments, questions, or proposed corrections with respect to our cost estimates. We welcome your input. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 553

Metrics (Overview & Discussion) In our product teardowns, we gather a series of metrics for product profiling and comparison. Some metrics focus on system characteristics such as total silicon area, total system semiconductor storage capacity, and total connection count. Other metrics reflect more subtle aspects of electronics assembly such as connection density, average component I/O count, and silicon tiling density. Taken as a whole, the metrics allow deeper comparison and benchmarking across multiple disciplines and multiple products. Key metrics we gather on products are described below along with their definitions and what they tend to say about the system under study. Most metrics can be used both in comparing similar products for benchmarking purposes or for quantifying differences in levels of complexity between dissimilar product types. Data fall into two categories; either “raw” measured data or ratios of these measured data sets. Total Silicon Area : This metric describes the total area of silicon as measured from X-ray or direct measurement of ICs. The area is an expression of the enclosed bare die area and excludes packaging area. The aggregate silicon area is a good benchmark to show how integrated a design might be when making comparisons to similar systems. Total silicon area also reflects the major cost driver for most systems we examine. Silicon Tiling Density : Ratio of Total Silicon Area to total printed circuit board “projected” area (i.e. the simple board area and not the cumulative surface area of both sides of the board). This metric directly reflects the level of efficiency and aggressiveness in integrated circuit packing and placement. Single digit Silicon Tiling Density is typical but silicon coverage of 10% - 20% has been seen in some of the most advanced products we have examined. Higher Tiling Densities often correspond with the use of chip scale packaging (CSPs) or other small form-factor IC packaging technologies. High density circuit boards are also often a supporting technology. Number of Parts : Total component count including ICs, passives, modules, connectors, etc., each separated out in our reporting. Number of Connections : The total number of connections corresponds to the total number of interconnects introduced by the aggregate component set and reflects any electrical connection observed (solder joints, adhesive interconnect, or connector terminal interfaces). Opportunity Count : Opportunity Count is the total number of parts plus the total number of connections; the name reflects that each of these constituent elements represents an opportunity for failure. A high opportunity count means more complex and riskier electronics assembly. Average Pin Count (APC) : Ratio of total number of component terminals to total number of parts, at the system level. This metric reflects the ‘average’ terminal complexity of the components and often provide a signature of integration level and/or “digital-ness” of the overall product. Low APCs reflect a high number of discretes or other low-pincount devices often characteristic of analog circuitry. Conversely, high APCs are characteristic of highly integrated, high-pincount assemblies, often those composed largely of digital integrated circuits. Connection Density : This metric is a ratio of the total Number of Connections to total printed circuit board assembly area, in units of connections per sq. inch. The metric provides data related to the Silicon Tiling Density above, but with an emphasis on complexity of I/O interconnect. For example, with a fixed Connection Density, high tiling density of low-pincount memory chips is more readily achieved than comparable silicon tiling of high pincount logic. Part Density : This metric is a ratio of the total Number of Parts to total printed circuit board assembly area, in units of components per sq. inch. The metric provides data related to the Silicon Tiling Density and Connection Density as described above, but with an emphasis on density and complexity of component packing efficiency. For example, low Part Density of high-pincount devices can pose an equal challenge in Connection Density to high Part Density of low-pincount devices. High Part Density does reflect challenges in surface mount assembly in terms of (typically) precision of placement, number of placements, and engineering of part clearances. Routing Density (heuristic estimate) = 3*(Average Pin Count)*√Part Density. The Routing Density metric is an empirically derived relationship that characterizes the wiring density of the interconnect used to support the interconnection of components in a planar electronic assembly (i.e. the circuit board). Architectural issues such as bussing or other factors affecting the regularity of wiring impact the actual Routing Density needed to support a given application, but the metric provides a ready measure of wiring complexity. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 554

Appendix

Click Here to Return to Cost Analysis Page 137

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

555

Deep Dive Report BMW i3 Hybrid Pressure Refueling ECU 2253

Report #15900-150204-RRb Product Description This report concerns the Hybrid Pressure Refueling Electronic Control Unit (ECU) of the 2014 BMW i3. This device monitors the vehicle’s current operating condition via a pressure temperature sensor in the fuel tank and then controls the pressure reduction by opening a valve. The Hybrid Pressure Refueling ECU then activates the fuel filler flap, which allows the vehicle to be refueled. This device features a Renesas #uPD70f3548 32-bit microcontroller, NXP semiconductor #TJA1043T high-speed CAN transceiver, Atmel #ATA6663 LIN transceiver, ON Semiconductor #NCV4299 150 mA lowdropout voltage regulator, and STMicroelectronics #VND5050AJ-E double-channel high side driver with analog current sense.

DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information. Copyright © 2015, TechInsights. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of TechInsights.

www.teardown.com [email protected]

Product Overview Product Description

Integrated Circuit Metrics

Product Type

Automotive

IC Die Count

9

Brand

BMW

IC Package Count

8

Product Name & Model # i3 Hybrid Pressure Refueling ECU Official Release Date

5/2/2014

Weight (grams) Product Dimensions (mm)

69.7 (Measured) 99.62 x 63.6 x 31.84 (Measured at Longest/Widest/Thickest Points)

Product Features Connectivity

NXP Semiconductor #TJA1043T High-Speed CAN Transceiver, Atmel #ATA6663 LIN Transceiver

Processor

Renesas #uPD70f3548 32-Bit Microcontroller

Voltage Regulation

ON Semiconductor #NCV4299 150 mA LowDropout Voltage Regulator

Cost Metrics Retail Price Total Manufacturing Cost

$23.38

Electronics Cost

$21.67

Manufacturing Cost Breakdown Integrated Circuits

$12.78

54.7%

Modules, Discretes & Connectors

$6.64

28.4%

Substrates

$0.84

3.6%

Component Insertion

$0.99

4.2%

Card Test

$0.42

1.8%

Non-Electronic Parts

$1.48

6.3%

Final Assembly & Test

$0.23

1.0%

Total $23.38 100.0%

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 557

Block Diagram 4 - STMicroelectronics #VND5050AJ-E Double-Channel High Side Driver w/ Analog Current Sense 3 - STMicroelectronics #VND5160J-E Double-Channel High Side Driver

1 - Renesas #uPD70F3548 32-Bit Microcontroller

2 - NXP Semiconductor #TJA1043T CAN Transceiver

7 - Atmel #ATA6663 LIN Transceiver

Vehicle Wiring Connector

Estimated block diagram based on observation of this specific product implementation, manufacturer’s data sheets where available, and best engineering judgment. Certain details of the interface circuitry are not reflected in this block diagram. Partitioning and connectivity are speculative.

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 558

Product Label

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 559

Exterior Features

Connects to Range Extender Module

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 560

Exterior Features

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 561

Major Components (Side 1)

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 562

Major Components (Side 2)

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 563

Component Arrangement

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 564

Teardown Sequence

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 565

Main Board (Side 1)

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 566

Main Board (Side 1 IC Identification)

4 - STMicroelectronics #VND5050AJ-E Double-Channel High Side Driver

3 - STMicroelectronics #VND5160J-E Double-Channel High Side Driver

1 - Renesas #uPD70F3548 32-Bit Microcontroller

5 - STMicroelectronics #S3VN04DP Power MOSFET (2-Die Pkg.) 10 - Unknown #Unknown LDO?

2 - NXP Semiconductor #TJA1043T CAN Transceiver

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 567

Main Board (Side 2)

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 568

Main Board (Side 2 IC Identification)

6 - ON Semiconductor #NCV4299 150 mA LDO Regulator 7 - Atmel #ATA6663 LIN Transceiver

Grid = 1 cm Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 569

Main Board Cross-Section

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 570

Substrate Data Substrates Assembly Name Main Board

Manufacturer

Helbako

Core Material

FR4

Copyright © 2015, TechInsights

7 June 2017

Mfg. Technology

4 Layer Conventional FR4 / HF

Area (cm²)

Layers

4

45.6

Min. Trace Pitch (mm) 0.45

Min. Trace Width (mm) 0.13

Copyright © Munro & Associates, Inc. 2015

ThruVia Land Dia (mm) 0.60

ThruVia Hole Dia (mm)

BlindVia Land Dia (mm)

0.30

www.LeanDesign.com

BlindVia Hole Dia (mm)

