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BMW i3 Cost Analysis Zone 5: System Electronics
7 June 2017
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Disclaimers Legal Disclaimer: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by Munro & Associates, Inc. from generally available data. Munro & Associates, Inc. believe these estimates reflect the probable costs. The actual producer did not supply the data, and therefore the actual costs may differ from these estimates. Furthermore, Munro & Associates, Inc. extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information. Copyright © 2015 Munro & Associates, Inc. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of Munro & Associates Inc. under penalty of law. Technical Disclaimer: The goal of this analysis is to establish a should cost value for manufacturing the vehicle and its sub-systems. These cost totals do not include tooling, Engineering Research and Development (ER&D), testing and calibration, logistics, or profit. Manufacturing process assumptions, such as manual assembly vs. automation or mold cavity numbers, were selected based on an annual volume of 20,000. 7 June 2017
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Subject
Page
Disclaimers
2
Description of Report Content
20
Data Overview
21
Interpreting Data
29
Cost Analysis
35
Zone 5: Electronics Overview
36
Zone 5: Electronics
37
System Electronics Overview
38
System Electronics
39
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Subject
Page
Infotainment Unit and Bracket Asm
40
Infotainment Unit Installation
69
IP Screw Cover
71
Central Information Display Installation
73
Passenger A-Pillar Foam Asm
75
Passenger A-Pillar Foam Installation
82
Passenger A-Pillar Speaker Mount Asm
84
Passenger A-Pillar Speaker Mount Installation
91
Passenger A-Pillar Speaker Asm
93
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Subject
Page
Passenger A-Pillar Speaker Installation
100
Driver A-Pillar Foam Asm
102
Driver A-Pillar Foam Installation
109
Driver A-Pillar Speaker Mount Asm
111
Driver A-Pillar Speaker Mount Installation
118
Driver A-Pillar Speaker Asm
120
Driver A-Pillar Speaker Installation
127
Back-up Antenna Installation
129
Horn and EDME Mounting Bracket Asm
131
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Subject
Page
EDME and Horn Installation
136
KAFAS and Controller Mounting Bracket Asm
138
KAFAS and Controller Installation
140
Remote Control Receiver and Bracket Installation
142
Side Wave Traps and Filter Installation
144
Telematic Communication Box and Bracket Asm
146
Bracket Installation
186
Touch Box Control Unit Installation
188
Proximity Sensor Installation
190
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Subject
Page
Parking Maneuvering Assistant Installation
192
Antenna Amplifier Asm
194
Assemble Antenna Amplifier
207
Body Wire Harnesses Overview
209
Body Wire Harnesses
210
Body Domain Controller and Bracket Asm
211
Fuse Box Installation
256
PDC Mounting Tray Asm
258
PDC Mounting Tray Installation
265
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Subject
Page
Fuse Box Bracket Asm
267
Fuse Box Bracket Installation
274
Power Distribution Center Asm
276
Cover, Power Distribution Center
292
Main Wire Harness Installation
294
Driver Underbody Wire Harness Installation
296
12V Battery and Bracket Asm
298
12V Battery and Bracket Installation
322
Positive Battery Cable Wire Harness Installation
324
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Subject
Page
Negative Battery Cable Installation
326
Ground, Chassis to Power Module Installation
328
Ground, Motor Asm to Power Module Installation
330
Ground, Power Module to Chassis Installation
332
Ground, Rear X Brace To Heat Shield Installation
334
Ground, Chassis to Exhaust Heat Shield Installatio
336
Ground, Chassis to Engine Installation
338
Ground, AC Compressor To Motor Installation
340
Ground, Chassis to Motor Installation
342
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Subject
Page
Steering Column Ground Strap Installation
344
Appendix Reports
346
TechInsights Electronics Reports
347
Munro & Associates Wire Harness Reports
872
Technical References
1290
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Design Profit® Process • The Design Profit® Software is used to provide a detailed cost map analyzing every subassembly, part, operation, & tool in the manufacturing process. • The various symbols shown below are used in a hierarchical diagram to quantify & compare design and manufacturing efficiencies & costs. Parts Subassemblies Pre-Processed Parts
Tools
Fastening Operations Non-Value Added Operations
Parallel Processing
Multi-Touches Material Modifications
Repeated Operations Inspections Notes Process Steps
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Design Profit® Process
Each symbol is created by filling out a properties window. Penalty conditions and other information related to the symbol are assigned, in order to calculate the effect of handling difficulties on assembly time.
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Design Profit® Process Components to be Assembled
Part to Fabricate
Fabrication Operations
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Assembly Operations Above is a Design Profit cost map. The top horizontal line of symbols indicates the assemblies, parts, and assembly processes used to create the above parent assembly. Each of the symbols below a parent are analyzed in detail. Total costs are then rolled-up to the parent symbol. The vertical string of symbols on the left shows the details of each step and work cell in the fabrication process. The vertical string of symbols on the right shows the details of each step and work cell in the assembly process. Copyright © Munro & Associates, Inc. 2015
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Assumptions The following assumptions were made for the cost analysis: • All processing was documented in the Design Profit software. • All raw material prices are based on quotes and published information. • All manufacturing processes include the man and machine to establish an hourly cost for the manufacturing work cell for each process and country utilized in creating the vehicle. These work cell rates are used along with calculation of cycle time to generate the process costs of components. Machine rates are developed through an internal model, accounting for all aspects of the primary and secondary equipment for the process. Operator rates are based on the specific country, and related industry labor rates. Adjustments are made for the number of operators in the workcell. • Common/basic components were costed as commodity items. These included: bearings, seals, fasteners, and electronic components. • Bearings/Seals/Fasteners are compared to numerous costed bills of materials to establish a purchased price. • Electronic component costs are based on the costed bill of materials on hand, quote requests, and published information. Component pricing is run through trend lines to establish a cost for the appropriate targeted volumes. • Machining cycle times are calculated using operations based on speeds and feeds from the standard machinist handbook. 7 June 2017
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SG&A Calculations
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Medium High
• The SG&A mark-up used for fabricated parts raw material and processing costs is a variable rate based on the technology level associated with the system. A table of the standard percentage markups is shown to the right. Low technology is typical of a system mostly consisting of simple parts, such as basic stampings and injection molded parts. High technology is typically a system with complex automated assembly, high tolerance machined parts, and complex electronic systems, or more standard processes applied to new applications. Cutting edge is typically a system that uses first to market application of an advanced technology.
Cutting Edge
• The SG&A mark-up used for commodity parts is a flat 3.0% typically used as a standard industry value. This mark-up accounts for the purchasing and handling of commodity parts.
Low
Sales, General, and Administration:
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Technology SG&A Level Mark-Ups 1 6.0% 2 7.0% 3 8.0% 4 9.0% 5 10.0% 6 11.0% 7 12.0% 8 13.0% 9 14.0% 10 15.0% 11 16.0% 12 17.0% 13 18.0% 14 19.0% 15 20.0% 16 21.0% 17 22.0% 18 23.0% 19 24.0% 20 25.0% 15
Defining Q Burden Quality Burden (Q Burden) is the additional cost carried by each good product unit, to account for the actions and materials used to correct defects in parts (as received or produced) or in production processes. Q Burden is a key component of the Cost of Quality and may be considered equivalent to failure costs. Q Burden reflects the variable cost of poor quality. The probability of a defect can be estimated from industry averages or can be based on company statistics. Q Burden is calculated by adding the incident and disposition costs for each defect and multiplying the sum by the probability of a defect occurrence. The incident is the set of actions that are taken immediately upon the discovery of a real or suspected defect. The disposition is the actions to deal with the defective production after the incident. Q Burden does not include: • Base overhead associated with the quality organization (the amount required to assure compliance with industry and customer standards) • Process documentation generally needed in order to communicate requirements and standards for production, inspection, and testing • Inspection and test equipment depreciation and consumables (unless needed for troubleshooting defective product) • Defect prevention activity (investment in new equipment, process improvement, mistake-proofing activities, redesign, lean/six sigma activities, etc.) 7 June 2017
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Die Casting Estimates
The die casting material costs and cycle times are calculated in an internal parametric based cost estimating sheet, and outputs are fed into Design Profit to develop final fabrication costs. Since die casting is a more material driven primary fabrication process, the cells to the right include general dimensional values and material selections. 7 June 2017
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Injection Molding Estimates
The injection molding material costs and cycle times are calculated in an internal parametric based cost estimating sheet, and outputs are fed into Design Profit to develop final fabrication costs. Since injection molding is a more complex material driven primary fabrication process, the cells to the right include detailed dimensional values and material selections. 7 June 2017
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Stamping Estimates
The stamping material costs and cycle times are calculated in an internal parametric based cost estimating sheet, and outputs are fed into Design Profit to develop final fabrication costs. Since stamping is a more machine driven primary fabrication process, the cells to the right include dimensional values related to stations operating in the press, along with material selections. 7 June 2017
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Description of Report Content Zone Report Outline: • Zone Information – Zone Overview – Zone Executive Summary
• Chapter Information – – – –
Chapter Overview Eye Catching Features Executive Summary Repeating Series of Sets of Costing Detail Pages • • •
Assembly Details (Set of 3 Pages) Part Details (Set of 2 Pages) Assembly Process (Set of 2 Pages)
• Appendix Information – TechInsights Reports •
Electronic Component Costing Details
– Munro & Associates Wire Harness Reports • •
Wire Harness Costing Details
Zones and Chapters are meant to be similar in structure to a system and sub-system breakdown, however, they may or may not represent specific Original Equipment Manufacturer (OEM) organizations. For example, the Zone 7: Driveline contains the chapters for Motor, Gear Box and Half Shafts.
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Data Overview – Executive Summaries
Executive Summary: Page 1 of 1
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At the beginning of each Zone report and beginning of each Chapter, there will be a Executive Summary page. This page provides the high level totals of the Zone or Chapter, based on the following detailed data. The upper part of the summary table shows typical metrics totaled from the assembly and fabrication processes, including part counts, operation counts, timing, and weights. The lower part of the table shows the total costs incurred from these processes.
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Data Overview – Assembly Details
Assembly Details: Page 1 of 3
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As the report progresses through the breakdown hierarchy of the Chapter, when an assembly is analyzed, three detail pages will be provided. The first page, shown to the left, is a high level overview. The top left photo is the independent assembly, placed on a grid for a reference perspective. The bottom left photo is the assembly in location, once it is assembled to its parent assembly. The top right is a list of the parent assemblies of this assembly. The bottom right is a table summarizing total metrics and costs related to the completed assembly. www.LeanDesign.com
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Data Overview – Assembly Details
Assembly Details: Page 2 of 3 •
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Note for large assemblies with many line items this page could become multiple pages. Copyright © Munro & Associates, Inc. 2015
The second assembly detail page, shown to the left, is the detailed breakdown of the totals for each line item within the current assembly. The line items within the breakdown will include assemblies, parts, and assembly processes. This makes these tables effectively a combined Bill of Materials (BOM) and Bill of Process (BOP) for that assembly. The top table provides the typical metrics totaled from the assembly and fabrication process of each line item. The bottom table provides the total costs incurred from these processes. www.LeanDesign.com
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Data Overview – Assembly Details The third assembly detail page, shown to the left, is a detailed summary of the totals shown on the previous page. The upper part of the summary table shows typical metrics totaled from the assembly and fabrication process, including part counts, operation counts, timing, and weights. The lower part of the table shows the total costs incurred from these processes.
Assembly Details: Page 3 of 3
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Data Overview – Part Details
Part Details: Page 1 of 2
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As the report progresses through the breakdown hierarchy of the Chapter, when a part is analyzed, two detail pages will be provided. The first page, shown to the left, is a high level overview. The top left photo is the independent part, placed on a grid for a reference perspective. The bottom left photo is the part in location, once it is assembled to its parent assembly. The top right is a list of the parent assemblies of this part. The bottom right is a table summarizing total metrics and costs related to the completed part. www.LeanDesign.com
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Data Overview – Part Details The second part detail page, shown to the left, is the detailed breakdown of the totals for the raw materials and each process step to fabricate the part. The top table provides the typical fabrication process metrics and costs totaled for each step. The bottom table provides the total costs for raw material or purchased parts used in the fabrication process.
Part Details: Page 2 of 2 •
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Data Overview – Assembly Process Details
Assembly Process Details: Page 1 of 2
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As the report progresses through the breakdown hierarchy of the Chapter, when an assembly process is analyzed, two detail pages will be provided. The first page, shown to the left, is a high level overview. The top left are photos of the purchased parts utilized in the process, placed on a grid for a reference perspective. The bottom left photo is a view of the location, once the process is complete. The top right is a list of the parent assemblies of this process. The bottom right is a table summarizing total metrics and costs related to the process. www.LeanDesign.com
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Data Overview – Assembly Process Details
Assembly Process Details: Page 2 of 2 •
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Note for complex processes with many steps this page could become multiple pages. Copyright © Munro & Associates, Inc. 2015
The second assembly process detail page, shown to the left, is the detailed breakdown of the totals for the purchased parts and each assembly process step. The top table provides the typical assembly process metrics and costs totaled for each step. The bottom table provides the total costs for purchased parts used in the assembly process. If a electronic component or wire harness are in the list of purchased parts, then this page will also have a link to the accompanying report in the Appendix. www.LeanDesign.com
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Interpreting Data – Part Counts Summary tables, include three metrics related to part count. The first metric, “Parts” is the total quantity of parts. The second metric, “Fasteners” is the total quantity of fasteners, within that total part count, meaning that the fasteners count is a sub-total of the parts count. The third metric, “Part Numbers” is the total unique part instances in the total part count (this includes numbers for both main parts and fasteners).
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Interpreting Data – Operation Counts Summary tables, also include two metrics related to operation counts. The first “Steps”, is the total count of the operations required to complete an assembly, part, or assembly process. Operations counted in this total include handling of parts, movement of equipment or operators, handling of tools, fastenings of parts and assemblies, operations to add and remove material during the fabrication process, etc. The second “Fastenings” is the total count of the operations specifically related to fastenings components together, meaning that the fastening count is a sub-total of the steps count. 7 June 2017
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Interpreting Data – Fasteners vs. Fastenings Often it would be expected that the analysis would have the same number of fasteners to fastenings, however, that is not always the case. One scenario is shown to the right, where there are less fasteners, than fastenings. This is typical of welding operations or the application of sealant or adhesive, as there is not a standard bolt, nut, or clip to be counted as a fastener. A second scenario is where there are more fasteners, than fastenings. This is typical of a process that engages multiple fasteners at the same time, like a multi-head nut runner. 7 June 2017
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Interpreting Data – Right First Time Summary tables include “Right First Time” (RFT). This value states the probably that all the steps that total to this point in the process will be completed without an error. Naturally, as the number and complexity of steps required to complete the assembly, part, or assembly process increase, the RFT percentage will decrease. RFT is calculated using typical bestin-class PPM values for incident rates. However, even with high Sigma level processes, as the steps count increases greatly, the RFT percentage will decrease greatly.
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Interpreting Data – No Commodity Items in Assembly Process Some assembly processes will not require the use of commodity items in the process to fasten parts and assemblies. For example, the installation of the half shafts to the vehicle utilizes a press fit, and therefore does not require commodities, like bolts, nuts, or clips to fasten in place. When no commodities are required, the top left photos will be replaced with the standard statement shown on the left. Additionally there will be no weight or material cost / purchased parts cost present in the process summary.
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Interpreting Data – Low Q Burden
Some assembly and fabrication process steps that have few operations or operations with low PPMs of defects, will often display $0.00 in Q Burden. This is simply because the Q Burden value for that step in the process is less than one cent. However, this fraction of a cent of cost will be rolled-up to any parent part or assembly for these processes and added to its totals.
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Cost Analysis
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Zone 5: Electronics Overview Zone 5 contains system electronics and the body wiring harnesses. The system electronics is comprised of infotainment, center display, rear view camera, telematics communication, audio system, park/maneuver assist modules. The wiring system contains all of the harnesses associated with the typical 12 volt systems used through out the vehicle. The harness group also contains the 12 volt battery and power distribution box. All major components were costed in detail, while prices were applied to commodity items (i.e. seals, fasteners, latches, and seat belts). Estimates are based on actual parts. Photos: Background on 100mm grid paper.
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Zone 5: Electronics Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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System Electronics Overview The electronics system primarily contains the 12 volt systems within the vehicle. The main components in the group include: infotainment, central display and telematics communication modules. Additional modules within the group include RF transceivers, touch box control unit, wave trap, suppression module, fuel tank depressurization module, rear view camera module park maneuver (assist) module and audio components. A majority of the modules were housed in injection molded housings except the infotainment unit and rear view camera module which were in metal housings. All major components were costed in detail, while prices were applied to commodity items (i.e. seals, fasteners, latches, and seat belts). Estimates are based on actual parts. Photos: Background on 100mm grid paper.
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System Electronics Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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Infotainment Unit and Bracket Asm \... \Zone 5 Electronics \System Electronics \Infotainment Unit and Bracket Asm
Assembly Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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Infotainment Unit and Bracket Asm
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Infotainment Unit and Bracket Asm Detailed Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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Bracket Asm, Infotainment Unit and Bracket Asm \... \System Electronics \Infotainment Unit and Bracket Asm \Bracket Asm, Infotainment Unit and Bracket Asm
Assembly Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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Bracket Asm, Infotainment Unit and Bracket Asm
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Bracket Asm, Infotainment Unit and Bracket Asm Detailed Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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Bracket, Bracket Asm \... \Bracket Asm, Infotainment Unit and Bracket Asm \Bracket, Bracket Asm \Bracket Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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Bracket, Bracket Asm
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Assemble Bracket \... \Infotainment Unit and Bracket Asm \Bracket Asm, Infotainment Unit and Bracket Asm \Assemble Bracket
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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Assemble Bracket
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Retention Slider, Infotainment Unit Asm \... \Infotainment Unit and Bracket Asm \Retention Slider, Infotainment Unit Asm \Retention Feature Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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Retention Slider, Infotainment Unit Asm
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Assemble Bracket to Infotainment Unit \... \System Electronics \Infotainment Unit and Bracket Asm \Assemble Bracket to Infotainment Unit
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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Assemble Bracket to Infotainment Unit
Click Here for TechInsights Electronics Report on Digital Radio Module
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Optional Equipment System, Infotainment Unit & Bra \... \System Electronics \Infotainment Unit and Bracket Asm \Optional Equipment System, Infotainment Unit & Bra
Assembly Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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Optional Equipment System, Infotainment Unit & Bra
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Optional Equipment System, Infotainment Unit & Bra Detailed Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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Platform, Optional Equipment System Asm \... \Optional Equipment System, Infotainment Unit & Bra \Platform, Optional Equipment System Asm \Bracket Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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Platform, Optional Equipment System Asm
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Assemble Platform \... \Infotainment Unit and Bracket Asm \Optional Equipment System, Infotainment Unit & Bra \Assemble Platform
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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Assemble Platform
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Cover, Optional Equipment System Asm \... \Optional Equipment System, Infotainment Unit & Bra \Cover, Optional Equipment System Asm \Cover Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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Cover, Optional Equipment System Asm
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Assemble Cover \... \Infotainment Unit and Bracket Asm \Optional Equipment System, Infotainment Unit & Bra \Assemble Cover
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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Assemble Cover
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Assemble Labels \... \Infotainment Unit and Bracket Asm \Optional Equipment System, Infotainment Unit & Bra \Assemble Labels
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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Assemble Labels
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Assemble Infotainment Auxiliary Printed Circuit \... \System Electronics \Infotainment Unit and Bracket Asm \Assemble Infotainment Auxiliary Printed Circuit
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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Assemble Infotainment Auxiliary Printed Circuit
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Infotainment Unit Installation \... \Zone 5 Electronics \System Electronics \Infotainment Unit Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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Infotainment Unit Installation
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IP Screw Cover \... \System Electronics \IP Screw Cover \Screw Cover Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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IP Screw Cover
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72
Central Information Display Installation \... \Zone 5 Electronics \System Electronics \Central Information Display Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
73
Central Information Display Installation
Click Here for TechInsights Electronics Report on 10.2” Infotainment Display 7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
74
Passenger A-Pillar Foam Asm \... \Zone 5 Electronics \System Electronics \Passenger A-Pillar Foam Asm
Assembly Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
75
Passenger A-Pillar Foam Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
76
Passenger A-Pillar Foam Asm Detailed Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
77
Passenger A-Pillar Foam \... \Passenger A-Pillar Foam Asm \Passenger A-Pillar Foam \A-Pillar Foam Asm Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
78
Passenger A-Pillar Foam
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
79
Assemble Passenger A-Pillar Foam \... \System Electronics \Passenger A-Pillar Foam Asm \Assemble Passenger A-Pillar Foam
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
80
Assemble Passenger A-Pillar Foam
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
81
Passenger A-Pillar Foam Installation \... \Zone 5 Electronics \System Electronics \Passenger A-Pillar Foam Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
82
Passenger A-Pillar Foam Installation
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
83
Passenger A-Pillar Speaker Mount Asm \... \Zone 5 Electronics \System Electronics \Passenger A-Pillar Speaker Mount Asm
Assembly Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
84
Passenger A-Pillar Speaker Mount Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
85
Passenger A-Pillar Speaker Mount Asm Detailed Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
86
Passenger A-Pillar Speaker Mount \... \Passenger A-Pillar Speaker Mount Asm \Passenger A-Pillar Speaker Mount \Passenger A-Pillar Speaker Mount Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
87
Passenger A-Pillar Speaker Mount
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
88
Assemble A-Pillar Speaker Mount \... \System Electronics \Passenger A-Pillar Speaker Mount Asm \Assemble A-Pillar Speaker Mount
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
89
Assemble A-Pillar Speaker Mount
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
90
Passenger A-Pillar Speaker Mount Installation \... \Zone 5 Electronics \System Electronics \Passenger A-Pillar Speaker Mount Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
91
Passenger A-Pillar Speaker Mount Installation
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
92
Passenger A-Pillar Speaker Asm \... \Zone 5 Electronics \System Electronics \Passenger A-Pillar Speaker Asm
Assembly Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
93
Passenger A-Pillar Speaker Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
94
Passenger A-Pillar Speaker Asm Detailed Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
95
Passenger A-Pillar Speaker Mount, Passenger A-Pill \... \Passenger A-Pillar Speaker Asm \Passenger A-Pillar Speaker Mount, Passenger A-Pill \Passenger A-Pillar Speaker Mount Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
96
Passenger A-Pillar Speaker Mount, Passenger A-Pill
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
97
Assemble Passenger A-Pillar Speaker \... \System Electronics \Passenger A-Pillar Speaker Asm \Assemble Passenger A-Pillar Speaker
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
98
Assemble Passenger A-Pillar Speaker
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
99
Passenger A-Pillar Speaker Installation \... \Zone 5 Electronics \System Electronics \Passenger A-Pillar Speaker Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
100
Passenger A-Pillar Speaker Installation
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
101
Driver A-Pillar Foam Asm \... \Zone 5 Electronics \System Electronics \Driver A-Pillar Foam Asm
Assembly Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
102
Driver A-Pillar Foam Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
103
Driver A-Pillar Foam Asm Detailed Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
104
Driver A-Pillar Foam, Driver A-Pillar Foam Asm \... \Driver A-Pillar Foam Asm \Driver A-Pillar Foam, Driver A-Pillar Foam Asm \A-Pillar Foam Asm Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
105
Driver A-Pillar Foam, Driver A-Pillar Foam Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
106
Assemble Driver A-Pillar Foam \... \System Electronics \Driver A-Pillar Foam Asm \Assemble Driver A-Pillar Foam
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
107
Assemble Driver A-Pillar Foam
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
108
Driver A-Pillar Foam Installation \... \Zone 5 Electronics \System Electronics \Driver A-Pillar Foam Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
109
Driver A-Pillar Foam Installation
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
110
Driver A-Pillar Speaker Mount Asm \... \Zone 5 Electronics \System Electronics \Driver A-Pillar Speaker Mount Asm
Assembly Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
111
Driver A-Pillar Speaker Mount Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
112
Driver A-Pillar Speaker Mount Asm Detailed Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
113
Driver A-Pillar Speaker Mount, Driver APillar Spe \... \Driver A-Pillar Speaker Mount Asm \Driver A-Pillar Speaker Mount, Driver A-Pillar Spe \Driver A-Pillar Speaker Mount Asm Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
114
Driver A-Pillar Speaker Mount, Driver APillar Spe
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
115
Assemble Driver A-Pillar Speaker Mount \... \System Electronics \Driver A-Pillar Speaker Mount Asm \Assemble Driver A-Pillar Speaker Mount
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
116
Assemble Driver A-Pillar Speaker Mount
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
117
Driver A-Pillar Speaker Mount Installation \... \Zone 5 Electronics \System Electronics \Driver A-Pillar Speaker Mount Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
118
Driver A-Pillar Speaker Mount Installation
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
119
Driver A-Pillar Speaker Asm \... \Zone 5 Electronics \System Electronics \Driver A-Pillar Speaker Asm
Assembly Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
120
Driver A-Pillar Speaker Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
121
Driver A-Pillar Speaker Asm Detailed Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
122
Driver A-Pillar Speaker Mount, Driver APillar Spe \... \Driver A-Pillar Speaker Asm \Driver A-Pillar Speaker Mount, Driver A-Pillar Spe \Driver A-Pillar Speaker Mount Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
123
Driver A-Pillar Speaker Mount, Driver APillar Spe
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
124
Assemble Driver A-Pillar Speaker \... \System Electronics \Driver A-Pillar Speaker Asm \Assemble Driver A-Pillar Speaker
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
125
Assemble Driver A-Pillar Speaker
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
126
Driver A-Pillar Speaker Installation \... \Zone 5 Electronics \System Electronics \Driver A-Pillar Speaker Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
127
Driver A-Pillar Speaker Installation
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
128
Back-up Antenna Installation \... \Zone 5 Electronics \System Electronics \Back-up Antenna Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
129
Back-up Antenna Installation
Click Here for TechInsights Electronics Report on Back-Up Antenna Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
130
Horn and EDME Mounting Bracket Asm \... \Zone 5 Electronics \System Electronics \Horn and EDME Mounting Bracket Asm
Assembly Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
131
Horn and EDME Mounting Bracket Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
132
Horn and EDME Mounting Bracket Asm Detailed Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
133
EDME Mounting Bracke \... \Horn and EDME Mounting Bracket Asm \ EDME Mounting Bracke \ EDME Mounting Bracket Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
134
EDME Mounting Bracke
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
135
EDME and Horn Installation \... \Zone 5 Electronics \System Electronics \EDME and Horn Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
136
EDME and Horn Installation
Click Here for TechInsights Electronics Report on Electrical Digital Motor Asm 7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
137
KAFAS and Controller Mounting Bracket Asm \... \System Electronics \KAFAS and Controller Mounting Bracket Asm \KAFAS and Conroller Mtg Bracket Asm Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
138
KAFAS and Controller Mounting Bracket Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
139
KAFAS and Controller Installation \... \Zone 5 Electronics \System Electronics \KAFAS and Controller Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
140
KAFAS and Controller Installation
Click Here for TechInsights Electronics Report on Hybrid Pressure Refueling ECU Click Here for TechInsights Electronics Report on Driver Support System 7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
141
Remote Control Receiver and Bracket Installation \... \Zone 5 Electronics \System Electronics \Remote Control Receiver and Bracket Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
142
Remote Control Receiver and Bracket Installation
Click Here for TechInsights Electronics Report on Remote Control Receiver Asm 7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
143
Side Wave Traps and Filter Installation \... \Zone 5 Electronics \System Electronics \Side Wave Traps and Filter Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
144
Side Wave Traps and Filter Installation
Click Here for TechInsights Electronics Report on Wave Trap Click Here for TechInsights Electronics Report on Interference Suppression Filter Asm 7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
145
Telematic Communication Box and Bracket Asm \... \Zone 5 Electronics \System Electronics \Telematic Communication Box and Bracket Asm
Assembly Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
146
Telematic Communication Box and Bracket Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
147
Telematic Communication Box and Bracket Asm Detailed Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
148
Mounting Bracket Asm, Telematic Communication Box \... \System Electronics \Telematic Communication Box and Bracket Asm \Mounting Bracket Asm, Telematic Communication Box
Assembly Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
149
Mounting Bracket Asm, Telematic Communication Box
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
150
Mounting Bracket Asm, Telematic Communication Box Detailed Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
151
Mounting Bracket, Mounting Bracket Asm \... \Mounting Bracket Asm, Telematic Communication Box \Mounting Bracket, Mounting Bracket Asm \Mounting Bracket Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
152
Mounting Bracket, Mounting Bracket Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
153
Assemble Mounting Bracket \... \Telematic Communication Box and Bracket Asm \Mounting Bracket Asm, Telematic Communication Box \Assemble Mounting Bracket
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
154
Assemble Mounting Bracket
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
155
Fan Mounting Bracket, Mounting Bracket Asm \... \Mounting Bracket Asm, Telematic Communication Box \Fan Mounting Bracket, Mounting Bracket Asm \Fan Mounting Bracket Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
156
Fan Mounting Bracket, Mounting Bracket Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
157
Assemble Fan Mounting Bracket \... \Telematic Communication Box and Bracket Asm \Mounting Bracket Asm, Telematic Communication Box \Assemble Fan Mounting Bracket
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
158
Assemble Fan Mounting Bracket
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
159
Telematic Communication Asm, Telematic Communicati \... \System Electronics \Telematic Communication Box and Bracket Asm \Telematic Communication Asm, Telematic Communicati Assembly Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
160
Telematic Communication Asm, Telematic Communicati
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
161
Telematic Communication Asm, Telematic Communicati Detailed Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
162
Telematic Communication Box, Telematic Communicati \... \Telematic Communication Asm, Telematic Communicati \Telematic Communication Box, Telematic Communicati \Telematic Communication Box Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
163
Telematic Communication Box, Telematic Communicati
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
164
Battery Asm, Telematic Communication Box Asm \... \Telematic Communication Box and Bracket Asm \Telematic Communication Asm, Telematic Communicati \Battery Asm, Telematic Communication Box Asm
Assembly Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
165
Battery Asm, Telematic Communication Box Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
166
Battery Asm, Telematic Communication Box Asm Detailed Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
167
Battery Process \... \Telematic Communication Asm, Telematic Communicati \Battery Asm, Telematic Communication Box Asm \Battery Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
168
Battery Process
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
169
Assemble Telematic Communication Box Battery \... \Telematic Communication Box and Bracket Asm \Telematic Communication Asm, Telematic Communicati \Assemble Telematic Communication Box Battery
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
170
Assemble Telematic Communication Box Battery
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
171
Telematic Communication Box Lid, Telematic Communi \... \Telematic Communication Asm, Telematic Communicati \Telematic Communication Box Lid, Telematic Communi \Telematic Communication Box Lid Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
172
Telematic Communication Box Lid, Telematic Communi
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
173
Assemble Telematic Communication Box Lid \... \Telematic Communication Box and Bracket Asm \Telematic Communication Asm, Telematic Communicati \Assemble Telematic Communication Box Lid
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
174
Assemble Telematic Communication Box Lid
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
175
Assemble Telematic Communication Printed Circuit \... \Telematic Communication Box and Bracket Asm \Telematic Communication Asm, Telematic Communicati \Assemble Telematic Communication Printed Circuit
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
176
Assemble Telematic Communication Printed Circuit
Click Here for TechInsights Electronics Report on Telematics Communication Boards 7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
177
Telematic Communication Box Mounting Bracket, Tele \... \Telematic Communication Asm, Telematic Communicati \Telematic Communication Box Mounting Bracket, Tele \Telematic Communication Box Mtg Bracket Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
178
Telematic Communication Box Mounting Bracket, Tele
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
179
Assemble Telematic Communication Mounting Bracket \... \Telematic Communication Box and Bracket Asm \Telematic Communication Asm, Telematic Communicati \Assemble Telematic Communication Mounting Bracket
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
180
Assemble Telematic Communication Mounting Bracket
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
181
Assemble Telematic Communication Box to Bracket \... \System Electronics \Telematic Communication Box and Bracket Asm \Assemble Telematic Communication Box to Bracket
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
182
Assemble Telematic Communication Box to Bracket
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
183
Assemble Fan \... \System Electronics \Telematic Communication Box and Bracket Asm \Assemble Fan
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
184
Assemble Fan
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
185
Bracket Installation \... \Zone 5 Electronics \System Electronics \Bracket Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
186
Bracket Installation
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
187
Touch Box Control Unit Installation \... \Zone 5 Electronics \System Electronics \Touch Box Control Unit Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
188
Touch Box Control Unit Installation
Click Here for TechInsights Electronics Report on Touch Controller
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
189
Proximity Sensor Installation \... \Zone 5 Electronics \System Electronics \Proximity Sensor Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
190
Proximity Sensor Installation
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
191
Parking Maneuvering Assistant Installation \... \Zone 5 Electronics \System Electronics \Parking Maneuvering Assistant Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
192
Parking Maneuvering Assistant Installation
Click Here for TechInsights Electronics Report on Parking Assist Module
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
193
Antenna Amplifier Asm \... \Zone 5 Electronics \System Electronics \Antenna Amplifier Asm
Assembly Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
194
Antenna Amplifier Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
195
Antenna Amplifier Asm Detailed Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
196
Assemble Antenna Amplifier Circuit \... \System Electronics \Antenna Amplifier Asm \Assemble Antenna Amplifier Circuit
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
197
Assemble Antenna Amplifier Circuit
Click Here for TechInsights Electronics Report on Antenna Amplifier Board 7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
198
Upper Housing, Antenna Amplifier \... \Antenna Amplifier Asm \Upper Housing, Antenna Amplifier \Upper Housing, Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
199
Upper Housing, Antenna Amplifier
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
200
Lower Housing, Antenna Amplifier \... \Antenna Amplifier Asm \Lower Housing, Antenna Amplifier \Lower Housing, Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
201
Lower Housing, Antenna Amplifier
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
202
Assemble Antenna Amplifier Housing \... \System Electronics \Antenna Amplifier Asm \Assemble Antenna Amplifier Housing
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
203
Assemble Antenna Amplifier Housing
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
204
Assemble Screw \... \System Electronics \Antenna Amplifier Asm \Assemble Screw
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
205
Assemble Screw
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
206
Assemble Antenna Amplifier \... \Zone 5 Electronics \System Electronics \Assemble Antenna Amplifier
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
207
Assemble Antenna Amplifier
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
208
Body Wire Harnesses Overview The body wiring group contains the 12 volt vehicle electrical wiring harnesses, 12 volt battery and the body controller/power distribution box. The harnesses consist of two primary parts the in vehicle harness (body harness) and the chassis mounted harness (underbody harness). The group also contains various ground straps and the 12 volt battery cable. The 12 volt battery is mounted in a stamped steel mounting bracket. The body domain controller includes the electronics control as well as circuit protection (fuse box). All major components were costed in detail, while prices were applied to commodity items (i.e. seals, fasteners, latches, and seat belts). Estimates are based on actual parts. Photos: Background on 100mm grid paper.
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
209
Body Wire Harnesses Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
210
Body Domain Controller and Bracket Asm \... \Zone 5 Electronics \Body Wire Harnesses \Body Domain Controller and Bracket Asm
Assembly Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
211
Body Domain Controller and Bracket Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
212
Body Domain Controller and Bracket Asm Detailed Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
213
Bracket Asm, Body Domain Controller and Bracket \... \Body Wire Harnesses \Body Domain Controller and Bracket Asm \Bracket Asm, Body Domain Controller and Bracket
Assembly Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
214
Bracket Asm, Body Domain Controller and Bracket
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
215
Bracket Asm, Body Domain Controller and Bracket Detailed Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
216
Bracket, Bracket Asm \... \Bracket Asm, Body Domain Controller and Bracket \Bracket, Bracket Asm \Bracket Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
217
Bracket, Bracket Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
218
Assemble Compression Sleeve \... \Body Domain Controller and Bracket Asm \Bracket Asm, Body Domain Controller and Bracket \Assemble Compression Sleeve
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
219
Assemble Compression Sleeve
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
220
Assemble Felt Tape \... \Body Domain Controller and Bracket Asm \Bracket Asm, Body Domain Controller and Bracket \Assemble Felt Tape
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
221
Assemble Felt Tape
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
222
Isolator Cap, Body Mounting Isolator Asm \... \Body Domain Controller and Bracket Asm \Isolator Cap, Body Mounting Isolator Asm \Isolator Cap Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
223
Isolator Cap, Body Mounting Isolator Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
224
Assemble Body Mounting Isolator \... \Body Wire Harnesses \Body Domain Controller and Bracket Asm \Assemble Body Mounting Isolator
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
225
Assemble Body Mounting Isolator
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
226
Connector Asm, Body Domain Controller and Bracket \... \Body Wire Harnesses \Body Domain Controller and Bracket Asm \Connector Asm, Body Domain Controller and Bracket
Assembly Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
227
Connector Asm, Body Domain Controller and Bracket
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
228
Connector Asm, Body Domain Controller and Bracket Detailed Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
229
Connector Upper Housing Asm, Connector Asm \... \Body Domain Controller and Bracket Asm \Connector Asm, Body Domain Controller and Bracket \Connector Upper Housing Asm, Connector Asm
Assembly Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
230
Connector Upper Housing Asm, Connector Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
231
Connector Upper Housing Asm, Connector Asm Detailed Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
232
Connector Upper Housing, Connector Asm \... \Connector Upper Housing Asm, Connector Asm \Connector Upper Housing, Connector Asm \Connector Upper Housing Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
233
Connector Upper Housing, Connector Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
234
Assemble Connector Upper Housing \... \Connector Asm, Body Domain Controller and Bracket \Connector Upper Housing Asm, Connector Asm \Assemble Connector Upper Housing
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
235
Assemble Connector Upper Housing
Click Here for TechInsights Electronics Report on Single Termination Board, Connector Asm 7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
236
Connector Lower Housing, Connector Asm \... \Connector Asm, Body Domain Controller and Bracket \Connector Lower Housing, Connector Asm \Connector Lower Housing Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
237
Connector Lower Housing, Connector Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
238
Assemble Connector Lower Housing \... \Body Domain Controller and Bracket Asm \Connector Asm, Body Domain Controller and Bracket \Assemble Connector Lower Housing
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
239
Assemble Connector Lower Housing
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
240
Assemble Connector \... \Body Wire Harnesses \Body Domain Controller and Bracket Asm \Assemble Connector
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
241
Assemble Connector
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
242
Body Domain Controller, Body Domain Controller and \... \Body Wire Harnesses \Body Domain Controller and Bracket Asm \Body Domain Controller, Body Domain Controller and
Assembly Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
243
Body Domain Controller, Body Domain Controller and
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
244
Body Domain Controller, Body Domain Controller and Detailed Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
245
Upper Housing Body Domain Controller, Body Domain \... \Body Domain Controller, Body Domain Controller and \Upper Housing Body Domain Controller, Body Domain \Upper Housing Body Domain Controller Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
246
Upper Housing Body Domain Controller, Body Domain
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
247
Assemble Upper Housing and Printed Circuit Board \... \Body Domain Controller and Bracket Asm \Body Domain Controller, Body Domain Controller and \Assemble Upper Housing and Printed Circuit Board
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
248
Assemble Upper Housing and Printed Circuit Board
Click Here for TechInsights Electronics Report on Body Domain Controller 7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
249
Lower Housing Body Domain Controller \... \Body Domain Controller, Body Domain Controller and \Lower Housing Body Domain Controller \Lower Housing Body Domain Controller Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
250
Lower Housing Body Domain Controller
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
251
Assemble Lower Housing \... \Body Domain Controller and Bracket Asm \Body Domain Controller, Body Domain Controller and \Assemble Lower Housing
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
252
Assemble Lower Housing
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
253
Assemble Body Domain Controller and Bracket Asm \... \Body Wire Harnesses \Body Domain Controller and Bracket Asm \Assemble Body Domain Controller and Bracket Asm
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
254
Assemble Body Domain Controller and Bracket Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
255
Fuse Box Installation \... \Zone 5 Electronics \Body Wire Harnesses \Fuse Box Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
256
Fuse Box Installation
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
257
PDC Mounting Tray Asm \... \Zone 5 Electronics \Body Wire Harnesses \PDC Mounting Tray Asm
Assembly Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
258
PDC Mounting Tray Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
259
PDC Mounting Tray Asm Detailed Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
260
PDC Mounting Tray \... \PDC Mounting Tray Asm \PDC Mounting Tray \PDC Mounting Tray Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
261
PDC Mounting Tray
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
262
Assemble Body Domain Controller and Bracket \... \Body Wire Harnesses \PDC Mounting Tray Asm \Assemble Body Domain Controller and Bracket
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
263
Assemble Body Domain Controller and Bracket
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
264
PDC Mounting Tray Installation \... \Zone 5 Electronics \Body Wire Harnesses \PDC Mounting Tray Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
265
PDC Mounting Tray Installation
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
266
Fuse Box Bracket Asm \... \Zone 5 Electronics \Body Wire Harnesses \Fuse Box Bracket Asm
Assembly Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
267
Fuse Box Bracket Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
268
Fuse Box Bracket Asm Detailed Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
269
Stamping, Fuse Box Bracket Asm \... \Fuse Box Bracket Asm \Stamping, Fuse Box Bracket Asm \Stamping, Fuse Box Bracket Asm Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
270
Stamping, Fuse Box Bracket Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
271
Assemble Fuse Box Bracket \... \Body Wire Harnesses \Fuse Box Bracket Asm \Assemble Fuse Box Bracket
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
272
Assemble Fuse Box Bracket
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
273
Fuse Box Bracket Installation \... \Zone 5 Electronics \Body Wire Harnesses \Fuse Box Bracket Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
274
Fuse Box Bracket Installation
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
275
Power Distribution Center Asm \... \Zone 5 Electronics \Body Wire Harnesses \Power Distribution Center Asm
Assembly Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
276
Power Distribution Center Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
277
Power Distribution Center Asm Detailed Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
278
Housing, Power Distribution Box \... \Power Distribution Center Asm \Housing, Power Distribution Box \Housing, Power Distribution Center Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
279
Housing, Power Distribution Box
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
280
Fuse Panel, Power Distribution \... \Body Wire Harnesses \Power Distribution Center Asm \Fuse Panel, Power Distribution
Assembly Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
281
Fuse Panel, Power Distribution
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
282
Fuse Panel, Power Distribution Detailed Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
283
Fuse Panel Buss Bar \... \Fuse Panel, Power Distribution \Fuse Panel Buss Bar \Fuse Panel Buss Bar Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
284
Fuse Panel Buss Bar
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
285
Assemble Fuse Panel \... \Power Distribution Center Asm \Fuse Panel, Power Distribution \Assemble Fuse Panel
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
286
Assemble Fuse Panel
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
287
Isolator, Power Distribution Box \... \Power Distribution Center Asm \Isolator, Power Distribution Box \Housing, Power Distribution Center Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
288
Isolator, Power Distribution Box
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
289
Assemble Power Distribution Box \... \Body Wire Harnesses \Power Distribution Center Asm \Assemble Power Distribution Box
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
290
Assemble Power Distribution Box
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
291
Cover, Power Distribution Center \... \Body Wire Harnesses \Cover, Power Distribution Center \Cover, Power Distribution Center Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
292
Cover, Power Distribution Center
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
293
Main Wire Harness Installation \... \Zone 5 Electronics \Body Wire Harnesses \Main Wire Harness Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
294
Main Wire Harness Installation
Click Here for Munro & Associates Wire Harness Report on Main Wire Harness 7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
295
Driver Underbody Wire Harness Installation \... \Zone 5 Electronics \Body Wire Harnesses \Driver Underbody Wire Harness Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
296
Driver Underbody Wire Harness Installation
Click Here for Munro & Associates Wire Harness Report on Driver Underbody Wire Harness 7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
297
12V Battery and Bracket Asm \... \Zone 5 Electronics \Body Wire Harnesses \12V Battery and Bracket Asm
Assembly Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
298
12V Battery and Bracket Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
299
12V Battery and Bracket Asm Detailed Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
300
12V Battery Tray Asm \... \Body Wire Harnesses \12V Battery and Bracket Asm \12V Battery Tray Asm
Assembly Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
301
12V Battery Tray Asm
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
302
12V Battery Tray Asm Detailed Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
303
12V Battery Tray Part-A \... \12V Battery Tray Asm \12V Battery Tray Part-A \12V Battery Tray Part-A Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
304
12V Battery Tray Part-A
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
305
12V Battery Tray Part-B \... \12V Battery Tray Asm \12V Battery Tray Part-B \12V Battery Tray Part-B Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
306
12V Battery Tray Part-B
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
307
12V Battery Tray Part-C \... \12V Battery Tray Asm \12V Battery Tray Part-C \12V Battery Tray Part-C Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
308
12V Battery Tray Part-C
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
309
12V Battery Tray Part-D \... \12V Battery Tray Asm \12V Battery Tray Part-D \12V Battery Tray Part-D Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
310
12V Battery Tray Part-D
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
311
Assemble Battery Tray \... \12V Battery and Bracket Asm \12V Battery Tray Asm \Assemble Battery Tray
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
312
Assemble Battery Tray
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
313
12V Battery Hold Down \... \12V Battery and Bracket Asm \12V Battery Hold Down \12V Battery Hold Down Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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12V Battery Hold Down
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12V N Battery Terminal \... \12V Battery and Bracket Asm \12V N Battery Terminal \12V N Battery Terminal Process
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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12V N Battery Terminal
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12V P Battery Terminal \... \12V Battery and Bracket Asm \12V P Battery Terminal \12V P Battery Terminal Process
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12V P Battery Terminal
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Assemble 12V Battery & Tray \... \Body Wire Harnesses \12V Battery and Bracket Asm \Assemble 12V Battery & Tray
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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Assemble 12V Battery & Tray
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12V Battery and Bracket Installation \... \Zone 5 Electronics \Body Wire Harnesses \12V Battery and Bracket Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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322
12V Battery and Bracket Installation
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323
Positive Battery Cable Wire Harness Installation \... \Zone 5 Electronics \Body Wire Harnesses \Positive Battery Cable Wire Harness Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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Positive Battery Cable Wire Harness Installation
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Negative Battery Cable Installation \... \Zone 5 Electronics \Body Wire Harnesses \Negative Battery Cable Installation
Process Summary
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Negative Battery Cable Installation
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327
Ground, Chassis to Power Module Installation \... \Zone 5 Electronics \Body Wire Harnesses \Ground, Chassis to Power Module Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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Ground, Chassis to Power Module Installation
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Ground, Motor Asm to Power Module Installation \... \Zone 5 Electronics \Body Wire Harnesses \Ground, Motor Asm to Power Module Installation
Process Summary
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Ground, Motor Asm to Power Module Installation
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Ground, Power Module to Chassis Installation \... \Zone 5 Electronics \Body Wire Harnesses \Ground, Power Module to Chassis Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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Ground, Power Module to Chassis Installation
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333
Ground, Rear X Brace To Heat Shield Installation \... \Zone 5 Electronics \Body Wire Harnesses \Ground, Rear X Brace To Heat Shield Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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Ground, Rear X Brace To Heat Shield Installation
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Ground, Chassis to Exhaust Heat Shield Installatio \... \Zone 5 Electronics \Body Wire Harnesses \Ground, Chassis to Exhaust Heat Shield Installatio
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
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336
Ground, Chassis to Exhaust Heat Shield Installatio
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337
Ground, Chassis to Engine Installation \... \Zone 5 Electronics \Body Wire Harnesses \Ground, Chassis to Engine Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
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338
Ground, Chassis to Engine Installation
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339
Ground, AC Compressor To Motor Installation \... \Zone 5 Electronics \Body Wire Harnesses \Ground, AC Compressor To Motor Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
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340
Ground, AC Compressor To Motor Installation
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341
Ground, Chassis to Motor Installation \... \Zone 5 Electronics \Body Wire Harnesses \Ground, Chassis to Motor Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
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342
Ground, Chassis to Motor Installation
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343
Steering Column Ground Strap Installation \... \Zone 5 Electronics \Body Wire Harnesses \Steering Column Ground Strap Installation
Process Summary
* Excluding tooling, ER&D, logistics, and profit margin ** Includes material cost and purchased parts cost
7 June 2017
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Steering Column Ground Strap Installation
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Appendix Reports
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Appendix
TechInsights Electronics Reports
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Deep Dive Report
BMW i3 Digital Radio Module HBB125 Satellite Radio, WiFi 802.11a/b/g, Bluetooth 3.0 Report #15200-150210-RBb
Product Description The HBB125 is the digital radio module included in models of the BMW i3. Along with the ubiquitous AM / FM radio, the HBB125 adds a 200 GB hard drive and Sirius / XM radio. Connectivity is provided via GPS, WiFi 802.11 a/b/g and Bluetooth 3.0, with CAN and USB 2.0 protocols also present in this device, but not user accessible. At its core are three different processors: Intel E660T "Atom" processor, Texas Instruments Jacinto Automotive Applications processor and Nvidia GeForce 8 (G-98) Graphics processor. In addition, over 9.8 GB of system memory has been implemented in the form of SDRAM, Flash and EEPROM from companies that include Micron, Spansion, STMicroelectronics, Microchip, Atmel and ISSI.
DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information. Copyright © 2015, TechInsights. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of TechInsights.
www.teardown.com [email protected]
Product Overview Product Description
Integrated Circuit Metrics
Product Type
Automotive
IC Die Count**
119
Brand
BMW (Harman)
IC Package Count**
117
Product Name & Model #
i3 Digital Radio Module, HBB125
Official Release Date
5/2/2014
Weight (grams)
1790
Retail Price
Dimensions (mm)
230 x 190 x 116
Total Manufacturing Cost
$558.65
Electronics Cost**
$435.39
Cost Metrics
Product Features
$2,700.00
Manufacturing Cost Breakdown
Connectivity
AM/FM Radio, Satellite Radio, WiFi 802.11a/b/g, Bluetooth 3.0, GPS
Processors
(1) (2) (3) (4) (5) (6)
Intel E660T 1.3 GHz Atom Processor Texas Instruments Jacinto Automotive Applications Processor NXP Semi SAF3560 Terrestrial Digital Radio Processor NXP Semi SAF7741 Car Radio Digital Signal Processor UBlox UBX-G6000 GPS Baseband Processor Nvidia EMP9 (G-98) Graphics Processor
Storage
200 GB Hard Drive 9.8 GB Total Solid-State Storage (not user-accessible)
Interface
None (User interface located elsewhere in the vehicle)
Sensors
Temperature
Integrated Circuits
$273.32
48.9%
Modules, Discretes & Connectors
$83.23
14.9%
Substrates
$18.72
3.4%
Component Insertion
$17.89
3.2%
$8.74
1.6%
Hard Drive*
$29.14
5.2%
Sirius XM Radio Module
$48.03
8.6%
Non-Electronic Parts
$57.31
10.3%
Final Assembly & Test
$22.27
4.0%
Card Test
Total
$558.65 100.0%
*Line Item Cost Only **Including Subsystems
Key Subsystems Sirius XM Radio Module
STMicroelectronics STA280BB Baseband Processor & STA210N3A Satellite Radio Tuner
Drives
Hard Drive: Automotive-Grade 2.5" 200 GB SATA, 8 MB Cache, 4200 RPM
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Block Diagram 9 - Avago #AFBR-2012S Optical Receiver
Fan 31 - Maxim #MAX6414UK31 Microprocessor Reset Circuit
29 - Microchip #OS81060AM Intelligent Network Interface Controller
8 - Avago #AFBR-1012S Optical Transmitter
11 - Atmel #ATmega169P 8-Bit Microcontroller w/ 16 KB Flash 1 - NXP Semiconductor #TDA8579 Differential Line Receiver
2 - AKM Semiconductor #AK4628A Multichannel Audio CODEC
4 - STMicroelectronics #TDA7569BLVPD 4 x 50 W Audio Power Amplifier
Mother Board
3 - Analog Devices #ADV7180 SDTV Video Decoder
6 - Atmel #ATtiny261 8-Bit Microcontroller w/ Flash
Radio Board
Power Board
35 - AKM Semiconductor #AK5359 Stereo A/D Converter
32 - Maxim #MAX3221EEAE+ RS-232 Transceiver
12 - Micron #MT48LC16M16A2 SDR SDRAM Memory - 32 MB
26 - Micron #MT48LC16M16A2 SDR SDRAM Memory - 32 MB
37 - Texas Instruments #DRH443HSBIZDU Jacinto Automotive Applications Processor
16 - NXP Semiconductor #TJA1041 CAN Transceiver
25 - Spansion #S29GL512S10DHA02 NOR Flash Memory - 64 MB
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Block Diagram WiFi Antenna Coaxial Connector Mauve
Beige
Blue
46 - Marvell Semiconductor #88W8688 Single-Chip Bluetooth 3.0 / WiFi 802.11a/b/g
45 - Microchip #25LC080 EEPROM Memory - 1 KB
51 - UBlox #UBX-G6000 GPS Baseband Processor
Interconnect Board
50 - UBlox #BX-G0010-QA GPS Front-End
64 - Skyworks #AS179 SPDT GaAs Switch
47 - Microsemi #LX5511 2.4 GHz WiFi Power Amplifier
Hard Drive
GPS Antenna Coaxial Connector
Bluetooth Antenna Coaxial Connector
52 - Micron #M29W400FT NOR Flash Memory - 512 KB
USB3
Main Board
USB2
USB1
53 - Micron #M25PX32-VZM6FBA Serial NOR Flash Memory - 4 MB
APIX
65 - Inova Semiconductor #INAP375T Automotive Pixel Link Transmitter
54 - Xilinx #XA6SLX45T Spartan-6 Automotive FPGA
67 - NVIDIA #EMP9 (G-98) Graphics Processor
69 - Maxim #MAX6649 Temperature Sensor
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49 - Renesas #R5H30201D Microcontroller
44 - Micron #MT47H64M16HR-25E AIT - Micron DDR2 SDRAM44 Memory - 128 MB #MT47H64M16HR-25E AIT DDR2 SDRAM Memory - 128 MB
68 - Micron #MT47H64M16HR-25E AIT - Micron DDR2 SDRAM68 Memory - 128 MB #MT47H64M16HR-25E AIT DDR2 SDRAM Memory - 128 MB
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Daughter Board
Mother Board BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 351
Block Diagram 85 - Micron #M25PX32-VMP6FBA Serial NOR Flash Memory - 4 MB
76 - Micron #MT47H128M8CF-25E 76 - Micron AIT:H DDR2 SDRAM Memory - 128AIT:H MB #MT47H128M8CF-25E 76 - Micron DDR2 SDRAM Memory - 128AIT:H MB #MT47H128M8CF-25E 76 - Micron DDR2 SDRAM Memory - 128AIT:H MB #MT47H128M8CF-25E DDR2 SDRAM Memory - 128 MB
84 - Micron #MT47H128M8CF-25E 84 - Micron AIT:H DDR2 SDRAM Memory - 128AIT:H MB #MT47H128M8CF-25E 84 - Micron DDR2 SDRAM Memory - 128AIT:H MB #MT47H128M8CF-25E 84 - Micron DDR2 SDRAM Memory - 128AIT:H MB #MT47H128M8CF-25E DDR2 SDRAM Memory - 128 MB 80 - Intel #E660T 1.30 GHz Atom Processor
79 - STMicroelectronics #STA2X11 I/O Controller Hub
78 - Micrel #KSZ8041NL Ethernet Transceiver
77 - Micron #MTFC8GLGDM-AIT Z Multichip Memory - 8 GB MLC NAND Flash, Memory Controller (eMMC)
83 - Rohm #BD9592AMWV Power Management
81 - Rohm #BU7336MWV Clock Generator
Mother Board
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 352
Block Diagram AM/FM1 Antenna Coaxial Connector
FM2 Antenna Coaxial Connector
Black
Satellite Radio Antenna Coaxial Connector
White
94 - NXP Semiconductor #TEF7000HN Digital Radio Front-End
Pink
Sirius/XM Radio Module
95 - NXP Semiconductor #TEF7000HN Digital Radio Front-End
DIPL
99 - STMicroelectronics #STA210N3A Satellite Radio Tuner
FM
91 - Silicon Labs #Si4761 AM/FM Radio Receiver & HD Radio Tuner
AM
90 - NXP Semiconductor #SAF7741 Car Radio Digital Signal Processor
88 - NXP Semiconductor #SAF3560 Terrestrial Digital Radio Processor
100 - Spansion #S29GL032N90BF104 NOR Flash Memory - 4 MB 102 - ISSI #IS46LR16320B-6BLA1 DDR SDRAM Memory - 64 MB
101 - STMicroelectronics #STA280BB Baseband Processor
98 - Micron #M25P80 Serial NOR Flash Memory - 1 MB
96 - Atmel #AT24C64A-10TU Serial EEPROM Memory - 8 KB
89 - Micron #MT48LC8M16A2P-6A AIT:L Automotive SDR SDRAM - 16 MB 93 - Silicon Labs #Si4749 FM RDS / RBDS Data Receiver / Alternate Frequency Scanner
Main Board
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 353
Product Labels
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Product Labels
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Exterior Features
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Exterior Features APIX Bluetooth Antenna USB3 USB2 USB1
WiFi Antenna Vehicle Wiring Harness GPS Antenna AM/FM1 Antenna FM2 Antenna
Satellite Radio Antenna
Fiber Optic Cables
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Major Components (Side 1)
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Major Components (Side 2)
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Component Arrangement
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Teardown Sequence
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Teardown Sequence
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 362
Teardown Sequence
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Teardown Sequence
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Teardown Sequence
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Teardown Sequence
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Teardown Sequence
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Teardown Sequence
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Teardown Sequence
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 369
Teardown Sequence
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Teardown Sequence
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Teardown Sequence
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Teardown Sequence
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Teardown Sequence
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Teardown Sequence Removal of material in these areas was required in order to separate the three PC boards.
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Teardown Sequence
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Hard Drive Subsystem Hard Drive Brand Part Number Module Dimensions Weight (grams) Estimated Module Line Item Price
Toshiba MK2060GSC 100 x 69.6 x 9.5 88.40 $29.14
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Sirius XM Radio Module Sirius XM Radio Module as assembled on side 2 of the Radio Board.
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Sirius XM Radio Board (Side 1) 99 - STMicroelectronics #STA210N3A Satellite Radio Tuner
100 - Spansion #S29GL032N90BF104 NOR Flash Memory - 4 MB
101 - STMicroelectronics #STA280BB Baseband Processor
102 - ISSI #IS46LR16320B-6BLA1 DDR SDRAM Memory - 64 MB
103 - Texas Instruments #SN74LVC1G17 Single Schmitt-Trigger Buffer
104 - Texas Instruments #LP3907 Dual DC/DC & Dual Linear Regulators
Radio Board
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Sirius XM Radio Board (Side 2)
105 - Texas Instruments #LMC7101Q-Q1 Operational Amplifier
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Sirius XM Radio Module Sirius XM Radio Module Brand Part Number Module Dimensions Weight (grams)
Estimated Costs
Electronic Parts Non-Electronic Parts Assembly Test Gross Margin
Estimated Module Price
Sirius 91UMSR5H.GB3AG 71.5 x 45.3 x 10.3 41.50 $31.65 $0.10 $1.52 $0.35 $14.41 $48.03
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Main Board (Side 1) Power Board
Radio Board
Heat Sink Fan
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Main Board (Side 1)
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Main Board (Side 1 IC Identification) 1 - NXP Semiconductor #TDA8579 Differential Line Receiver
2 - AKM Semiconductor #AK4628A Multichannel Audio CODEC
3 - Analog Devices #ADV7180 SDTV Video Decoder
17 - Infineon #TLE4276DV 400 mA Adjustable LDO Regulator
4 - STMicroelectronics #TDA7569BLVPD 4 x 50 W Audio Power Amplifier
16 - NXP Semiconductor #TJA1041 CAN Transceiver
15 - Intersil #ISL78213ARZ 3 A DC-DC Converter
5 - NXP Semiconductor #74LVC14APW Hex Inverting Schmitt Trigger 6 - Atmel #ATtiny261 8-Bit Microcontroller w/ Flash
13 - Texas Instruments #SN74LVC1G08DCK 2-Input Positive-AND Gate
7 - Texas Instruments #SN74LVC125APW Quad Buffer
12 - Micron #MT48LC16M16A2 SDR SDRAM Memory - 32 MB
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11 - Atmel #ATmega169P 8-Bit Microcontroller w/ 16 KB Flash
10 - Intersil #ISL78310 1 A LDO Regulator
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9 - Avago #AFBR-2012S Optical Receiver
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8 - Avago #AFBR-1012S Optical Transmitter BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 384
Main Board (Side 1 IC Identification) 18 - Texas Instruments #SN74HC4066PW Quad Bilateral Switch
19 - Texas Instruments #SN74LVC1G08IDCK 2-Input Positive-AND Gate
24 - Maxim #MAX4835ETT18BD2+T 250 mA / 1.8 V LDO Regulator
20 - Texas Instruments #SN74LVC2G125-Q1 Dual Bus Buffer
21 - NXP Semiconductor #74LVC1G14GW Single Schmitt-Trigger Inverter
13 - Texas Instruments #SN74LVC1G08DCK 2-Input Positive-AND Gate
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Main Board (Side 2) Mother Board
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 386
Main Board (Side 2 IC Identification) 27 - Texas Instruments #SN74LVC125APW Quad Buffer
28 - NXP Semiconductor #74LVC08A Quad 2-Input AND Gate
26 - Micron #MT48LC16M16A2 SDR SDRAM Memory - 32 MB
29 - Microchip #OS81060AM Intelligent Network Interface Controller
30 - STMicroelectronics #L5973D 2 A DC-DC Converter
25 - Spansion #S29GL512S10DHA02 NOR Flash Memory - 64 MB
31 - Maxim #MAX6414UK31 Microprocessor Reset Circuit 32 - Maxim #MAX3221EEAE+ RS-232 Transceiver
37 - Texas Instruments #DRH443HSBIZDU Jacinto Automotive Applications Processor
33 - Linear Technology #LTC3859 DC/DC Converter 36 - Infineon #TLF4277 200 mA LDO Regulator
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34 - Intersil #ISL78310 1 A LDO Regulator
30 - STMicroelectronics #L5973D 2 A DC-DC Converter
35 - AKM Semiconductor #AK5359 Stereo A/D Converter
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 387
Main Board (Side 2 IC Identification)
38 - Texas Instruments #SN74LVC1G08IDCK 2-Input Positive-AND Gate
42 - Analog Devices #ADA4851-2WYRMZ-R7 Operational Amplifier
41 - Infineon #TLE4266 150 mA / 5 V LDO Regulator
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 388
Main Board Cross-Section
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 389
Mother Board (Side 1) Not Used
Interconnect Board
Main Board
APIX Grid = 1 cm
Bluetooth Antenna
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WiFi Antenna USB3 USB2 USB1
Copyright © Munro & Associates, Inc. 2015
GPS Antenna
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 390
Mother Board (Side 1 IC Identification) 43 - Intersil #ISL78214ARZ 4 A DC-DC Converter
55 - Intersil #ISL78213ARZ 3 A DC-DC Converter
44 - Micron #MT47H64M16HR-25E AIT DDR2 SDRAM Memory - 128 MB
54 - Xilinx #XA6SLX45T Spartan-6 Automotive FPGA
53 - Micron #M25PX32-VZM6FBA Serial NOR Flash Memory - 4 MB
45 - Microchip #25LC080 EEPROM Memory - 1 KB
46 - Marvell Semiconductor #88W8688 Single-Chip Bluetooth 3.0 / WiFi 802.11a/b/g
52 - Micron #M29W400FT NOR Flash Memory - 512 KB
47 - Microsemi #LX5511 2.4 GHz WiFi Power Amplifier
51 - UBlox #UBX-G6000 GPS Baseband Processor 50 - UBlox #BX-G0010-QA GPS Front-End
48 - Texas Instruments #LM2903D Dual Comparator
49 - Renesas #R5H30201D Microcontroller
Grid = 1 cm Copyright © 2015, TechInsights
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 391
Mother Board (Side 1 IC Identification)
63 - Texas Instruments #SN74LVC1G08DCK 2-Input Positive-AND Gate
56 - Intersil #ISL78310 1 A LDO Regulator
62 - NXP Semiconductor #74LVC14APW Hex Inverting Schmitt Trigger
57 - STMicroelectronics #TL431AIYD Programmable Voltage Reference
58 - Maxim #MAX4835ETT18BD2+T 250 mA / 1.8 V LDO Regulator
Grid = 1 cm Copyright © 2015, TechInsights
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 392
Mother Board (Side 2)
Daughter Board
Grid = 1 cm Copyright © 2015, TechInsights
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 393
Mother Board (Side 2 IC Identification)
64 - Skyworks #AS179 SPDT GaAs Switch
65 - Inova Semiconductor #INAP375T Automotive Pixel Link Transmitter 66 - STMicroelectronics #L5973D 2 A DC-DC Converter
66 - STMicroelectronics #L5973D 2 A DC-DC Converter
71 - Texas Instruments #SN74LVC1G08DCK 2-Input Positive-AND Gate
67 - NVIDIA #EMP9 (G-98) Graphics Processor 68 - Micron #MT47H64M16HR-25E AIT DDR2 SDRAM Memory - 128 MB
73 - Texas Instruments #SN74CBTD3384PW Bus Switch
72 - Maxim #MAX8517 1 A LDO Regulator 69 - Maxim #MAX6649 Temperature Sensor 70 - Intersil #ISL78210 DC-DC Converter
71 - Texas Instruments #SN74LVC1G08DCK 2-Input Positive-AND Gate
Grid = 1 cm Copyright © 2015, TechInsights
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 394
Mother Board (Side 2 IC Identification) 74 - Unknown #E8 ? ESD Protection ?
75 - Unknown #HSA ? EMI Filter ?
? = Unconfirmed
Grid = 1 cm Copyright © 2015, TechInsights
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 395
Mother Board (Cross-Section)
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 396
Daughter Board (Side 1)
Mother Board
Grid = 1 cm Copyright © 2015, TechInsights
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 397
Daughter Board (Side 1 IC Identification) 76 - Micron #MT47H128M8CF-25E AIT:H DDR2 SDRAM Memory - 128 MB
77 - Micron #MTFC8GLGDM-AIT Z Multichip Memory - 8 GB MLC NAND Flash, Memory Controller (eMMC) (3-Die Pkg.)