Thickness (mm) 1.7

Routing Density

Estimated Costs

20.4 $

0.84

BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 571

Integrated Circuit Components Package Info

Estimated Costs

Die Info

Location Pkg Ref. #

Pkg Qty

Brand Name

Main Board, Side 1

1 2 3 4 5

1 1 1 1 1

Renesas NXP Semiconductor STMicroelectronics STMicroelectronics STMicroelectronics

uPD70F3548 TJA1043T VND5160J-E VND5050AJ-E VNS3NV04DP-E

32-Bit Microcontroller CAN Transceiver Double-Channel High Side Driver Double-Channel High Side Driver Power MOSFET

Main Board, Side 2

6 7

1 1

ON Semiconductor Atmel

NCV4299 ATA6663

Main Board, Side 1

10

1

Unknown

Unknown

Totals

8

Form

Pin Count

Length (mm)

Width (mm)

Height (mm)

Die Ref #

Die Qty

Length (mm)

Width (mm)

QFP SOP SOP SOP MCP - 2 Chips

100 14 12 12 8

13.87 8.72 4.86 4.91 4.95

13.84 3.95 3.71 3.73 3.71

1.57 1.55 1.50 1.49 1.41

1.1 2.1 3.1 4.1 5.1

1 1 1 1 2

Renesas NXP Semiconductor STMicroelectronics STMicroelectronics STMicroelectronics

70F4002 TJA1043T VNG2A None VN56A

32-Bit Microcontroller CAN transceiver Double-Channel High Side Driver Double-Channel High Side Driver MOSFET

6.52 2.50 2.95 3.82 2.32

5.51 1.65 1.48 1.84 1.67

$ 10.780 $ 10.780 $ 0.283 $ 0.283 $ 0.272 $ 0.272 $ 0.399 $ 0.399 $ 0.211 $ 0.422

150 mA LDO Regulator LIN Transceiver

SOP SOP

14 8

8.77 4.93

3.71 3.63

1.55 1.41

6.1 7.1

1 1

ON Semiconductor Atmel

NCV4299A ATA6863

150 mA LDO Regulator LIN Transceiver

2.81 1.64

2.61 1.22

$ $

0.433 $ 0.143 $

0.433 0.143

Unknown

SOP

6

3.01

1.46

0.87

10.1

1

Unknown

T305B

Unknown

0.58

0.56

$

0.046 $

0.046

Part Number

Pkg Description

174

Brand Name

Part Number

9

Description

Each

Total

$12.78

Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.

Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 572

Modular Components Estimated Costs

Package Location

Main Board, Side 1

TOTALS

Copyright © 2015, TechInsights

7 June 2017

Qty

1

Brand Name

NDK

Part Number

NX8045GE

Description

Crystal: Ceramic

1

Pin Count

Length (mm)

Width (mm)

2

7.11

4.41

2

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

Each

Total

$ 0.200 $ 0.200

$0.20

BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 573

Active Discrete Components Package Location

Qty

Estimated Costs

Functional Description Form

Top Marking

Pin Count

Length (mm)

Width (mm)

Each

Total

Main Board, Side 1

1 4 5

Small Active Small Active Small Active

MOSFET Diode, SMT Transistor, Small

QJ463 Siliconix Logo AA(TRIANGLE) W38B SG 39 General Semiconductor 37 75 V3, 74 s 3N, 31 WE s, 1FW 3d, tAN 41,

5 2 3

4.54 4.06 2.84

4.30 2.49 1.30

$0.280 $0.015 $0.030

$0.280 $0.060 $0.150

Main Board, Side 2

2 1 2 6

Small Active Small Active Small Active Small Active

MOSFET MOSFET Transistor, Small Transistor, Small

7NV04P ST Logo GF349 SG 1325 N ST4140 2D WE s 37 75 V3, Y6 9, 1FW 39, YA s 3N

4 4 3 3

6.48 6.56 1.99 2.72

3.36 3.36 1.49 1.19

$0.440 $0.440 $0.030 $0.030

$0.880 $0.440 $0.060 $0.179

TOTALS

21

Copyright © 2015, TechInsights

7 June 2017

64

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

$2.05

BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 574

Passive Discrete Components Estimated Costs

Package Location

Qty

Functional Description Form

Each

Total

Main Board, Side 1

3 1 1 1 1 4 16 58

Small Passive Misc Coil Capacitor Capacitor Small Passive Small Passive Small Passive