78 - Micrel #KSZ8041NL Ethernet Transceiver
79 - STMicroelectronics #STA2X11 I/O Controller Hub
82 - Texas Instruments #SN74LVC1G125DBV Single Buffer
83 - Rohm #BD9592AMWV Power Management
80 - Intel #E660T 1.30 GHz Atom Processor
81 - Rohm #BU7336MWV Clock Generator
Grid = 1 cm Copyright © 2015, TechInsights
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 398
Daughter Board (Side 1 X-Rays)
77.1 - Micron #L73A MLC NAND Flash Memory - 4 GB Die Size: 10.3 x 8.8 mm
77.2 - Micron #PS8200 Memory Controller Die Size: 4.7 x 1.8 mm
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77 - Micron #MTFC8GLGDM-AIT Z Multichip Memory - 8 GB MLC NAND Flash, Memory Controller (eMMC) (3-Die Pkg.) Pkg Size: 13 x 11.5 mm BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 399
Daughter Board (Side 1 X-Rays)
77.1 - Micron #L73A MLC NAND Flash Memory - 4 GB Die Size: 10.3 x 8.8 mm
77.2 - Micron #PS8200 Memory Controller Die Size: 4.7 x 1.8 mm
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77 - Micron #MTFC8GLUDM-AIT Multichip Memory - 8 GB MLC NAND Flash, Memory Controller (eMMC) (3-Die Pkg.) Pkg Size: 13 x 11.5 mm BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 400
Daughter Board (Side 2)
Grid = 1 cm Copyright © 2015, TechInsights
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 401
Daughter Board (Side 2 IC Identification) 84 - Micron #MT47H128M8CF-25E AIT:H DDR2 SDRAM Memory - 128 MB
85 - Micron #M25PX32-VMP6FBA Serial NOR Flash Memory - 4 MB
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 402
Daughter Board (Cross-Section)
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 403
Radio Board (Side 1) Not Used
Grid = 1 cm Copyright © 2015, TechInsights
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 404
Radio Board (Side 1 IC Identification) 87 - Texas Instruments #LM1117IMP-ADJ/NOPB 800 mA Adjustable LDO Regulator
88 - NXP Semiconductor #SAF3560 Terrestrial Digital Radio Processor
89 - Micron #MT48LC8M16A2P-6A AIT:L Automotive SDR SDRAM - 16 MB
91 - Silicon Labs #Si4761 AM/FM Radio Receiver & HD Radio Tuner
90 - NXP Semiconductor #SAF7741 Car Radio Digital Signal Processor
92 - Texas Instruments #LMV331M5 Comparator
93 - Silicon Labs #Si4749 FM RDS / RBDS Data Receiver / Alternate Frequency Scanner
94 - NXP Semiconductor #TEF7000HN Digital Radio Front-End
Grid = 1 cm Copyright © 2015, TechInsights
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 405
Radio Board (Side 2) Main Board AM/FM 1 Antenna
Sirius XM Radio Module FM 2 Antenna
Satellite Radio Antenna
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 406
Radio Board (Side 2 IC Identification) 95 - NXP Semiconductor #TEF7000HN Digital Radio Front-End
96 - Atmel #AT24C64A-10TU Serial EEPROM Memory - 8 KB
97 - Infineon #TLF4277 200 mA LDO Regulator
98 - Micron #M25P80 Serial NOR Flash Memory - 1 MB
Grid = 1 cm Copyright © 2015, TechInsights
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 407
Power Board with Connector (Side 1)
To Vehicle Wiring Harness
Grid = 1 cm Copyright © 2015, TechInsights
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 408
Power Board (Side 1)
Vehicle Wiring Harness Connector removed
Grid = 1 cm Copyright © 2015, TechInsights
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Main Board
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 409
Power Board (Side 2)
Grid = 1 cm Copyright © 2015, TechInsights
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 410
Interconnect Board Mother Board
Hard Drive
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 411
Substrate Data Substrates Assembly Name Daughter Board Interconnect Board Main Board Mother Board Power Board Radio Board
Manufactur er
AT&S FR4 CircuiTech Precision FR4 Electronics Compeq FR4 AT&S FR4 Compeq FR4 Denka FR4
Copyright © 2015, TechInsights
7 June 2017
Core Material
Mfg. Technology
8 Layer buildup FR4 / HF 4 Layer conventional FR4 / HF 6 Layer conventional FR4 / HF 8 Layer conventional FR4 / HF 6 Layer conventional FR4 / HF 6 Layer conventional FR4 / HF
Area (cm²)
Layers
8 4 6 8 6 6
87.1 41.1 223.0 219.0 81.4 107.1
Min. Trace Pitch (mm) 0.25 0.20 0.20 0.25 0.40 0.30
Min. Trace Width (mm) 0.10 0.10 0.10 0.10 0.15 0.10
Copyright © Munro & Associates, Inc. 2015
ThruVia Land Dia (mm)
ThruVia Hole Dia (mm)
BlindVia Land Dia (mm) 0.30
0.60 0.60 0.40 0.70 0.50
0.45 0.25 0.20 0.40 0.30
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BlindVia Hole Dia (mm) 0.05
Thickness (mm) 1.3 1.4 1.4 1.3 1.5 1.6
Routing Density 39.5 19.3 21.6 31.6 9.8 20.3
Estimated Costs $ $ $ $ $ $
5.21 0.76 3.57 5.15 1.82 2.21
BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 412
Integrated Circuit Components Package Info
Estimated Costs
Die Info
Location Pkg Ref. #
Pkg Qty
Brand Name
Main Board, Side 1
1 2 3 4 5 6 7 8 9 10 11 12 13 15 16 17 18 19 20 21 24
1 1 1 1 1 1 1 1 1 1 1 1 3 1 1 1 1 1 1 1 1
NXP Semiconductor AKM Semiconductor Analog Devices STMicroelectronics NXP Semiconductor Atmel Texas Instruments Avago Avago Intersil Atmel Micron Texas Instruments Intersil NXP Semiconductor Infineon Texas Instruments Texas Instruments Texas Instruments NXP Semiconductor Maxim
TDA8579 AK4628A ADV7180 TDA7569BLVPD 74LVC14APW ATtiny261 SN74LVC125APW AFBR-1012S AFBR-2012S ISL78310 ATmega169P MT48LC16M16A2 SN74LVC1G08DCK ISL78213ARZ TJA1041 TLE4276DV SN74HC4066PW SN74LVC1G08IDCK SN74LVC2G125-Q1 74LVC1G14GW MAX4835ETT18BD2+T
Main Board, Side 2
25 26 27 28 29 30 31 32 33 34 35 36 37 38 41 42
1 1 1 1 1 2 1 1 1 1 1 2 1 1 1 1
Spansion Micron Texas Instruments NXP Semiconductor Microchip STMicroelectronics Maxim Maxim Linear Technology Intersil AKM Semiconductor Infineon Texas Instruments Texas Instruments Infineon Analog Devices
S29GL512S10DHA02 MT48LC16M16A2 SN74LVC125APW 74LVC08A OS81060AM L5973D MAX6414UK31 MAX3221EEAE+ LTC3859 ISL78310 AK5359 TLF4277 DRH443HSBIZDU SN74LVC1G08IDCK TLE4266 ADA4851-2WYRMZ-R7
Part Number
Form
Pin Count
Length (mm)
Width (mm)
Height (mm)
Die Ref #
Die Qty
Differential Line Receiver Multichannel Audio CODEC SDTV Video Decoder 4 x 50 W Audio Power Amplifier Hex Inverting Schmitt Trigger 8-Bit Microcontroller w/ Flash Quad Buffer Optical Transmitter Optical Receiver 1 A LDO Regulator 8-Bit Microcontroller w/ 16 KB Flash SDR SDRAM Memory - 32 MB 2-Input Positive-AND Gate 3 A DC-DC Converter CAN Transceiver 400 mA Adjustable LDO Regulator Quad Bilateral Switch 2-Input Positive-AND Gate Dual Bus Buffer Single Schmitt-Trigger Inverter 250 mA / 1.8 V LDO Regulator
SOP QFP QFP SOP SOP QFN SOP TO TO DFN QFP TSOP SOP QFN SOP TO SOP SOP SOP SOP DFN
8 44 48 36 14 32 14 4 4 10 64 54 5 16 14 5 14 5 8 5 6
4.90 10.00 6.80 15.90 5.00 5.00 5.00 7.10 7.10 3.00 13.80 22.30 2.10 4.00 8.80 6.50 5.20 2.10 2.30 2.10 3.00
3.90 9.90 6.80 11.20 4.40 5.00 4.40 5.60 5.60 3.00 13.80 10.00 1.20 4.00 3.90 6.10 4.40 1.20 2.00 1.20 3.00
1.60 1.50 1.60 3.40 1.10 1.00 1.00 2.70 2.70 1.00 1.10 1.20 1.00 1.00 1.70 2.40 1.00 1.00 0.80 1.00 0.80
1.1 2.1 3.1 4.1 5.1 6.1 7.1 8.1 9.1 10.1 11.1 12.1 13.1 15.1 16.1 17.1 18.1 19.1 20.1 21.1 24.1
1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
NXP Semiconductor AKM Semiconductor Analog Devices STMicroelectronics NXP Semiconductor Atmel Texas Instruments Avago Avago Intersil Atmel Micron Texas Instruments Intersil NXP Semiconductor Infineon Texas Instruments Texas Instruments Texas Instruments NXP Semiconductor Maxim
TDA8579 5616 TV718_D UK75AA C5181 AT35462 LVC125K M1293012 M1384 53698A01 AT35504 T36 L08E 53609A01 cF1142A TLE4276DV LC705E L08E L2G125D CP32 A524Z-S
NOR Flash Memory - 64 MB SDR SDRAM Memory - 32 MB Quad Buffer Quad 2-Input AND Gate Intelligent Network Interface Controller 2 A DC-DC Converter Microprocessor Reset Circuit RS-232 Transceiver DC/DC Converter 1 A LDO Regulator Stereo A/D Converter 200 mA LDO Regulator Jacinto Automotive Applications Processor 2-Input Positive-AND Gate 150 mA / 5 V LDO Regulator Operational Amplifier
BGA TSOP SOP SOP QFN SOP SOP SOP QFN DFN TSOP SOP BGA SOP SOP SOP
64 54 14 14 40 8 5 16 38 10 16 14 352 5 4 8
9.00 22.30 5.00 5.00 5.70 5.00 3.00 6.10 7.00 3.00 5.00 5.10 23.00 2.10 6.40 2.90
9.00 10.00 4.40 4.40 5.70 3.80 1.60 5.10 5.00 3.00 4.30 3.90 23.00 1.20 3.40 2.90
1.00 1.20 1.00 1.00 0.90 1.60 1.30 1.90 0.80 1.00 1.00 1.40 1.90 1.00 1.60 1.00
25.1 26.1 27.1 28.1 29.1 30.1 31.1 32.1 33.1 34.1 35.1 36.1 37.1 38.1 41.1 42.1
1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
Spansion Micron Texas Instruments NXP Semiconductor Microchip STMicroelectronics Maxim Maxim Linear Technology Intersil AKM Semiconductor Infineon Texas Instruments Texas Instruments Infineon Analog Devices
98290A T36 LVC125K PS70D7 OS87260 CUD73E M560Z-2 R560V -1 BF3859 53698A01 5841 TLF4277 F761977B L08E TLE4266 ADA4851_2R1
Pkg Description
Brand Name
Part Number
Length (mm)
Width (mm)
Differential Line Receiver Multichannel Audio CODEC SDTV Video Decoder 4 x 50 W Audio Power Amplifier Hex Inverting Schmitt Trigger 8-Bit Microcontroller w/ Flash Quad Buffer Optical Transmitter Optical Receiver 1 A LDO Regulator 8-Bit Microcontroller w/ 16 KB Flash SDR SDRAM Memory - 32 MB 2-Input Positive-AND Gate 3 A DC-DC Converter CAN Transceiver 400 mA Adjustable LDO Regulator Quad Bilateral Switch 2-Input Positive-AND Gate Dual Bus Buffer Single Schmitt-Trigger Inverter 250 mA / 1.8 V LDO Regulator
2.10 3.60 3.40 6.50 0.66 2.10 1.00 1.50 1.70 1.30 3.90 5.40 0.50 2.00 3.20 2.10 0.90 0.50 0.80 0.40 2.30
1.80 3.20 3.30 5.00 0.55 1.90 0.80 1.00 1.00 1.10 3.60 3.20 0.50 2.00 1.90 1.80 0.90 0.50 0.60 0.30 1.10
$ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $
0.253 2.559 2.973 6.181 0.107 1.303 0.126 0.775 0.808 0.129 4.196 2.054 0.042 0.294 1.211 0.233 0.127 0.042 0.072 0.037 0.164
$ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $
0.253 2.559 2.973 6.181 0.107 1.303 0.126 0.775 0.808 0.129 4.196 2.054 0.127 0.294 1.211 0.233 0.127 0.042 0.072 0.037 0.164
NOR Flash Memory - 64 MB SDR SDRAM Memory - 32 MB Quad Buffer Quad 2-Input AND Gate Intelligent Network Interface Controller 2 A DC-DC Converter Microprocessor Reset Circuit RS-232 Transceiver DC/DC Converter 1 A LDO Regulator Stereo A/D Converter 200 mA LDO Regulator Automotive Applications Processor 2-Input Positive-AND Gate 150 mA / 5 V LDO Regulator Operational Amplifier
6.70 5.40 1.00 0.60 2.90 2.70 0.90 4.00 2.60 1.30 2.10 2.50 7.00 0.50 1.60 1.10
4.90 3.20 0.80 0.50 2.50 1.90 0.90 2.30 1.50 1.10 1.70 2.10 6.80 0.50 1.30 0.80
$ 3.275 $ 2.054 $ 0.126 $ 0.105 $ 1.793 $ 0.292 $ 0.069 $ 1.467 $ 0.390 $ 0.129 $ 0.798 $ 0.324 $ 29.371 $ 0.042 $ 0.133 $ 0.093
$ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $
3.275 2.054 0.126 0.105 1.793 0.585 0.069 1.467 0.390 0.129 0.798 0.648 29.371 0.042 0.133 0.093
Description
Each
Total
Note: Continued on next page... Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.
Copyright © 2015, TechInsights
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 413
Integrated Circuit Components -Continued Package Info
Estimated Costs
Die Info
Location Pkg Ref. #
Pkg Qty
Brand Name
Mother Board, Side 1
43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 62 63
2 2 1 1 1 1 1 1 1 1 1 1 1 2 1 1 1 1
Intersil Micron Microchip Marvell Semiconductor Microsemi Texas Instruments Renesas UBlox UBlox Micron Micron Xilinx Intersil Intersil STMicroelectronics Maxim NXP Semiconductor Texas Instruments
ISL78214ARZ MT47H64M16HR-25E AIT 25LC080 88W8688 LX5511 LM2903D R5H30201D BX-G0010-QA UBX-G6000 M29W400FT M25PX32-VZM6FBA XA6SLX45T ISL78213ARZ ISL78310 TL431AIYD MAX4835ETT18BD2+T 74LVC14APW SN74LVC1G08DCK
4 A DC-DC Converter DDR2 SDRAM Memory - 128 MB EEPROM Memory - 1 KB Single-Chip Bluetooth 3.0 / WiFi 802.11a/b/g 2.4 GHz WiFi Power Amplifier Dual Comparator Microcontroller GPS Front-End GPS Baseband Processor NOR Flash Memory - 512 KB Serial NOR Flash Memory - 4 MB Spartan-6 Automotive FPGA 3 A DC-DC Converter 1 A LDO Regulator Programmable Voltage Reference 250 mA / 1.8 V LDO Regulator Hex Inverting Schmitt Trigger 2-Input Positive-AND Gate
Mother Board, Side 2
64 65 66 67 68 69 70 71 72 73 74 75
1 1 2 1 2 1 1 2 1 1 6 1
Skyworks Inova Semiconductor STMicroelectronics NVIDIA Micron Maxim Intersil Texas Instruments Maxim Texas Instruments Unknown Unknown
AS179 INAP375T L5973D EMP9 (G-98) MT47H64M16HR-25E AIT MAX6649 ISL78210 SN74LVC1G08DCK MAX8517 SN74CBTD3384PW E8 ? HSA ?
SPDT GaAs Switch Automotive Pixel Link Transmitter 2 A DC-DC Converter Graphics Processor DDR2 SDRAM Memory - 128 MB Temperature Sensor DC-DC Converter 2-Input Positive-AND Gate 1 A LDO Regulator Bus Switch ESD Protection ? EMI Filter ?
76
4
Micron
MT47H128M8CF-25E AIT:H
DDR2 SDRAM Memory - 128 MB
77
1
Micron
MTFC8GLGDM-AIT Z
Multichip Memory - 8 GB MLC NAND Flash, Memory BGA Controller Stacked(eMMC) 2+1
78 79 80 81 82 83
1 1 1 1 1 1
Micrel STMicroelectronics Intel Rohm Texas Instruments Rohm
KSZ8041NL STA2X11 E660T BU7336MWV SN74LVC1G125DBV BD9592AMWV
Ethernet Transceiver I/O Controller Hub 1.30 GHz Atom Processor Clock Generator Single Buffer Power Management
QFN BGA BGA QFN SOP QFN
32 361 676 64 5 88
Daughter Board, Side 2
84 85
4 1
Micron Micron
MT47H128M8CF-25E AIT:H M25PX32-VMP6FBA
DDR2 SDRAM Memory - 128 MB Serial NOR Flash Memory - 4 MB
BGA QFN
Radio Board, Side 1
87 88 89 90 91 92 93 94
1 1 1 1 1 1 1 1
Texas Instruments NXP Semiconductor Micron NXP Semiconductor Silicon Labs Texas Instruments Silicon Labs NXP Semiconductor
LM1117IMP-ADJ/NOPB SAF3560 MT48LC8M16A2P-6A AIT:L SAF7741 Si4761 LMV331M5 Si4749 TEF7000HN
800 mA Adjustable LDO Regulator SOP Terrestrial Digital Radio Processor QFN Automotive SDR SDRAM - 16 MB SOP Car Radio Digital Signal Processor QFN AM/FM Radio Receiver & HD Radio Tuner QFN Comparator SOP FM RDS / RBDS Data Receiver / Alternate Frequency Scanner QFN Digital Radio Front-End QFN
Radio Board, Side 2
95 96 97 98
1 1 1 1
NXP Semiconductor Atmel Infineon Micron
TEF7000HN AT24C64A-10TU TLF4277 M25P80
Digital Radio Front-End Serial EEPROM Memory - 8 KB 200 mA LDO Regulator Serial NOR Flash Memory - 1 MB
Daughter Board, Side 1
Totals
110
Part Number
Pkg Description
Form
Pin Count
Length (mm)
Width (mm)
Height (mm)
Die Ref #
Die Qty
QFN BGA SOP BGA QFN SOP SOP QFN BGA BGA BGA BGA QFN DFN SOP DFN SOP SOP
16 84 8 152 16 8 8 24 100 48 24 484 16 10 8 6 14 5
4.00 12.60 3.00 10.00 3.00 5.00 5.00 4.00 9.00 8.00 8.00 23.00 4.00 3.00 5.10 3.00 5.00 2.10
4.00 8.00 2.90 6.00 3.00 3.90 3.80 4.00 9.00 6.00 6.00 23.00 4.00 3.00 4.10 3.00 4.40 1.20
1.00 1.00 1.00 0.74 1.00 1.50 1.50 0.90 0.70 0.80 0.80 2.30 1.00 1.00 1.50 0.80 0.90 1.00
43.1 44.1 45.1 46.1 47.1 48.1 49.1 50.1 51.1 52.1 53.1 54.1 55.1 56.1 57.1 58.1 62.1 63.1
1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
Intersil Micron Microchip Marvell Semiconductor Microsemi Texas Instruments Renesas UBlox UBlox Micron Micron Xilinx Intersil Intersil STMicroelectronics Maxim NXP Semiconductor Texas Instruments
SOP QFN SOP BGA BGA SOP QFN SOP TSOP SOP DFN DFN
6 100 8 969 84 8 16 5 10 24 4 10
2.00 13.90 5.00 29.10 12.60 3.00 2.60 2.10 3.00 7.90 1.20 2.60
1.20 13.80 3.80 29.10 8.00 3.00 1.80 1.20 3.00 4.40 0.80 1.10
0.90 1.40 1.60 3.00 1.00 0.90 0.60 1.00 1.00 1.00 0.40 0.50
64.1 65.1 66.1 67.1 68.1 69.1 70.1 71.1 72.1 73.1 74.1 75.1
1 1 1 1 1 1 1 1 1 1 1 1
60
10.00
8.00
0.90
153
13.00
11.50
0.90
5.00 16.00 22.00 8.00 3.00 10.00
5.00 16.00 22.00 8.00 1.70 10.00
0.90 1.30 2.30 1.00 1.20 1.00
76.1 77.1 77.2 78.1 79.1 80.1 81.1 82.1 83.1
60 8
10.00 5.90
8.00 5.00
0.90 0.90
4 144 54 144 40 5 24 48
6.50 19.90 22.30 19.90 6.00 3.00 4.00 7.00
3.60 19.80 10.10 19.90 6.00 1.60 4.00 7.00
1.60 1.50 1.00 1.50 0.90 1.00 0.90 1.00
48 8 14 8
7.00 4.50 5.10 5.00
7.00 3.00 3.90 3.80
1.00 0.90 1.40 1.50
BGA
QFN TSOP SOP SOP
6014
Description
Length (mm)
Width (mm)
ISL8012 MT47H64M16HR-25E AIT I4 B00 B5 C5 BB5 141E LX5511 TLM393B R5H30201D G010 UBX-5100 P3JC M5JF1 X9633 53609A01 53698A01 CCB 431 A524Z-S C5181 L08E
4 A DC-DC Converter DDR2 SDRAM Memory - 128 MB EEPROM Memory - 1 KB Single-Chip Bluetooth 3.0 / WiFi 802.11a/b/g 2.4 GHz WiFi Power Amplifier Dual Comparator Microcontroller GPS Front-End GPS Baseband Processor NOR Flash Memory - 512 KB Serial NOR Flash Memory - 4 MB Spartan-6 Automotive FPGA 3 A DC-DC Converter 1 A LDO Regulator Programmable Voltage Reference 250 mA / 1.8 V LDO Regulator Hex Inverting Schmitt Trigger 2-Input Positive-AND Gate
2.00 7.50 1.70 8.10 0.93 0.80 2.50 2.20 4.00 3.30 3.80 7.50 2.00 1.30 1.40 2.30 0.66 0.50
2.00 5.50 1.30 4.00 0.64 0.70 2.40 1.80 3.00 1.60 3.30 7.20 2.00 1.10 1.10 1.10 0.55 0.50
$ 0.300 $ 2.413 $ 0.312 $ 7.809 $ 0.198 $ 0.082 $ 1.027 $ 1.198 $ 4.018 $ 0.379 $ 0.397 $ 31.790 $ 0.294 $ 0.129 $ 0.124 $ 0.164 $ 0.107 $ 0.042
$ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $ $
0.600 4.827 0.312 7.809 0.198 0.082 1.027 1.198 4.018 0.379 0.397 31.790 0.294 0.257 0.124 0.164 0.107 0.042
Skyworks Inova Semiconductor STMicroelectronics NVIDIA Micron Maxim Intersil Texas Instruments Maxim Texas Instruments Unknown Unknown
AS179 INAP375T CUD73E G-98 MT47H64M16HR-25E AIT T547X-2 ISL78210 L08E PM63Y CBTD3384D E8 ? HSA ?