Diode Array Fuse SMT, Small Electrolytic, Small Electrolytic, Small Cap, Res, Ferrite Array Res Cap, Res, Ferrite

6 2 4 2 2 8 2 2

$0.040 $0.085 $0.750 $0.050 $0.060 $0.007 $0.004 $0.004

$0.120 $0.085 $0.750 $0.050 $0.060 $0.030 $0.064 $0.232

Main Board, Side 2

3 22 48

Small Passive Small Passive Small Passive

Cap, Res, Ferrite Array Res Cap, Res, Ferrite

6 2 2

$0.007 $0.004 $0.004

$0.022 $0.088 $0.192

TOTALS

Copyright © 2015, TechInsights

7 June 2017

Pin Count

158

Copyright © Munro & Associates, Inc. 2015

366

www.LeanDesign.com

$1.69

BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 575

Connectors Estimated Costs

Package Location

Qty

Main Board, Side 1

TOTALS

Copyright © 2015, TechInsights

7 June 2017

1

1

Form

Connector: Vehicle Wiring

Pin Count

Length (mm)

Width (mm)

Each

Total

26

51.81

29.86

$2.700

$2.700

26

Copyright © Munro & Associates, Inc. 2015

$2.70

www.LeanDesign.com

BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 576

Electronic Assembly Metrics

Assembly Weight (grams)

182.32

Avg. Pin Count

182.3

4

Connection Density (Connections/sq.cm)

4

45.6

Component Density (Components/sq.cm)

45.6

System Totals

Number of Connections

Circuit Area (sq.cm)

Main Board

Number of Components

Metal Layers

Main Electronics

Assembly Name

Substrate Area (sq.cm)

General Area

Routing Density (cm of routing per sq.cm of substrate)

Electronic Assembly Metrics by Assembly

20.4

189

632

4.2

13.9

3.3

36.80

189

632

4.1

13.9

3.3

36.80

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 577

Electronic Assembly Metrics

Card Test

Insertion

Substrates

Connector Components

Passive Components

Assembly Name

Total

Main Electronics

Modular & Odd Form Components

Integrated Circuits

General Area

Small Active Components

Electronics Costs by Assembly

Main Board

$

21.67

$

12.78

$

0.20

$

2.05

$

1.69

$

2.70

$

0.84

$

0.99

$

0.42

System Totals

$

21.67

$

12.78

$

0.20

$

2.05

$

1.69

$

2.70

$

0.84

$

0.99

$

0.42

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 578

Electronic Assembly Metrics

IC Package Count

IC Connections

Modular/Odd Form Components

Modular/Odd Form Component Connections

Small Active Components

Small Active Component Connections

Passive Components

Passive Component Connections

Connectors

Connector Connections

Opportunities

Counts by Assembly

Main Board

8

174

1

2

21

64

158

366

1

26

821

System Totals

8

174

1

2

21

64

158

366

1

26

821

General Area

Main Electronics

Assembly Name

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 579

Electronic Assembly Metrics

68.9

174

68.9

Non-Volatile Memory (KBytes)

174

8

Volatile Memory (KBytes)

8

9

Package Connections per sq.cm of Package Area

Die Area (sq.mm)

9

System Totals

Die Area/Package Area Ratio

Number of Package Connections

Main Electronics

Assembly Name

Package Area (sq.mm)

IC Package Count

Main Board

General Area

Substrate Tiling Density (die area / substrate area)

IC Die Count

IC Metrics

0.02

335.9

0.20

51.8

0

0

335.9

0.20

51.8

0

0

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 580

Electronic Costs Breakdown Estimated Cost of Electronics $21.67 Connector Components 12%

Substrates 4%

Insertion 5%

Card Test 2%

Passive Components 8%

Small Active Components 9%

Integrated Circuits 59% Modular & Odd Components 1%

NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights

7 June 2017

Copyright © Munro & Associates, Inc. 2015

www.LeanDesign.com

BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 581

Vendor IC Cost Distribution Pkg. Brand Renesas STMicroelectronics ON Semiconductor NXP Semiconductor Atmel Unknown

Cost $10.78 $1.09 $0.43 $0.28 $0.14 $0.05

ONSemi 3%

NXP 2%

Atmel 1% Other