SPDT GaAs Switch Automotive Pixel Link Transmitter 2 A DC-DC Converter Graphics Processor DDR2 SDRAM Memory - 128 MB Temperature Sensor DC-DC Converter 2-Input Positive-AND Gate 1 A LDO Regulator Bus Switch ESD Protection ? EMI Filter ?
0.40 3.00 2.70 9.60 7.50 2.10 2.00 0.50 1.60 1.90 0.20 0.70
0.30 2.80 1.90 9.10 5.50 1.50 1.20 0.50 1.50 1.50 0.20 0.50
$ 0.303 $ 3.444 $ 0.292 $ 30.753 $ 2.413 $ 0.590 $ 0.191 $ 0.042 $ 0.175 $ 0.277 $ 0.040 $ 0.065
$ $ $ $ $ $ $ $ $ $ $ $
0.303 3.444 0.585 30.753 4.827 0.590 0.191 0.085 0.175 0.277 0.240 0.065
1 2 1 1 1 1 1 1 1
Micron Micron Micron Micrel STMicroelectronics Intel Rohm Texas Instruments Rohm
MT47H128M8CF-25E AIT:H L73A PS8200 KS8041 V710CA 8PTCCB PC505 L125D VZ422
DDR2 SDRAM Memory - 128 MB MLC NAND Flash Memory - 4 GB Memory Controller Ethernet Transceiver I/O Controller Hub 1.30 GHz Atom Processor Clock Generator Single Buffer Power Management
7.50 10.30 4.70 1.60 5.30 12.80 3.20 0.50 5.80
5.40 8.80 1.80 1.40 5.20 7.50 3.10 0.50 5.80
$ 1.189 $ 5.971 $ 1.664 $ 0.763 $ 10.607 $ 38.532 $ 2.328 $ 0.048 $ 6.613
$ $ $ $ $ $ $ $ $
4.758 11.942 1.664 0.763 10.607 38.532 2.328 0.048 6.613
84.1 85.1
1 1
Micron Micron
MT47H128M8CF-25E AIT:H M5JF1
DDR2 SDRAM Memory - 128 MB Serial NOR Flash Memory - 4 MB
7.50 3.80
5.40 3.30
$ $
1.189 0.354
$ $
4.758 0.354
87.1 88.1 89.1 90.1 91.1 92.1 93.1 94.1
1 1 1 1 1 1 1 1
Texas Instruments NXP Semiconductor Micron NXP Semiconductor Silicon Labs Texas Instruments Silicon Labs NXP Semiconductor
UK6 TV123181C T55a tV0073501F Si4750A5 LMV331 Si4720 V0045501.F6
800 mA Adjustable LDO Regulator 2.00 1.20 Terrestrial Digital Radio Processor 3.60 3.60 Automotive SDR SDRAM - 16 MB 5.40 3.20 Car Radio Digital Signal Processor 5.10 5.00 AM/FM Radio Receiver & HD Radio Tuner 2.90 2.70 Comparator 0.40 0.40 FM RDS / RBDS Data Receiver / Alternate Frequency 2.00 Scanner 1.80 Digital Radio Front-End 3.60 3.40
$ $ $ $ $ $ $ $
0.150 8.645 2.058 9.625 1.973 0.043 1.118 3.319
$ $ $ $ $ $ $ $
0.150 8.645 2.058 9.625 1.973 0.043 1.118 3.319
95.1 96.1 97.1 98.1
1 1 1 1
NXP Semiconductor Atmel Infineon Micron
V0045501.F6 AT355 TLF4277 M3JB1
Digital Radio Front-End Serial EEPROM Memory - 8 KB 200 mA LDO Regulator Serial NOR Flash Memory - 1 MB
$ $ $ $
3.319 0.194 0.324 0.175
$ $ $ $
3.319 0.194 0.324 0.175
Brand Name
Part Number
112
3.60 1.60 2.50 3.40
3.40 1.60 2.10 1.50
Each
Total
$273.32
Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet. Copyright © 2015, TechInsights
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 414
Subsystem IC Components Note: The ICs listed below are for reference only. Their costs are integrated into the cost of the individual subsystems. Package Info
Estimated Costs
Die Info
Location Pkg Ref. #
Sirius XM Radio Module: Sirius XM Radio Board
Totals
99 100 101 102 103 104 105
Pkg Qty 1 1 1 1 1 1 1
7
Brand Name STMicroelectronics Spansion STMicroelectronics ISSI Texas Instruments Texas Instruments Texas Instruments
Part Number STA210N3A S29GL032N90BF104 STA280BB IS46LR16320B-6BLA1 SN74LVC1G17 LP3907 LMC7101Q-Q1
Pkg Description Satellite Radio Tuner NOR Flash Memory - 4 MB Baseband Processor DDR SDRAM Memory - 64 MB Single Schmitt-Trigger Buffer Dual DC/DC & Dual Linear Regulators Operational Amplifier
Form
Pin Count
Length (mm)
QFN BGA BGA BGA SOP QFN SOP
68 48 289 60 5 24 5
9.60 8.20 15.00 10.00 1.90 4.00 3.00
Width (mm)
Height (mm)
Die Ref #
Die Qty
9.60 6.20 15.00 8.00 1.20 4.00 1.60
0.90 0.90 1.10 0.60 0.90 0.80 1.00
99.1 100.1 101.1 102.1 103.1 104.1 105.1
1 1 1 1 1 1 1
499
Brand Name STMicroelectronics Spansion STMicroelectronics ISSI Texas Instruments Texas Instruments Texas Instruments
7
Part Number A195AA 98M68B V587B K056MP1F L17D 320C LM7101C
Description
Length (mm)
Satellite Radio Tuner 5.30 NOR Flash Memory - 4 MB 4.60 Baseband Processor 5.70 DDR SDRAM Memory - 64 MB 8.30 Single Schmitt-Trigger Buffer 0.50 Dual DC/DC & Dual Linear Regulators 2.50 Operational Amplifier 1.10
Width (mm) 3.30 3.40 5.10 6.60 0.50 2.50 0.90
Each $ 5.484 $ 1.446 $ 12.024 $ 3.316 $ 0.042 $ 1.230 $ 0.078
Total $ $ $ $ $ $ $
5.484 1.446 12.024 3.316 0.042 1.230 0.078
$23.62
Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.
Copyright © 2015, TechInsights
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 415
Modular Components Estimated Costs
Package Location
Qty
Brand Name
Part Number
Description
Pin Count
Length (mm)
Width (mm)
Each
Total $ $ $ $ $
Main Board, Side 1
1 1 1 1 1
NDK Delta Electronics Unknown NDK Pulse
NX5032GA AUB0412HD 7534/1809131 C NX8045GB HX1188NL
Crystal: Ceramic - 28.636 NDK Fan: Large - Heat Sink Shielding: Large - Main Connector Crystal: Ceramic - 24.000 NDK Transformer: Transformer - LAN
2 3 4 2 16
5.00 40.00 51.30 8.00 12.70
3.20 40.00 41.00 4.50 6.80
$ $ $ $ $
Main Board, Side 2
1 1
NDK TDK-EPC
NX8045GB B82789C513N2
Crystal: Ceramic - 16.934 NDK Transformer: CAN
2 4
8.00 5.00
4.50 3.70
$ 0.200 $ 0.200 $ 0.500 $ 0.500
Radio Board, Side 1
1 1 1
Unknown NDK NDK
Unknown Unknown Unknown
Shielding: Large - Digital Radio FE Crystal: Ceramic - 36.400 NDK Crystal: Ceramic - 41.600 NDK
1 4 4
43.00 3.20 3.20
42.30 2.50 2.50
$ 0.040 $ 0.040 $ 0.200 $ 0.200 $ 0.200 $ 0.200
Radio Board, Side 2
1 2 1
NDK Unknown Unknown
Unknown Unknown Unknown
Crystal: Ceramic - 28.224 NDK Shielding / Bracket - Antenna Connectors Shielding: Large - Digital Radio FE
2 1 1
7.90 25.00 43.00
4.50 11.50 42.30
$ 0.200 $ 0.200 $ 0.020 $ 0.040 $ 0.040 $ 0.040
Mother Board, Side 1
1 1 1 1 1 1
Unknown NDK NDK NDK Unknown Murata
A3ZPL Unknown Unknown Unknown 26000 K343YS XNCHH
Crystal: Ceramic - A3ZPL Crystal: Ceramic - T10.000 NDK Crystal: Ceramic - 27.000 NDK Crystal: Ceramic - 26.000 NDK Crystal: Ceramic - 26000 Oscillator: TCXO
2 4 4 4 4 6
3.20 5.00 3.20 3.20 3.20 2.50
1.50 3.20 2.50 2.50 2.50 2.00
$ $ $ $ $ $
Mother Board, Side 2
1
NDK
Unknown
Crystal: Ceramic - T66.000 NDK
4
5.00
3.20
$ 0.200 $ 0.200
Daughter Board, Side 1
1
NDK
Unknown
Crystal: Ceramic - 25.000 NDK
4
2.50
2.00
$ 0.200 $ 0.200
Daughter Board, Side 2
2
Unknown
4L00
Crystal: Metal
2
6.40
3.00
$ 0.170 $ 0.340
TOTALS
Copyright © 2015, TechInsights
7 June 2017
24
83
Copyright © Munro & Associates, Inc. 2015
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0.200 2.530 0.040 0.200 2.000
0.200 0.200 0.200 0.200 0.200 0.620
$ $ $ $ $ $
0.200 2.530 0.040 0.200 2.000
0.200 0.200 0.200 0.200 0.200 0.620
$8.75
BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 416
Active Discrete Components Package Location
Qty
Form
Main Board, Side 1
2 7 2 4 1 7 7 1 1 5 1
Small Active Small Active Small Active Small Active Small Active Small Active Small Active Small Active Small Active Small Active Small Active
MOSFET - Si4453 Transistor, Small - 3N WUs MOSFET - SQJ848 Diode, SMT Diode, SMT - Y Transistor, Small Transistor, Small Transistor, Small - TE Transistor, Small - 3S WNs Transistor, Small - Dt3 MOSFET - uPA1816
Main Board, Side 2
5 2 8 1 4 15 3 6 1 1 1 2 2
Small Active Small Active Small Active Small Active Small Active Small Active Small Active Small Active Small Active Small Active Small Active Small Active Small Active
Transistor, Small - Dt3 Diode, SMT MOSFET - SQJ848 MOSFET - SQ4401EY Transistor, Small Transistor, Small Diode, SMT Diode, SMT Transistor, Large Transistor, Small - BC847BS Transistor, Large - FZT651 Transistor, Small - 3N WUs Transistor, Small - TF
Radio Board, Side 1
1
Small Active
MOSFET - PHK04P02T
Radio Board, Side 2
1
Small Active
Transistor, Small
Power Board, Side 1
4 1
Small Active Small Active
Diode, SMT - MELF TVS Diode, SMT - SM6A27
Mother Board, Side 1
1 2 2 8 1
Small Active Small Active Small Active Small Active Small Active
MOSFET - Si4453 Diode, SMT - SSC54 Transistor, Small - TE, TF Transistor, Small Diode, SMT - MELF
Mother Board, Side 2
2 1 7 1 2 2 2 2 5
Small Active Small Active Small Active Small Active Small Active Small Active Small Active Small Active Small Active
MOSFET - SQ4840 MOSFET - uPA1816 Transistor, Small Transistor, Small Diode, SMT - SSC54 Transistor, Small - Ht9 Transistor, Small - 3Ft Transistor, Small - Dt3 Transistor, Small
Daughter Board, Side 1
1 3
Small Active Small Active
MOSFET - uPA1760 Diode, SMT
Daughter Board, Side 2
1 2 1 2 1 2 1
Small Active Small Active Small Active Small Active Small Active Small Active Small Active
Transistor, Small - BC847BS Diode, SMT Transistor, Small Transistor, Small Transistor, Small - TE LED, Single MOSFET - uPA1760
TOTALS
Copyright © 2015, TechInsights
7 June 2017
Estimated Costs
Functional Description Top Marking
Pin Count
Length (mm)
Width (mm)
4453 AB W43B 3N WUs QJ848 CK W42M S6 Y 1GW 3d, A COKS, 1 KS 42, 5CW 41 38 WNS, 39 A4S, t08, t06 TE 3S WNs Dt3 A1816 412
8 6 4 2 2 3 3 6 6 6 8
4.90 2.10 4.80 1.67 1.60 2.90 2.00 2.90 2.10 2.10 4.40
3.90 1.20 4.30 1.37 1.10 1.30 1.20 1.50 1.20 1.20 3.00
$0.500 $0.030 $0.360 $0.015 $0.015 $0.030 $0.030 $0.030 $0.030 $0.030 $0.260
$1.000 $0.209 $0.720 $0.060 $0.015 $0.209 $0.209 $0.030 $0.030 $0.150 $0.260
Dt3 EO S4 QJ848 BF W41M Q4401E AT W43B t06, 1Gt, t30, 39 A4 s 8P T, 1GW 3d, A7W 3d, t16 3d, 21 Z12 V3, tAN 3o BK W39, HU AN S6, 44, L2 AM W41 1Ft FZT 651 3N WUs TF
6 2 4 8 3 3 2 2 4 6 4 6 6
2.10 2.80 4.80 4.90 2.00 2.90 2.50 1.67 4.40 2.10 6.50 2.10 2.90
1.20 1.80 4.30 3.90 1.20 1.30 1.50 1.37 2.40 1.20 3.50 1.20 1.50
$0.030 $0.015 $0.360 $0.500 $0.030 $0.030 $0.015 $0.015 $0.150 $0.030 $0.180 $0.030 $0.030
$0.150 $0.030 $2.880 $0.500 $0.120 $0.449 $0.045 $0.089 $0.150 $0.030 $0.180 $0.060 $0.060
K04P02T NXP 26 06 n1412
8
5.00
4.14
$0.180
$0.180
A7W 3d
3
2.90
1.30
$0.030
$0.030
None SM6A27 1405
2 2
3.34 13.30
1.71 8.40
$0.030 $1.410
$0.120 $1.410
4453 AR W39B S54 44 TE, TF M8W 3d, A7W 3d, 1GW 3d, WOs 36 None
8 2 6 3 2
5.00 6.80 2.90 2.90 3.10
4.00 5.90 1.50 1.30 1.50
$0.500 $0.170 $0.030 $0.030 $0.030
$0.500 $0.340 $0.060 $0.239 $0.030
Q4840 AJ W39B A1816 351 t30, t06, 13t TF S54 44 Ht9 3Ft Dt3 1GW 3d, M8W 3d
8 8 3 6 2 6 6 6 3
5.00 4.40 2.10 2.90 6.80 2.10 2.10 2.10 2.90
3.80 3.00 1.20 1.50 5.90 1.20 1.20 1.20 1.30
$0.090 $0.090 $0.030 $0.030 $0.170 $0.030 $0.030 $0.030 $0.030
$0.180 $0.090 $0.209 $0.030 $0.340 $0.060 $0.060 $0.060 $0.150
A1760 344 S6
8 2
5.00 1.67
4.30 1.37
$0.090 $0.015
$0.090 $0.045
1Ft S6 XMs 3N 3N SWs, t30 TE None A1760 344
6 2 3 3 6 2 8
2.10 1.67 2.90 2.10 2.90 1.20 5.00
1.20 1.37 1.30 1.20 1.50 0.80 4.30
$0.090 $0.015 $0.030 $0.030 $0.030 $0.050 $0.090
$0.090 $0.030 $0.030 $0.060 $0.030 $0.100 $0.090
148
583
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
Each
Total
$12.28
BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 417
Passive Discrete Components Package Location
Qty
Form
Each
Total
Main Board, Side 1
Capacitor Capacitor Capacitor Coil Coil Coil Coil Coil Coil Capacitor Small Passive
Poly Small SM Electrolytic, Medium - 47uF Electrolytic, Large - 470uF SMT, Large - 2R0ML M3N2 SMT, Small - M3D2 SMT, Large - 200uH SMT, Large - Shielded SMT, Small - Shielded SMT, Small - 1uH Tantalum / Niobium, Large Cap, Res, Ferrite
2 2 2 3 2 4 2 2 2 2 2
$0.070 $0.040 $0.130 $0.580 $0.290 $0.900 $0.400 $0.360 $0.250 $0.150 $0.004
$0.070 $0.240 $1.040 $0.580 $0.580 $0.900 $0.800 $0.360 $0.250 $0.300 $1.960
Main Board, Side 2
1 459 4
Coil Small Passive Coil
SMT, Small Cap, Res, Ferrite SMT, Small
2 2 2
$0.050 $0.004 $0.250
$0.050 $1.836 $1.000
Radio Board, Side 1
159 1 6 3 1
Small Passive Capacitor Small Passive Coil Small Passive
Cap, Res, Ferrite Electrolytic, Medium - 47uF Coil, Inductor SMT, Small Ferrite Array
2 2 2 2 8
$0.004 $0.040 $0.008 $0.050 $0.007
$0.636 $0.040 $0.048 $0.150 $0.007
Radio Board, Side 2
9 204 1 4
Coil Small Passive Small Passive Small Passive
SMT, Small Cap, Res, Ferrite Ferrite Array Coil, Inductor
2 2 8 2
$0.250 $0.004 $0.007 $0.008
$2.250 $0.816 $0.007 $0.032
Power Board, Side 1
39 3 2 2
Small Passive Capacitor Coil Small Passive
Cap, Res, Ferrite Electrolytic, Large - 470uF SMT, Large - 200uH Resistor - 1R1
2 2 4 2
$0.004 $0.130 $0.900 $0.004
$0.156 $0.390 $1.800 $0.008
Mother Board, Side 1
3 2 8 6 1 3 510
Coil Filter Small Passive Coil Coil Capacitor Small Passive
SMT, Large - 1.5uH Ceramic, Small Coil, Inductor SMT, Small SMT, Small - M3D2 Electrolytic, Medium Cap, Res, Ferrite
2 6 2 2 2 2 2
$0.400 $0.065 $0.008 $0.250 $0.290 $0.040 $0.004
$1.200 $0.130 $0.064 $1.500 $0.290 $0.120 $2.040
Mother Board, Side 2
3 3 2 1 395
Capacitor Coil Small Passive Filter Small Passive
Tantalum / Niobium, Small SMT, Small Coil, Inductor Ceramic, Small Cap, Res, Ferrite
2 2 2 2 2
$0.050 $0.250 $0.008 $0.065 $0.004
$0.150 $0.750 $0.016 $0.065 $1.580
Daughter Board, Side 1
318 2
Small Passive Coil
Cap, Res, Ferrite SMT, Small - 1R2 YL
2 2
$0.004 $0.250
$1.272 $0.500
Daughter Board, Side 2
382 2 6
Small Passive Capacitor Coil
Cap, Res, Ferrite Tantalum / Niobium, Small SMT, Small
2 2 2
$0.004 $0.050 $0.250
$1.528 $0.100 $1.500
1
Small Passive
Resistor
2
$0.004
Interconnect Board, Side 1
7 June 2017
Pin Count
1 6 8 1 2 1 2 1 1 2 490
TOTALS
Copyright © 2015, TechInsights
Estimated Costs
Functional Description
3061
Copyright © Munro & Associates, Inc. 2015
6149
www.LeanDesign.com
$0.004
$29.12
BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 418
Connectors Estimated Costs
Package Location
Qty
Form
Pin Count
Length (mm)
Width (mm)
Each
Total
Interconnect Board, Side 1
1 2 1
Bd to Bd: Female - Hard Drive Connector: Threaded Insert, Gnd Bd to Bd: Male - Mother Brd
29 1 60
45.70 13.20 31.50
5.50 13.20 6.20
$1.530 $0.020 $1.730
$1.530 $0.040 $1.730
Main Board, Side 1
1
Bd to Bd: Male - Heat Sink Fan
3
9.90
5.00
$0.060
$0.060
Main Board, Side 2
1 1
Bd to Bd: Male - Mother Board16 Bd to Bd: Female - Mother Board120
16 120
23.80 35.00
9.80 7.50
$1.190 $2.100
$1.190 $2.100
Mother Board, Side 1
1 2 1 1 1 3 3
Connector: Accessory - APIX Connector: Gnd Pin / Standoff Bd to Bd: Male - Main120 Bd to Bd: Female - Main16 Bd to Bd: Male - Interconnect Connector: USB - USB1 - 3 Connector: Antenna Coax - BT, WLAN, GPS
6 1 120 16 60 4 1
27.40 12.50 35.00 23.80 33.10 32.90 24.00
14.10 8.10 7.50 9.80 7.80 11.00 9.50
$1.240 $0.140 $2.100 $1.190 $1.730 $1.140 $1.140
$1.240 $0.280 $2.100 $1.190 $1.730 $3.420 $3.420
Mother Board, Side 2
1
Connector: Edge - Daughter Brd
230
75.80
10.70
$4.890
$4.890
Power Board, Side 1
1 1 1
Connector: Vehicle Wiring Harness Bd to Bd: Male - Header, Main32 Bd to Bd: Male - Header, Main40
40 32 40
49.70 32.20 38.50
43.00 4.20 4.20
$2.450 $0.460 $0.910
$2.450 $0.460 $0.910
Radio Board, Side 2
1 1 3
Bd to Bd: Male - Header, Main36 Bd to Bd: Male - Header, Main32 Connector: Antenna Coax - AM/FM1, FM2, Sat Radio
36 32 1
36.00 32.30 27.00
4.60 4.60 8.90
$0.460 $0.460 $1.140
$0.460 $0.460 $3.420
TOTALS
Copyright © 2015, TechInsights
7 June 2017
28
862
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
$33.08
BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 419
Electronic Assembly Metrics
Assembly Weight (grams)
5289.4
40.9
Avg. Pin Count
46
39.5 19.3 21.6 31.6 9.8 20.3
Connection Density (Connections/sq.cm)
784.6
Routing Density (cm of routing per sq.cm of substrate)
696.8 164.4 1338.0 1752.0 488.4 642.6 5082.2 207.2 207.2
Component Density (Components/sq.cm)
System Totals
8 4 6 8 6 6 38 8 8
Number of Connections
Sirius XM Radio Module: Sirius XM Radio Board
87.1 41.1 223.0 219.0 81.4 107.1 758.7 25.9 25.9
Number of Components
Daughter Board Interconnect Board Main Board Mother Board Power Board Radio Board
Circuit Area (sq.cm)
Main Electronics Main Electronics Main Electronics Main Electronics Main Electronics Main Electronics Main Electronics Totals Subsystem Electronics Subsystem Electronics Totals
Assembly Name
Metal Layers
General Area
Substrate Area (sq.cm)
Electronic Assembly Metrics by Assembly
743 5 1119 1036 54 414 3371 279 279
3346 93 3592 5017 218 1425 13691 1158 1158
8.5 0.1 5.0 4.7 0.7 3.9 4.4 10.8 10.8
38.4 2.3 16.1 22.9 2.7 13.3 18.0 44.7 44.7
4.5 18.6 3.2 4.8 4.0 3.4 4.1 4.2 4.2
43.00 19.80 262.60 173.10 115.80 152.10 766.40 41.50 41.50
3650
14849
4.7
18.9
4.1
807.90
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights
7 June 2017
Copyright © Munro & Associates, Inc. 2015
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 420
Electronic Assembly Metrics
Daughter Board Interconnect Board Main Board Mother Board Power Board Radio Board Hard Drive Sirius XM Radio Module System Totals
Card Test
Insertion
Substrates
Connector Components
Passive Components
Assembly Name
Total
Main Electronics Main Electronics Main Electronics Main Electronics Main Electronics Main Electronics Main Electronics Totals Subsystem Electronics Subsystem Electronics Subsystem Electronics Totals
Modular & Odd Form Components
Integrated Circuits
General Area
Small Active Components
Electronics Costs by Assembly
$ $ $ $ $ $ $ $ $ $
99.45 4.50 102.68 138.75 10.74 45.77 401.89 33.49 33.49
$ $ $ $ $ $ $ $ $ $
82.37 64.85 95.16 30.94 273.32 23.62 23.62
$ $ $ $ $ $ $ $ $ $
0.54 5.67 1.82 0.72 8.75 5.43 5.43
$ $ $ $ $ $ $ $ $ $
0.56 7.63 2.35 1.53 0.21 12.28 0.21 0.21
$ $ $ $ $ $ $ $ $ $
4.90 0.00 9.97 7.90 2.35 3.99 29.12 1.26 1.26
$ $ $ $ $ $ $ $ $ $
3.30 3.35 18.27 3.82 4.34 33.08 0.19 0.19
$ $ $ $ $ $ $ $ $ $
5.21 0.76 3.57 5.15 1.82 2.21 18.72 0.95 0.95
$ $ $ $ $ $ $ $ $ $
3.89 0.05 5.86 5.54 0.31 2.25 17.89 1.49 1.49
$ $ $ $ $ $ $ $ $ $
1.98 0.38 1.79 2.57 0.91 1.11 8.74 0.35 0.35
$
435.39
$
296.93
$
14.18
$
12.49
$
30.38
$
33.26
$
19.67
$
19.38
$
9.09
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 421
Electronic Assembly Metrics Small Active Component Connections
Passive Components
Passive Component Connections
Connectors
Connector Connections
Subsystem IOs
Opportunities
System Totals
Small Active Components
Hard Drive Sirius XM Radio Module
Modular/Odd Form Component Connections
Daughter Board Interconnect Board Main Board Mother Board Power Board Radio Board
Modular/Odd Form Components
Main Electronics Main Electronics Main Electronics Main Electronics Main Electronics Main Electronics Main Electronics Totals Subsystem Electronics Subsystem Electronics Subsystem Electronics Totals
Assembly Name
IC Connections
General Area
IC Package Count
Counts by Assembly
16 0 41 41 0 12 110 0 7 7
1867 0 1104 2502 0 541 6014 0 499 499
3 0 7 7 0 7 24 0 6 6
8 0 33 28 0 14 83 0 52 52
14 0 89 38 5 2 148 0 12 12
51 0 355 156 10 11 583 0 26 26
710 1 979 937 46 388 3061 0 253 253
1420 2 1961 1882 96 788 6149 0 548 548
0 4 3 13 3 5 28 0 1 1
0 91 139 449 112 71 862 0 33 33
0 0 0 0 0 0 0 26 33 59
4089 98 4711 6053 272 1839 17062 26 1470 1496
117
6513
30
135
160
609
3314
6697
29
895
59
18558
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 422
Electronic Assembly Metrics
Sirius XM Radio Module System Totals
119
117
6513
1627.5
Non-Volatile Memory (KBytes)
695.9 267.9 432.1 107.1 1503.0 124.5 124.5
Volatile Memory (KBytes)
1867 1104 2502 541 6014 499 499
Package Connections per sq.cm of Package Area
16 41 41 12 110 7 7
Die Area/Package Area Ratio
Daughter Board Main Board Mother Board Radio Board
Package Area (sq.mm)
Die Area (sq.mm)
18 41 41 12 112 7 7
Assembly Name
1753.1 2173.8 2512.0 1245.9 7684.7 471.1 471.1
0.40 0.12 0.17 0.09 0.20 0.26 0.26
106.5 50.8 99.6 43.4 78.3 1.1 105.9
1048576 65536 524288 16384 1654784 65536 65536
8392704 65536 4609 1032 8463881 4096 4096
8155.8
0.20
79.9
1720320
8467977
Substrate Tiling Density (die area / substrate area)
Number of Package Connections
Main Electronics Main Electronics Main Electronics Main Electronics Main Electronics Totals Subsystems Subsystem Electronics Totals
IC Package Count
General Area
IC Die Count
IC Metrics
0.08 0.01 0.02 0.01
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 423
Electronic Costs Breakdown Estimated Cost of Electronics
(Includes XM Radio Subsystem Electronics, but not Hard Drive)
$435.39
Substrates 5%
Insertion 4%
Card Test 2%
Connector Components 8% Passive Components 7%
Small Active Components 3% Integrated Circuits 68% Modular & Odd Components 3%
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 424
Vendor IC Cost Distribution Pkg. Brand Micron Intel STMicroelectronics Texas Instruments Xilinx NVIDIA
* Includes Subsystem Vendors & Associated Costs
Cost $40.25 $38.53 $35.59 $32.11 $31.79 $30.75
Other NXP Semiconductor Rohm Marvell Semiconductor Atmel UBlox Spansion Inova Semiconductor AKM Semiconductor ISSI Silicon Labs Analog Devices
$26.73 $8.94 $7.81 $5.69 $5.22 $4.72 $3.44 $3.36 $3.32 $3.09 $3.07
Intel 13% Micron 14%
Other 29%
NVIDIA 10%
STMicro 12% Xilinx 11%
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Texas Instruments 11%
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 425
Non-Electronic Cost Estimate Subsystem
Part ID No.
Qty
Heat Sink
15 16 17 18 19
1 1 1 1 1
Housing, Heat Sink / Fan Enclosure, Fan Heat Sink Clip, Heat Sink Compound, Heat Sink
Molded Molded Extruded + Cut Stamped + Formed
PA 66 = Polyamide Rubber Aluminum Steel
116.3 x 103.2 44.8 x 42.7 44.7 x 43 21.7 x 15
Housing
1 2 3 4 6 7 8 9 10 11 12 13 14
1 1 1 1 1 1 1 1 1 1 1 1 1
Housing, Main Housing, Lower Housing, Cover Bracket, Hard Drive Bracket, Main Connector Bracket, Antenna Connectors Bracket, Power Board Bracket, Sirus / XM Module Bracket, Fiber Optic Cable Guide, Fiber Optic Cable Retainer, Fiber Optic Cable Retainer, FB Cable @ Main Connector Guide, FB Cable
Cast + Machined + Tapped Cast + Tapped Cast Stamped + Formed Stamped + Formed Stamped + Formed Stamped + Formed + Tapped Stamped + Formed Stamped + Formed Molded Stamped + Formed Stamped + Formed Molded
AZ91D = Magnesium Alloy AZ91D = Magnesium Alloy AZ91D = Magnesium Alloy Steel Steel Steel Steel Steel Steel Plastic Steel Steel Rubber
229 x 157 x 98 180 x 143 x 33 153.7 x 142.7 x 27.8 101.4 x 94.9 x 16.8 96.6 x 75.6 x 12.5 96.6 x 30.7 x 8.3 109.9 x 82 x 21.4 74.1 x 43.8 x 27.1 25 x 6.2 x 9.3 23.3 x 9 x 8.4 22.9 x 11.1 x 8 16.6 x 11 x 3.6 12 x 10.8 x 9.2
Misc
20 21 22 23 24 25 26 27 28 29 30 31
12 2 1 2 1 4 44 1 1 2 10 1
Thermal Pads Slide Strain Relief Fiber Optic Cables Seal RTV Screws Tape, Kapton Label, Main Label, Large Label, Small Tape, White
Die-Cut Molded Molded Extruded + Coated Dispensed Dispensed Extruded + Threaded Die-Cut Die-Cut + Printed Die-Cut + Printed Die-Cut + Printed Die-Cut
Silicon Plastic POM Glass Conductive Foam Silicon Steel Polyimide + Adhesive Paper + Adhesive Plastic + Adhesive Plastic + Adhesive Plastic + Adhesive
Total
Fabrication Process
Material
Dimensions (mm) x x x x
35.9 22.1 25.1 10.4 x
x 24.7 x 11.3 x 5.9 33.8 x 30 x 18.1 185 x 3.8 x 1.5 x x x 23 x 13.2 x 0.05 130 x 110 x 0.07 50.1 x 20.4 x 0.05 x 52 x 10.3 x 0.07
Weight Est'd Cost Est'd (grams) Each Extended Cost 19.40 5.60 58.20 2.20 1.00 397.20 205.90 102.90 60.40 21.90 6.60 70.40 27.50 1.40 0.50 0.70 0.30 0.40 0.00 1.40 3.30 1.40 1.50 4.00 0.00 0.01 1.10 0.20 0.00 0.01
1.440 0.170 2.070 0.090 0.030
1.440 0.170 2.070 0.090 0.030
28.090 10.850 6.030 1.740 0.920 0.290 2.070 1.080 0.060 0.020 0.040 0.030 0.020
28.090 10.850 6.030 1.740 0.920 0.290 2.070 1.080 0.060 0.020 0.040 0.030 0.020
0.040 0.020 0.120 0.240 0.080 0.010 0.010 0.020 0.260 0.050 0.020 0.010
0.480 0.040 0.120 0.480 0.080 0.040 0.440 0.020 0.260 0.100 0.200 0.010
Estimated Cost
99
Copyright © 2015, TechInsights
7 June 2017
Description
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$57.31
BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 426
Final Ass’y Labor & Test Cost Estimate
Final Assembly & Test Made in Number of parts Est'd number of steps Est'd time (seconds)
Est'd final assembly cost Est'd final test cost
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Germany 114 422 1645 $ $
21.02 1.25
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 427
Cost Summary Estimated Cost Totals Main Electronic Assemblies Hard Drive & Sirius XM subsystems Non-Electronic Parts Final Assembly & Test
Total
$ $ $ $
401.89 77.17 57.31 22.27
Cost Total Notes: Estimated final assembly cost includes labor only. Total cost does not include Non-recurring, R&D, G&A, IP licensing fees/royalties, software, sales & marketing, distribution. Assumes fully scaled production.
$ 558.65 Non-Electronic Parts 10%
Final Assembly & Test 4%
Hard Drive & Sirius XM Subsystems 14%
Main Electronic Assemblies 72%
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Cost Estimation Process (Overview & Discussion) Cost modeling is tricky business. Multiple variables affect the actual production costs a manufacturer will experience, including development expenses, unit volumes, supply-and-demand in component markets, die yield-curve maturity, OEM purchasing power, and even variations in accounting practices. Different cost modeling methods employ different assumptions about how to handle these and other variables, but we can identify two basic approaches: that which seeks to track short-term variations in the inputs to the production process, and that which strives to maintain comparability of the output of the model across product families and over time. TechInsights’ philosophy in cost modeling is to emphasize consistency across products and comparability over time, rather than to track short-term fluctuations. During the past eight years, we have developed an estimation process that, while necessarily lacking an insider’s knowledge of the cost factors that impact any one manufacturer, is reasonably accurate in its prediction of unit costs in high-volume production environments. We do not claim that the model will produce the “right” answer for your firm’s environment. However, TechInsights does give customers a key analytical tool with a complete set of data in our Bill of Materials (BOM). The BOM allows readers to 1) scrutinize the assumptions behind our cost model and 2) modify the results based on substitution of their own component cost estimates where they have better information based on inside knowledge. Our estimation process decomposes overall system cost into three major categories: Electronics, Mechanical, and Final Assembly. We begin by creating a complete electronics bill-of-materials (BOM). Each component from the largest ASIC to the smallest discrete resistor is entered into a BOM table with identifying attributes such as size, pitch, I/O count, package type, manufacturer, part number, estimated placement cost, and die size (if the component is an IC). Integrated circuit costs are calculated from measured die area. Using assumptions for wafer size, process type, number of die per wafer, defect density, and profit margin in combination with die area, an estimate of semiconductor cost is derived. Costs for discrete components and interconnect are derived from assumption tables which relate BOM line items to specific cost estimates by component type and estimates for part placement costs are included. For LCD display costs, we employ a model which tabulates expected cost from measurements of glass area, LCD type, and total pixel resolution. When market costs are available from alternative sources, LCD panel costs are taken from and referenced to these sources. Costs of non-electronic components such as molded plastic enclosures and metallic components are measured in terms of weight, size, thickness, type of material, and complexity to arrive at their estimated cost. Other system items such as optics, antennae, batteries and displays are costed from a set of assumption tables derived from a combination of industry data, average high volume costs, and external sources. For final assembly, we re-build the torn-down product, tabulating stepwise assembly times as the reconstruction proceeds, to reach a total assembly time. Using a labor rate assumption for the country of origin, we then calculate final assembly cost. The three major categories for system cost contributors can be broken down into the subcategories of ICs, other electronics parts, displays, batteries (as appropriate), camera modules, electronics assembly, non-electronic elements, and final assembly. By adding the cost estimates for each of these subcategories, an overall estimated cost is derived for the system under evaluation. Product packaging and accessories (CDs, cables, etc.) are also documented and estimated for their contribution to total cost as appropriate. We believe our cost estimates generally fall within 15 percent of the “right answer,” which itself can vary depending on the market and OEM-specific factors mentioned earlier. While the TechInsights cost model is imperfect, it yields important insights into technology and business dynamics along with good first-order contributions to system cost by component type. Additionally, the consistency of approach and gradual modification to assumptions (smoothing out frequently-shifting pricing factors) hopefully yields a credible, but user-modifiable, view of OEM high volume cost-to-produce. Please feel free to contact us at [email protected] with any comments, questions, or proposed corrections with respect to our cost estimates. We welcome your input. Copyright © 2015, TechInsights
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 429
Metrics (Overview & Discussion) In our product teardowns, we gather a series of metrics for product profiling and comparison. Some metrics focus on system characteristics such as total silicon area, total system semiconductor storage capacity, and total connection count. Other metrics reflect more subtle aspects of electronics assembly such as connection density, average component I/O count, and silicon tiling density. Taken as a whole, the metrics allow deeper comparison and benchmarking across multiple disciplines and multiple products. Key metrics we gather on products are described below along with their definitions and what they tend to say about the system under study. Most metrics can be used both in comparing similar products for benchmarking purposes or for quantifying differences in levels of complexity between dissimilar product types. Data fall into two categories; either “raw” measured data or ratios of these measured data sets. Total Silicon Area : This metric describes the total area of silicon as measured from X-ray or direct measurement of ICs. The area is an expression of the enclosed bare die area and excludes packaging area. The aggregate silicon area is a good benchmark to show how integrated a design might be when making comparisons to similar systems. Total silicon area also reflects the major cost driver for most systems we examine. Silicon Tiling Density : Ratio of Total Silicon Area to total printed circuit board “projected” area (i.e. the simple board area and not the cumulative surface area of both sides of the board). This metric directly reflects the level of efficiency and aggressiveness in integrated circuit packing and placement. Single digit Silicon Tiling Density is typical but silicon coverage of 10% - 20% has been seen in some of the most advanced products we have examined. Higher Tiling Densities often correspond with the use of chip scale packaging (CSPs) or other small form-factor IC packaging technologies. High density circuit boards are also often a supporting technology. Number of Parts : Total component count including ICs, passives, modules, connectors, etc., each separated out in our reporting. Number of Connections : The total number of connections corresponds to the total number of interconnects introduced by the aggregate component set and reflects any electrical connection observed (solder joints, adhesive interconnect, or connector terminal interfaces). Opportunity Count : Opportunity Count is the total number of parts plus the total number of connections; the name reflects that each of these constituent elements represents an opportunity for failure. A high opportunity count means more complex and riskier electronics assembly. Average Pin Count (APC) : Ratio of total number of component terminals to total number of parts, at the system level. This metric reflects the ‘average’ terminal complexity of the components and often provide a signature of integration level and/or “digital-ness” of the overall product. Low APCs reflect a high number of discretes or other low-pincount devices often characteristic of analog circuitry. Conversely, high APCs are characteristic of highly integrated, high-pincount assemblies, often those composed largely of digital integrated circuits. Connection Density : This metric is a ratio of the total Number of Connections to total printed circuit board assembly area, in units of connections per sq. inch. The metric provides data related to the Silicon Tiling Density above, but with an emphasis on complexity of I/O interconnect. For example, with a fixed Connection Density, high tiling density of low-pincount memory chips is more readily achieved than comparable silicon tiling of high pincount logic. Part Density : This metric is a ratio of the total Number of Parts to total printed circuit board assembly area, in units of components per sq. inch. The metric provides data related to the Silicon Tiling Density and Connection Density as described above, but with an emphasis on density and complexity of component packing efficiency. For example, low Part Density of high-pincount devices can pose an equal challenge in Connection Density to high Part Density of low-pincount devices. High Part Density does reflect challenges in surface mount assembly in terms of (typically) precision of placement, number of placements, and engineering of part clearances. Routing Density (heuristic estimate) = 3*(Average Pin Count)*√Part Density. The Routing Density metric is an empirically derived relationship that characterizes the wiring density of the interconnect used to support the interconnection of components in a planar electronic assembly (i.e. the circuit board). Architectural issues such as bussing or other factors affecting the regularity of wiring impact the actual Routing Density needed to support a given application, but the metric provides a ready measure of wiring complexity. Copyright © 2015, TechInsights
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BMW i3 Digital Radio Module HBB125 #15200-150210-RBb Page 430
Appendix
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431
Deep Dive Report BMW i3 Optional Equipment Board 5567
Report #15900-141205-SBb
Product Description This Optional Equipment Board is used to take input from sensors on the 2014 BMW i3 for the appropriate processing. Key ICs include an STMicroelectronics #SPC56EL70L5 32-bit auto architecture microcontroller, (2) Infineon #BTS5180 Dual-channel smart high-side power switches, and two transceivers. It is possible, but unconfirmed, that this board processes data from the Steering Angle Sensor or Ride Height Sensors.
DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information. Copyright © 2015, TechInsights. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of TechInsights.
www.teardown.com [email protected]
Product Overview Product Description
Integrated Circuit Metrics
Product Type
Custom
IC Die Count
7
Brand
BMW
IC Package Count
7
Product Name & Model # i3 Optional Equipment Board Official Release Date
5/2/2014
Weight (grams) Product Dimensions (mm)
55.4 (Measured) 122.06 x 91.43 x 17.7 mm (Measured at Longest/Widest/Thickest Points)
Product Features Processor
STMicroelectronics #SPC56EL70L5 32-Bit Auto Architecture Microcontroller
Communications
Infineon #TLE6250GV33 CAN & NXP #TJA1082 FlexRay Transceivers
Power
Infineon #TLE8760 Power Management IC
Cost Metrics Retail Price Total Manufacturing Cost
$31.89
Electronics Cost
$31.89
Manufacturing Cost Breakdown Integrated Circuits
$16.47
51.6%
Modules, Discretes & Connectors
$11.72
36.8%
Substrates
$1.46
4.6%
Component Insertion
$1.51
4.7%
Card Test
$0.73
2.3%
Total $31.89 100.0%
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BMW i3 Optional Equipment Board #15900-141205-SBb – Page 433
Block Diagram
2 - STMicroelectronics #SPC56EL70L5 32-Bit Auto Architecture Microcontroller 1 - ON Semiconductor #LM2901VDG Quad Comparator
3 - Infineon #TLE6250GV33 CAN Transceiver
4 - NXP Semiconductor #TJA1082 FlexRay Transceiver
5 - Infineon #TLE8760 Power Management
Connector
6 - Infineon #BTS5180 6 - Infineon Dual-Channel #BTS5180 High-Side Power Switch Dual-Channel High-Side Power Switch
Estimated block diagram based on observation of this specific product implementation, manufacturer’s data sheets where available, and best engineering judgment. Certain details of the interface circuitry are not reflected in this block diagram. Partitioning and connectivity are speculative.
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BMW i3 Optional Equipment Board #15900-141205-SBb – Page 434
Exterior Features
Front Side of Board Connector
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BMW i3 Optional Equipment Board #15900-141205-SBb – Page 435
Exterior Features
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BMW i3 Optional Equipment Board #15900-141205-SBb – Page 436
Main Board (Side 1 IC Identification)
1 - ON Semiconductor #LM2901VDG Quad Comparator
2 - STMicroelectronics #SPC56EL70L5 32-Bit Auto Architecture Microcontroller
5 - Infineon #TLE8760 Power Management 3 - Infineon #TLE6250GV33 CAN Transceiver
4 - NXP Semiconductor #TJA1082 FlexRay Transceiver
Grid = 1 cm Copyright © 2015, TechInsights
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BMW i3 Optional Equipment Board #15900-141205-SBb – Page 437
Main Board (Side 2 IC Identification)
6 - Infineon #BTS5180 Dual-Channel High-Side Power Switch
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BMW i3 Optional Equipment Board #15900-141205-SBb – Page 438
Main Board Cross-Section
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BMW i3 Optional Equipment Board #15900-141205-SBb – Page 439
Substrate Data Substrates Assembly Name Main Board
Manufacturer
Unknown
Core Material
FR4
Copyright © 2015, TechInsights
7 June 2017
Mfg. Technology
4 Layer Conventional FR4 / HF
Area (cm²)
Layers
4
93.9
Min. Trace Pitch (mm) 0.48
Min. Trace Width (mm) 0.22
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ThruVia Land Dia (mm) 0.62
ThruVia Hole Dia (mm)
BlindVia Land Dia (mm)
0.36
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BlindVia Hole Dia (mm)
Thickness (mm) 1.5
Routing Density
Estimated Costs
16.2 $
1.46
BMW i3 Optional Equipment Board #15900-141205-SBb – Page 440
Integrated Circuit Components Package Info
Estimated Costs
Die Info
Location Pkg Ref. #
Pkg Qty
Brand Name
Main Board, Side 1
1 2 3 4 5
1 1 1 1 1
ON Semiconductor STMicroelectronics Infineon NXP Semiconductor Infineon
Main Board, Side 2
6
2
Infineon
Totals
7
Part Number
Pkg Description
Form
Pin Count
Length (mm)
Width (mm)
Height (mm)
Die Ref #
Die Qty
SOP QFP SOP TSOP QFP
14 144 8 14 48
8.60 20.00 5.00 5.10 6.50
3.80 20.00 3.50 4.40 6.50
1.30 1.50 1.50 0.95 1.00
1.1 2.1 3.1 4.1 5.1
1 1 1 1 1
ON Semiconductor STMicroelectronics Infineon NXP Semiconductor Infineon
139 (M) FL62X2 S0964 ? CF1401B S1234A25
Quad Comparator 32-Bit Microcontroller CAN Transceiver FlexRay Transceiver Power Management
14
8.65
2.65
1.70
6.1
1
Infineon
L8303B1
Dual-Channel High-Side Power 2.38Switch 1.73
LM2901VDG SPC56EL70L5 TLE6250GV33 TJA1082 TLE8760
Quad Comparator 32-Bit Microcontroller CAN Transceiver FlexRay Transceiver Power Management
BTS5180
Dual-Channel High-Side Power Switch SOP
256
Brand Name
Part Number
7
Description
Length (mm)
Width (mm)
1.29 7.51 2.08 2.54 3.96
1.17 6.53 2.00 1.94 3.66
Each
Total
$ 0.150 $ 0.150 $ 12.320 $ 12.320 $ 0.273 $ 0.273 $ 0.342 $ 0.342 $ 2.786 $ 2.786 $
0.298 $
0.596
$16.47
Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.
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BMW i3 Optional Equipment Board #15900-141205-SBb – Page 441
Modular Components Estimated Costs
Package Location
Main Board, Side 1
TOTALS
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Qty
1
Brand Name
Unknown
Part Number
Unknown
Description
Crystal: Metal
1
Pin Count
Length (mm)
Width (mm)
4
3.00
2.50
4
Copyright © Munro & Associates, Inc. 2015
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Each
Total
$ 0.170
$ 0.170
$0.17
BMW i3 Optional Equipment Board #15900-141205-SBb – Page 442
Active Discrete Components Package Location
Qty
Estimated Costs
Functional Description Form
Top Marking
Pin Count
Length (mm)
Width (mm)
Each
Total
Main Board, Side 1
3 1 1
Small Active Small Active Small Active
Diode, SMT MOSFET MOSFET
SG 43 (graphic) CD S44 4P03L11 GSB416 (Infineon logo)
3 2 2
4.11 4.00 6.50
2.96 2.50 6.00
$0.060 $0.090 $0.350
$0.180 $0.090 $0.350
Main Board, Side 2
5 1 1 2 1 4 2
Small Active Small Active Small Active Small Active Small Active Small Active Small Active
Transistor, Small Transistor, Small Transistor, Large MOSFET MOSFET Diode, SMT Diode, SMT
R1t 8C F S 1415 16 BCP55 2N06L65 GRJ413 (Infineon logo) BUK9277 55A 1895 PEm1403C1 MS9 44 (graphic) SG 43 (graphic)
6 3 3 8 4 2 2
2.00 2.50 6.00 5.50 6.50 4.50 4.00
1.00 1.50 3.00 5.00 5.50 3.00 2.50
$0.030 $0.030 $0.150 $0.310 $0.350 $0.060 $0.060
$0.150 $0.030 $0.150 $0.620 $0.350 $0.240 $0.120
TOTALS
21
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$2.28
BMW i3 Optional Equipment Board #15900-141205-SBb – Page 443
Passive Discrete Components Estimated Costs
Package Location
Qty
Functional Description Form
Main Board, Side 1
5 2 1 5 104 2
Main Board, Side 2
143 Small Passive
TOTALS
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Coil Coil Capacitor Capacitor Small Passive Coil
Pin Count
Each
Total
SMT, Small SMT, Large Electrolytic, Medium Electrolytic, Small Cap, Res, Ferrite SMT, CMC
2 2 2 2 2 4
$0.250 $1.350 $0.320 $0.080 $0.004 $0.690
$1.250 $2.700 $0.320 $0.400 $0.416 $1.380
Cap, Res, Ferrite
2
$0.004
$0.572
262
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528
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$7.04
BMW i3 Optional Equipment Board #15900-141205-SBb – Page 444
Connectors Estimated Costs
Package Location
Qty
Main Board, Side 1
TOTALS
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1
1
Form
Connector: Vehicle Wiring
Pin Count
Length (mm)
Width (mm)
Each
Total
26
48.38
15.88
$2.240
$2.240
26
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$2.24
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Electronic Assembly Metrics
375.76
Assembly Weight (grams)
375.8
4
Avg. Pin Count
4
93.9
Connection Density (Connections/sq.cm)
Circuit Area (sq.cm)
93.9
System Totals
Component Density (Components/sq.cm)
Metal Layers
Main Board
Number of Connections
Substrate Area (sq.cm)
Main Electronics
Assembly Name
Number of Components
General Area
Routing Density (cm of routing per sq.cm of substrate)
Electronic Assembly Metrics by Assembly
16.2
292
895
3.1
9.5
3.1
54.80
292
895
3.1
9.5
3.1
54.80
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights
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Electronic Assembly Metrics
Card Test
Insertion
Substrates
Connector Components
Passive Components
Assembly Name
Total
Main Electronics
Modular & Odd Form Components
Integrated Circuits
General Area
Small Active Components
Electronics Costs by Assembly
Main Board
$
31.89
$
16.47
$
0.17
$
2.28
$
7.04
$
2.24
$
1.46
$
1.51
$
0.73
System Totals
$
31.89
$
16.47
$
0.17
$
2.28
$
7.04
$
2.24
$
1.46
$
1.51
$
0.73
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights
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BMW i3 Optional Equipment Board #15900-141205-SBb – Page 447
Electronic Assembly Metrics
IC Package Count
IC Connections
Modular/Odd Form Components
Modular/Odd Form Component Connections
Small Active Components
Small Active Component Connections
Passive Components
Passive Component Connections
Connectors
Connector Connections
Opportunities
Counts by Assembly
Main Board
7
256
1
4
21
81
262
528
1
26
1187
System Totals
7
256
1
4
21
81
262
528
1
26
1187
General Area
Main Electronics
Assembly Name
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights
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Electronic Assembly Metrics
82.4
256
82.4
Non-Volatile Memory (KBytes)
256
7
Volatile Memory (KBytes)
7
7
Package Connections per sq.cm of Package Area
Die Area (sq.mm)
7
System Totals
Die Area/Package Area Ratio
Number of Package Connections
Main Electronics
Assembly Name
Package Area (sq.mm)
IC Package Count
Main Board
General Area
Substrate Tiling Density (die area / substrate area)
IC Die Count
IC Metrics
0.01
560.7
0.15
45.7
0
0
560.7
0.15
45.7
0
0
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights
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Electronic Costs Breakdown Estimated Cost of Electronics $31.89 Connector Components 7%
Substrates 5%
Insertion 5% Card Test 2%
Passive Components 22%
Integrated Circuits 51% Small Active Components 7%
Modular & Odd Components 1%
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights
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Vendor IC Cost Distribution Pkg. Brand STMicroelectronics Infineon NXP Semiconductor ON Semiconductor
Cost $12.32 $3.66 $0.34 $0.15
NXP Semi 2%
ON Semi 1%
Infineon 22%
STMicroelectronics 75%
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights
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Cost Summary Estimated Cost Totals Main Electronic Assemblies
Total
$
31.89
$ 31.89
Cost Total Notes: Estimated final assembly cost includes labor only. Total cost does not include Non-recurring, R&D, G&A, IP licensing fees/royalties, software, sales & marketing, distribution. Assumes fully scaled production.
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Cost Estimation Process (Overview & Discussion) Cost modeling is tricky business. Multiple variables affect the actual production costs a manufacturer will experience, including development expenses, unit volumes, supply-and-demand in component markets, die yield-curve maturity, OEM purchasing power, and even variations in accounting practices. Different cost modeling methods employ different assumptions about how to handle these and other variables, but we can identify two basic approaches: that which seeks to track short-term variations in the inputs to the production process, and that which strives to maintain comparability of the output of the model across product families and over time. TechInsights’ philosophy in cost modeling is to emphasize consistency across products and comparability over time, rather than to track short-term fluctuations. During the past eight years, we have developed an estimation process that, while necessarily lacking an insider’s knowledge of the cost factors that impact any one manufacturer, is reasonably accurate in its prediction of unit costs in high-volume production environments. We do not claim that the model will produce the “right” answer for your firm’s environment. However, TechInsights does give customers a key analytical tool with a complete set of data in our Bill of Materials (BOM). The BOM allows readers to 1) scrutinize the assumptions behind our cost model and 2) modify the results based on substitution of their own component cost estimates where they have better information based on inside knowledge. Our estimation process decomposes overall system cost into three major categories: Electronics, Mechanical, and Final Assembly. We begin by creating a complete electronics bill-of-materials (BOM). Each component from the largest ASIC to the smallest discrete resistor is entered into a BOM table with identifying attributes such as size, pitch, I/O count, package type, manufacturer, part number, estimated placement cost, and die size (if the component is an IC). Integrated circuit costs are calculated from measured die area. Using assumptions for wafer size, process type, number of die per wafer, defect density, and profit margin in combination with die area, an estimate of semiconductor cost is derived. Costs for discrete components and interconnect are derived from assumption tables which relate BOM line items to specific cost estimates by component type and estimates for part placement costs are included. For LCD display costs, we employ a model which tabulates expected cost from measurements of glass area, LCD type, and total pixel resolution. When market costs are available from alternative sources, LCD panel costs are taken from and referenced to these sources. Costs of non-electronic components such as molded plastic enclosures and metallic components are measured in terms of weight, size, thickness, type of material, and complexity to arrive at their estimated cost. Other system items such as optics, antennae, batteries and displays are costed from a set of assumption tables derived from a combination of industry data, average high volume costs, and external sources. For final assembly, we re-build the torn-down product, tabulating stepwise assembly times as the reconstruction proceeds, to reach a total assembly time. Using a labor rate assumption for the country of origin, we then calculate final assembly cost. The three major categories for system cost contributors can be broken down into the subcategories of ICs, other electronics parts, displays, batteries (as appropriate), camera modules, electronics assembly, non-electronic elements, and final assembly. By adding the cost estimates for each of these subcategories, an overall estimated cost is derived for the system under evaluation. Product packaging and accessories (CDs, cables, etc.) are also documented and estimated for their contribution to total cost as appropriate. We believe our cost estimates generally fall within 15 percent of the “right answer,” which itself can vary depending on the market and OEM-specific factors mentioned earlier. While the TechInsights cost model is imperfect, it yields important insights into technology and business dynamics along with good first-order contributions to system cost by component type. Additionally, the consistency of approach and gradual modification to assumptions (smoothing out frequently-shifting pricing factors) hopefully yields a credible, but user-modifiable, view of OEM high volume cost-to-produce. Please feel free to contact us at [email protected] with any comments, questions, or proposed corrections with respect to our cost estimates. We welcome your input. Copyright © 2015, TechInsights
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BMW i3 Optional Equipment Board #15900-141205-SBb – Page 453
Metrics (Overview & Discussion) In our product teardowns, we gather a series of metrics for product profiling and comparison. Some metrics focus on system characteristics such as total silicon area, total system semiconductor storage capacity, and total connection count. Other metrics reflect more subtle aspects of electronics assembly such as connection density, average component I/O count, and silicon tiling density. Taken as a whole, the metrics allow deeper comparison and benchmarking across multiple disciplines and multiple products. Key metrics we gather on products are described below along with their definitions and what they tend to say about the system under study. Most metrics can be used both in comparing similar products for benchmarking purposes or for quantifying differences in levels of complexity between dissimilar product types. Data fall into two categories; either “raw” measured data or ratios of these measured data sets. Total Silicon Area : This metric describes the total area of silicon as measured from X-ray or direct measurement of ICs. The area is an expression of the enclosed bare die area and excludes packaging area. The aggregate silicon area is a good benchmark to show how integrated a design might be when making comparisons to similar systems. Total silicon area also reflects the major cost driver for most systems we examine. Silicon Tiling Density : Ratio of Total Silicon Area to total printed circuit board “projected” area (i.e. the simple board area and not the cumulative surface area of both sides of the board). This metric directly reflects the level of efficiency and aggressiveness in integrated circuit packing and placement. Single digit Silicon Tiling Density is typical but silicon coverage of 10% - 20% has been seen in some of the most advanced products we have examined. Higher Tiling Densities often correspond with the use of chip scale packaging (CSPs) or other small form-factor IC packaging technologies. High density circuit boards are also often a supporting technology. Number of Parts : Total component count including ICs, passives, modules, connectors, etc., each separated out in our reporting. Number of Connections : The total number of connections corresponds to the total number of interconnects introduced by the aggregate component set and reflects any electrical connection observed (solder joints, adhesive interconnect, or connector terminal interfaces). Opportunity Count : Opportunity Count is the total number of parts plus the total number of connections; the name reflects that each of these constituent elements represents an opportunity for failure. A high opportunity count means more complex and riskier electronics assembly. Average Pin Count (APC) : Ratio of total number of component terminals to total number of parts, at the system level. This metric reflects the ‘average’ terminal complexity of the components and often provide a signature of integration level and/or “digital-ness” of the overall product. Low APCs reflect a high number of discretes or other low-pincount devices often characteristic of analog circuitry. Conversely, high APCs are characteristic of highly integrated, high-pincount assemblies, often those composed largely of digital integrated circuits. Connection Density : This metric is a ratio of the total Number of Connections to total printed circuit board assembly area, in units of connections per sq. inch. The metric provides data related to the Silicon Tiling Density above, but with an emphasis on complexity of I/O interconnect. For example, with a fixed Connection Density, high tiling density of low-pincount memory chips is more readily achieved than comparable silicon tiling of high pincount logic. Part Density : This metric is a ratio of the total Number of Parts to total printed circuit board assembly area, in units of components per sq. inch. The metric provides data related to the Silicon Tiling Density and Connection Density as described above, but with an emphasis on density and complexity of component packing efficiency. For example, low Part Density of high-pincount devices can pose an equal challenge in Connection Density to high Part Density of low-pincount devices. High Part Density does reflect challenges in surface mount assembly in terms of (typically) precision of placement, number of placements, and engineering of part clearances. Routing Density (heuristic estimate) = 3*(Average Pin Count)*√Part Density. The Routing Density metric is an empirically derived relationship that characterizes the wiring density of the interconnect used to support the interconnection of components in a planar electronic assembly (i.e. the circuit board). Architectural issues such as bussing or other factors affecting the regularity of wiring impact the actual Routing Density needed to support a given application, but the metric provides a ready measure of wiring complexity. Copyright © 2015, TechInsights
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Appendix
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455
Deep Dive Report CMI BMW i3 10.2” Infotainment Display 2113 / 9306743-04 Report #15900-141006-RBc
Product Description Model 9306743-04 is a 10.2" LCD display manufactured for BMW by CMI (Chi Mei Innolux) and included in 2014 i3 models equipped with the optional Technology + Driving Assistant Package. This package provides drivers with real-time navigation and traffic information during trips as well as access to BMW Online (business, stock, weather updates) and BMW Apps. The device uses a Fujitsu “Indigo-L” MB88F333BA graphics controller to drive a TFT-LCD display featuring 1280 x 480 resolution, 16M colors, and Himax PA3271A and PA6538C display drivers. Communication protocols used are the Automotive PIXel (APIX) link and Serial Peripheral Interface (SPI).
DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information. Copyright © 2015, TechInsights. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of TechInsights.
www.teardown.com [email protected]
Product Overview Product Description
Integrated Circuit Metrics
Product Type
Automotive
IC Die Count**
10
Brand
BMW, manufactured by CMI (Chi Mei Innolux)
IC Package Count**
10
Product Name & Model #
i3 Infotainment Display, 9306743-04
Official Release Date
5/21/2014 ?
Weight (grams)
908.8 (Measured)
Retail Price
Product Dimensions (mm)
286.5 x 131.0 x 57.3 (Measured)
Total Manufacturing Cost Electronics Cost**
Product Features Communications
Graphics Controller
Cost Metrics
Synchronous Serial I/F (SPI) Automotive PIXel (APIX) Link
Integrated Circuits
Fujitsu "Indigo-L" MB88F333BA
$18.43
14.2%
Modules, Discretes & Connectors
$4.75
3.7%
Substrates
$1.25
1.0%
Component Insertion
$1.66
1.3%
Card Test
$0.63
0.5%
None
$93.77
72.5%
Non-Electronic Parts
$8.31
6.4%
Final Assembly & Test
$0.54
0.4%
$129.34
100.0%
Total User Interface
$59.11
Manufacturing Cost Breakdown
Display Subsystem Connectivity
$129.34
None
**Including Subsystems
Key Subsystems Display
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10.2" TFT-LCD, 1280 x 480 Pixels, 16M Colors
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BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 457
TFT Panel
7 - Himax #PA3271A TFT-LCD Display Driver
Backlight Flex
Backlight Flex
Block Diagram
8 - Himax #PA6538C TFT-LCD Display Driver
1 - Maxim #MAX16838A 2-Channel LED Driver Vehicle Wiring Harness 6 - Semtech #SRV05-4A ESD Protection
3 - Fujitsu #MB88F333BA "Indigo-L" Graphics Controller
4 - Maxim #MAX16927 Automotive TFT-LCD Power Supply 5 - Rohm #BD87A29 2.9V Voltage Detector w/ Watchdog Timer
2 - Rohm #BD00KA5W 500 mA Adjustable LDO Regulator
Estimated block diagram based on observation of this specific product implementation, manufacturer’s data sheets where available, and best engineering judgment. Certain details of the interface circuitry are not reflected in this block diagram. Partitioning and connectivity are speculative.
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Product Labels
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Exterior Features
TFT-LCD Display
Mounting Holes
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Exterior Features
Vehicle Wiring Harness
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Major Components (Side 1)
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Major Components (Side 2)
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Component Arrangement
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Teardown Sequence
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Teardown Sequence
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Teardown Sequence
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Teardown Sequence
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Display Subsystem
Shown with polarizers attached. Grid = 1 cm Copyright © 2014, TechInsights
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Display Subsystem 7 - Himax #PA3271A TFT-LCD Display Driver
8 - Himax #PA6538C TFT-LCD Display Driver
Shown with polarizers attached. Grid = 1 cm Copyright © 2014, TechInsights
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Display Subsystem
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Display Subsystem 7-Backlight LEDs
Main Board
Two identical Backlight Flex assemblies are included in the display module.
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Display Subsystem Display Module Brand Part Number Module Dimensions Weight (grams)
Panel Metrics
View Size (mm) Type Colors Rows / Columns Backlighting Scheme
Estimated Costs
Panel(s) Electronic Parts Circuit Assembly Non-Electronic Parts Final Assembly Test Gross Margin
Estimated Module Price
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Unknown Unknown 264 x 109.3 x 18.1 499.60 92 x 244 TFT w/Chip-in-Glass 16777216 480 / 1280 Edge lit - 2-flexes, 7 white LEDs ea $14.04 $31.60 $0.55 $14.51 $0.00 $0.25 $32.82 $93.77
BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 473
Main Board (Side 1)
Vehicle Wiring Harness Display Flex
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Main Board (Side 1 IC Identification) 2 - Rohm #BD00KA5W 500 mA Adjustable LDO Regulator
3 - Fujitsu #MB88F333BA "Indigo-L" Graphics Controller
1 - Maxim #MAX16838A 2-Channel LED Driver
4 - Maxim #MAX16927 Automotive TFT-LCD Power Supply
5 - Rohm #BD87A29 2.9V Voltage Detector w/ Watchdog Timer
6 - Semtech #SRV05-4A ESD Protection
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Main Board (Side 2)
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Main Board Cross-Section
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Substrate Data Substrates Assembly Name Main Brd
Manufacturer
Shenzhen Kinwong Electronic Co LTD
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Core Material
FR4
Mfg. Technology
4 Layer conventional FR4 / HF
Layers
4
Area (cm²) 75.6
Min. Trace Pitch (mm) 0.60
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Min. Trace Width (mm) 0.30
ThruVia Land Dia (mm) 0.60
ThruVia Hole Dia (mm)
BlindVia Land Dia (mm)
0.35
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BlindVia Hole Dia (mm)
Thickness (mm) 1.6
Routing Density
Estimated Costs
18.7 $
1.25
BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 478
Integrated Circuit Components Package Info
Estimated Costs
Die Info
Location Pkg Ref. #
Pkg Qty
Brand Name
1 2 3 4 5 6
1 1 1 1 1 1
Maxim Rohm Fujitsu Maxim Rohm Semtech
Main Brd, Side 1
Totals
6
Part Number MAX16838A BD00KA5W MB88F333BA MAX16927 BD87A29 SRV05-4A
Pkg Description 2-Channel LED Driver 500 mA Adjustable LDO Regulator "Indigo-L" Graphics Controller Automotive TFT-LCD Power Supply 2.9V Voltage Detector w/ Watchdog Timer ESD Protection
Form
Pin Count
Length (mm)
Width (mm)
Height (mm)
Die Ref #
Die Qty
QFN TO QFP QFN SOP SOP
20 5 176 48 8 6
4.00 6.70 24.00 7.00 3.00 3.10
4.00 5.50 24.00 7.00 2.70 1.50
0.85 2.40 1.40 0.80 0.80 1.10
1.1 2.1 3.1 4.1 5.1 6.1
1 1 1 1 1 1
263
Brand Name Maxim Rohm Fujitsu Maxim Rohm Semtech
Part Number 5P22Z CU102 MB88F333 AP14Z CL476 SRV05-4A
6
Description 2-Channel LED Driver 500 mA Adjustable LDO Regulator "Indigo-L" Graphics Controller Automotive TFT-LCD Power Supply Voltage Detector w/ Watchdog Timer ESD Protection
Length (mm)
Width (mm)
2.20 1.50 6.70 3.50 1.50 1.40
1.90 1.50 6.70 2.90 1.40 0.70
Each $ 1.500 $ 0.171 $ 12.100 $ 4.130 $ 0.440 $ 0.087
Total $ 1.500 $ 0.171 $ 12.100 $ 4.130 $ 0.440 $ 0.087
$18.43
Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.
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Subsystem IC Components Note: The ICs listed below are for reference only. Their costs are integrated into the cost of the individual subsystems. Package Info
Estimated Costs
Die Info
Location Pkg Ref. # Display Module: Display Flex
Totals
7 8
Pkg Qty
Brand Name
1 3
4
Himax Himax
Part Number PA3271A PA6538C
Pkg Description TFT-LCD Display Driver TFT-LCD Display Driver
Form Flip Chip, Adhesive Flip Chip, Adhesive
Pin Count
Length (mm)
Width (mm)
Height (mm)
Die Ref #
662 1495
13.60 25.00
1.00 1.40
0.25 0.23
7.1 8.1
5147
Die Qty 1 1
Brand Name Himax Himax
Part Number PA3271A PA6538C
4
Description TFT-LCD Display Driver TFT-LCD Display Driver
Length (mm)
Width (mm)
13.60 25.00
1.00 1.40
Each $ 2.270 $ 5.500
Total $ $
2.270 16.500
$18.77
Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.
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BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 480
Modular Components Estimated Costs
Package Location
Main Brd, Side 1
TOTALS
Qty
1 1
Brand Name
KDS Daishinku Unknown
DSX151GAL 471 WE
Description
Resonator: Resonator Transformer: Transformer
2
Copyright © 2014, TechInsights
7 June 2017
Part Number
Pin Count
Length (mm)
Width (mm)
2 4
11.80 10.00
5.50 8.70
6
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Each
Total
$ 0.180 $ 1.890
$ 0.180 $ 1.890
$2.07
BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 481
Active Discrete Components Package Location
Main Brd, Side 1
TOTALS
Qty
7 2 1 1 1
Functional Description
Small Small Small Small Small
Active Active Active Active Active
Form
Top Marking
Pin Count
Length (mm)
Width (mm)
Transistor, Small Diode, SMT Diode, SMT Diode, SMT Diode, SMT
A7W 3d, 6BW 3o, WM9 3d, WJ3 42 B5 t3d A3 t3 ON C52 1BL3. AD46 SS14
3 2 2 2 2
2.80 2.70 3.70 4.20 4.30
1.30 1.70 2.60 3.60 2.70
12
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Estimated Costs
31
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Each $0.030 $0.015 $0.015 $0.015 $0.015
Total $0.209 $0.030 $0.015 $0.015 $0.015
$0.28
BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 482
Passive Discrete Components Estimated Costs
Package Location
Qty
1 2 5 Main Brd, Side 1 3 1 1 279
TOTALS
Capacitor Small Passive Coil Capacitor Small Passive Small Passive Small Passive
Form
Pin Count
Electrolytic, Small Coil, Inductor SMT, Small Electrolytic, Small Res Array - 472 Res - R180 Cap, Res, Ferrite
2 4 2 2 8 2 2
292
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Functional Description
594
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Each $0.040 $0.008 $0.050 $0.040 $0.007 $0.004 $0.004
Total $0.040 $0.016 $0.250 $0.120 $0.007 $0.004 $1.116
$1.55
BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 483
Connectors Estimated Costs
Package Location
Qty
Main Brd, Side 1
2 1 1
TOTALS
4
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Form
Connector: ZIF - Backlight Flexes Connector: ZIF - Display Flex Connector: Vehicle Wiring Harness
Pin Count
Length (mm)
Width (mm)
Each
Total
6 50 6
10.60 30.70 27.50
4.60 5.40 15.60
$0.092 $0.400 $0.250
$0.184 $0.400 $0.250
68
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$0.83
BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 484
Electronic Assembly Metrics
Connection Density (Connections/sq.cm)
Avg. Pin Count
Assembly Weight (grams)
302.4
Component Density (Components/sq.cm)
302.4
4
Number of Connections
4
75.6
Number of Components
75.6
Routing Density (cm of routing per sq.cm of substrate)
Main Brd
Main Electronics Totals
Circuit Area (sq.cm)
Main Electronics
Assembly Name
Metal Layers
General Area
Substrate Area (sq.cm)
Electronic Assembly Metrics by Assembly
18.7
316
962
4.2
12.7
3.0
47.60
316
962
4.2
12.7
3.0
47.60
Subsystem Electronics
Display Module: Backlight Flex1
8.4
2
16.8
5.9
8
16
1.0
1.9
2.0
0.30
Subsystem Electronics
Display Module: Backlight Flex2
8.4
2
16.8
5.9
8
16
1.0
1.9
2.0
0.30
Subsystem Electronics
Display Module: Display Flex
56.5
2
113.0
272.6
59
5257
1.0
93.0
89.1
3.20
73.3
6
146.6
75
5289
1.0
72.2
70.5
3.80
148.9
10
449
391
6251
2.6
42.0
16.0
51.40
Subsystem Electronics Totals System Totals
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2014, TechInsights
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BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 485
Electronic Assembly Metrics
Main Brd Display Module System Totals
Card Test
Insertion
Substrates
Connector Components
Passive Components
Assembly Name
Total Main Electronics Main Electronics Totals Subsystem Electronics Subsystem Electronics Totals
Modular & Odd Form Components
Integrated Circuits
General Area
Small Active Components
Electronics Costs by Assembly
$ $ $ $
26.71 26.71 32.40 32.40
$ $ $ $
18.43 18.43 18.77 18.77
$ $ $ $
2.07 2.07 -
$ $ $ $
0.28 0.28 0.75 0.75
$ $ $ $
1.55 1.55 0.22 0.22
$ $ $ $
0.83 0.83 -
$ $ $ $
1.25 1.25 11.87 11.87
$ $ $ $
1.66 1.66 0.55 0.55
$ $ $ $
0.63 0.63 0.25 0.25
$
59.11
$
37.20
$
2.07
$
1.03
$
1.77
$
0.83
$
13.12
$
2.21
$
0.88
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2014, TechInsights
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BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 486
Electronic Assembly Metrics
Passive Component Connections
Connectors
Connector Connections
Subsystem IOs
Opportunities
System Totals
Passive Components
Subsystem Electronics Totals
Small Active Component Connections
Display Module
Small Active Components
Subsystem Electronics
Modular/Odd Form Component Connections
Main Brd
Main Electronics Totals
Modular/Odd Form Components
Main Electronics
Assembly Name
IC Connections
General Area
IC Package Count
Counts by Assembly
6
263
2
6
12
31
292
594
4
68
0
1278
6
263
2
6
12
31
292
594
4
68
0
1278
4
5147
0
0
17
34
54
108
0
0
50
5414
4
5147
0
0
17
34
54
108
0
0
50
5414
10
5410
2
6
29
65
346
702
4
68
50
6692
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2014, TechInsights
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BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 487
Electronic Assembly Metrics
Die Area (sq.mm)
Substrate Tiling Density (die area / substrate area)
Package Area (sq.mm)
Die Area/Package Area Ratio
Package Connections per sq.cm of Package Area
Volatile Memory (KBytes)
Non-Volatile Memory (KBytes)
6
6
263
64.6
0.01
690.6
0.09
38.1
0
0
6
6
263
64.6
690.6
0.09
38.1
0
0
4
4
5147
118.6
118.6
1.00
43.4
0
0
4
4
5147
118.6
118.6
1.00
4339.8
0
0
10
10
5410
183.2
809.2
0.23
668.6
0
0
Assembly Name
Main Brd
Main Electronics Totals Subsystems
Number of Package Connections
Main Electronics
IC Package Count
General Area
IC Die Count
IC Metrics
Display Module
Subsystem Electronics Totals System Totals
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2014, TechInsights
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BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 488
Electronic Costs Breakdown Estimated Cost of Electronics
(Includes Subsystem Electronics)
$59.11
Insertion 4%
Card Test 1%
Substrates 22%
Integrated Circuits 63%
Connector Components 1% Passive Components 3% Small Active Components 2%
Modular & Odd Components 4%
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2014, TechInsights
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BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 489
Vendor IC Cost Distribution * Includes Subsystem Vendors & Associated Costs
Pkg. Brand Cost Himax Fujitsu Maxim Rohm Semtech
$18.77 $12.10 $5.63 $0.61 $0.09 Rohm 2%
Semtech 1%
Maxim 15% Himax 50% Fujitsu 32%
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2014, TechInsights
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BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 490
Non-Electronic Cost Estimate Subsystem
Part ID No.
Qty
Housing
1 2 3
1 1 1
Housing, Front Housing, Rear Housing, Inner
Molded Molded Cast
ABS ABS Aluminum
Misc
4 5 6 7 8 9 10 11
2 3 1 1 6 3 2 3
Label, Bar Code - Large Label, Bar Code - Small Tape, Kapton Label, QR Code Pad, Isolation Tape, Black Screw RTV
Die-Cut + Printed Die-Cut + Printed Die-Cut Die-Cut + Printed Die-Cut Die-Cut Extruded + Threaded Dispensed
Paper Paer Kapton Paper Plastic Plastic Steel Silicone
Total
Weight Est'd Cost Est'd (grams) Each Extended Cost
Fabrication Process Material Dimensions (mm) 290 x 127.8 x 13.9 286 x 127.5 x 54.3 271 x 115 x 44
24.00 110.00 221.20
1.080 2.070 4.680
1.080 2.070 4.680
69.8 x 19.8 x 0.06 37.9 x 5.5 x 0.06 32.9 x 7.1 x 0.02 9.7 x 7.8 x 0.06 14 x 14 x 0.3 39.5 x 13.2 x 0.07 13.5 x 4.1 x 2.6 x
0.30 0.15 0.03 0.02 0.60 0.03 0.60 3.00
0.060 0.050 0.020 0.030 0.010 0.010 0.020 0.010
0.120 0.150 0.020 0.030 0.060 0.030 0.040 0.030
Estimated Cost
24
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Description
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$8.31
BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 491
Final Ass’y Labor & Test Cost Estimate
Final Assembly & Test Made in Number of parts Est'd number of steps Est'd time (seconds)
Est'd final assembly cost Est'd final test cost
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China 29 93 316 $
0.24
$
0.30
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BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 492
Cost Summary Estimated Cost Totals Main Electronic Assemblies Display(s) Non-Electronic Parts Final Assembly & Test
Total
$ $ $ $
26.71 93.77 8.31 0.54
$ 129.34
Non-Electronic Parts 8%
Final Assembly & Test 1%
Main Electronic Assemblies 14%
Display Subsystem 77%
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BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 493
Cost Estimation Process (Overview & Discussion) Cost modeling is tricky business. Multiple variables affect the actual production costs a manufacturer will experience, including development expenses, unit volumes, supply-and-demand in component markets, die yield-curve maturity, OEM purchasing power, and even variations in accounting practices. Different cost modeling methods employ different assumptions about how to handle these and other variables, but we can identify two basic approaches: that which seeks to track short-term variations in the inputs to the production process, and that which strives to maintain comparability of the output of the model across product families and over time. TechInsights’ philosophy in cost modeling is to emphasize consistency across products and comparability over time, rather than to track short-term fluctuations. During the past eight years, we have developed an estimation process that, while necessarily lacking an insider’s knowledge of the cost factors that impact any one manufacturer, is reasonably accurate in its prediction of unit costs in high-volume production environments. We do not claim that the model will produce the “right” answer for your firm’s environment. However, TechInsights does give customers a key analytical tool with a complete set of data in our Bill of Materials (BOM). The BOM allows readers to 1) scrutinize the assumptions behind our cost model and 2) modify the results based on substitution of their own component cost estimates where they have better information based on inside knowledge. Our estimation process decomposes overall system cost into three major categories: Electronics, Mechanical, and Final Assembly. We begin by creating a complete electronics bill-of-materials (BOM). Each component from the largest ASIC to the smallest discrete resistor is entered into a BOM table with identifying attributes such as size, pitch, I/O count, package type, manufacturer, part number, estimated placement cost, and die size (if the component is an IC). Integrated circuit costs are calculated from measured die area. Using assumptions for wafer size, process type, number of die per wafer, defect density, and profit margin in combination with die area, an estimate of semiconductor cost is derived. Costs for discrete components and interconnect are derived from assumption tables which relate BOM line items to specific cost estimates by component type and estimates for part placement costs are included. For LCD display costs, we employ a model which tabulates expected cost from measurements of glass area, LCD type, and total pixel resolution. When market costs are available from alternative sources, LCD panel costs are taken from and referenced to these sources. Costs of non-electronic components such as molded plastic enclosures and metallic components are measured in terms of weight, size, thickness, type of material, and complexity to arrive at their estimated cost. Other system items such as optics, antennae, batteries and displays are costed from a set of assumption tables derived from a combination of industry data, average high volume costs, and external sources. For final assembly, we re-build the torn-down product, tabulating stepwise assembly times as the reconstruction proceeds, to reach a total assembly time. Using a labor rate assumption for the country of origin, we then calculate final assembly cost. The three major categories for system cost contributors can be broken down into the subcategories of ICs, other electronics parts, displays, batteries (as appropriate), camera modules, electronics assembly, non-electronic elements, and final assembly. By adding the cost estimates for each of these subcategories, an overall estimated cost is derived for the system under evaluation. Product packaging and accessories (CDs, cables, etc.) are also documented and estimated for their contribution to total cost as appropriate. We believe our cost estimates generally fall within 15 percent of the “right answer,” which itself can vary depending on the market and OEM-specific factors mentioned earlier. While the TechInsights cost model is imperfect, it yields important insights into technology and business dynamics along with good first-order contributions to system cost by component type. Additionally, the consistency of approach and gradual modification to assumptions (smoothing out frequently-shifting pricing factors) hopefully yields a credible, but user-modifiable, view of OEM high volume cost-to-produce. Please feel free to contact us at [email protected] with any comments, questions, or proposed corrections with respect to our cost estimates. We welcome your input. Copyright © 2014, TechInsights
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BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 494
Metrics (Overview & Discussion) In our product teardowns, we gather a series of metrics for product profiling and comparison. Some metrics focus on system characteristics such as total silicon area, total system semiconductor storage capacity, and total connection count. Other metrics reflect more subtle aspects of electronics assembly such as connection density, average component I/O count, and silicon tiling density. Taken as a whole, the metrics allow deeper comparison and benchmarking across multiple disciplines and multiple products. Key metrics we gather on products are described below along with their definitions and what they tend to say about the system under study. Most metrics can be used both in comparing similar products for benchmarking purposes or for quantifying differences in levels of complexity between dissimilar product types. Data fall into two categories; either “raw” measured data or ratios of these measured data sets. Total Silicon Area : This metric describes the total area of silicon as measured from X-ray or direct measurement of ICs. The area is an expression of the enclosed bare die area and excludes packaging area. The aggregate silicon area is a good benchmark to show how integrated a design might be when making comparisons to similar systems. Total silicon area also reflects the major cost driver for most systems we examine. Silicon Tiling Density : Ratio of Total Silicon Area to total printed circuit board “projected” area (i.e. the simple board area and not the cumulative surface area of both sides of the board). This metric directly reflects the level of efficiency and aggressiveness in integrated circuit packing and placement. Single digit Silicon Tiling Density is typical but silicon coverage of 10% - 20% has been seen in some of the most advanced products we have examined. Higher Tiling Densities often correspond with the use of chip scale packaging (CSPs) or other small form-factor IC packaging technologies. High density circuit boards are also often a supporting technology. Number of Parts : Total component count including ICs, passives, modules, connectors, etc., each separated out in our reporting. Number of Connections : The total number of connections corresponds to the total number of interconnects introduced by the aggregate component set and reflects any electrical connection observed (solder joints, adhesive interconnect, or connector terminal interfaces). Opportunity Count : Opportunity Count is the total number of parts plus the total number of connections; the name reflects that each of these constituent elements represents an opportunity for failure. A high opportunity count means more complex and riskier electronics assembly. Average Pin Count (APC) : Ratio of total number of component terminals to total number of parts, at the system level. This metric reflects the ‘average’ terminal complexity of the components and often provide a signature of integration level and/or “digital-ness” of the overall product. Low APCs reflect a high number of discretes or other low-pincount devices often characteristic of analog circuitry. Conversely, high APCs are characteristic of highly integrated, high-pincount assemblies, often those composed largely of digital integrated circuits. Connection Density : This metric is a ratio of the total Number of Connections to total printed circuit board assembly area, in units of connections per sq. inch. The metric provides data related to the Silicon Tiling Density above, but with an emphasis on complexity of I/O interconnect. For example, with a fixed Connection Density, high tiling density of low-pincount memory chips is more readily achieved than comparable silicon tiling of high pincount logic. Part Density : This metric is a ratio of the total Number of Parts to total printed circuit board assembly area, in units of components per sq. inch. The metric provides data related to the Silicon Tiling Density and Connection Density as described above, but with an emphasis on density and complexity of component packing efficiency. For example, low Part Density of high-pincount devices can pose an equal challenge in Connection Density to high Part Density of low-pincount devices. High Part Density does reflect challenges in surface mount assembly in terms of (typically) precision of placement, number of placements, and engineering of part clearances. Routing Density (heuristic estimate) = 3*(Average Pin Count)*√Part Density. The Routing Density metric is an empirically derived relationship that characterizes the wiring density of the interconnect used to support the interconnection of components in a planar electronic assembly (i.e. the circuit board). Architectural issues such as bussing or other factors affecting the regularity of wiring impact the actual Routing Density needed to support a given application, but the metric provides a ready measure of wiring complexity. Copyright © 2014, TechInsights
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BMW (CMI) i3 Infotainment Display #15900-141006-RBc - Page 495
Appendix
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496
Deep Dive Report BMW i3 Back-up Antenna Assembly 2245
Report #15900-150224-PKb
Product Description This report concerns the Back-up Antenna Assembly for the 2014 BMW i3. This module features a secondary PCB antenna housed in a molded plastic top enclosure and a metal internal support.
DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information. Copyright © 2015, TechInsights. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of TechInsights.
www.teardown.com [email protected]
Product Overview Product Description
Integrated Circuit Metrics
Product Type
Automotive
IC Die Count
0
Brand
BMW
IC Package Count
0
Product Name & Model #
i3 Back-up Antenna Assembly
Official Release Date
5/2/2014
Weight (grams)
8.5 (Measured)
Retail Price
Product Dimensions (mm)
99.4 x 65.0 x 27.0 (Measured at Longest/Widest/Thickest Points)
Total Manufacturing Cost
$5.39
Electronics Cost
$1.35
Product Features
Cost Metrics
Manufacturing Cost Breakdown Discretes
$0.01
0.2%
Connectors
$1.14
21.2%
Substrates
$0.11
2.0%
Component Insertion
$0.03
0.6%
Card Test
$0.06
1.1%
Non-Electronics
$3.76
69.8%
Final Assembly & Test
$0.28
5.2%
Total
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$5.39 100.0%
BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 498
Block Diagram
Secondary Antenna
Antenna Connector
Estimated block diagram based on observation of this specific product implementation, manufacturer’s data sheets where available, and best engineering judgment. Certain details of the interface circuitry are not reflected in this block diagram. Partitioning and connectivity are speculative.
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Product Label
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Exterior Features
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Exterior Features
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Major Components (Side 1)
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Major Components (Side 2)
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Teardown Sequence
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Teardown Sequence
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Main Board (Side 1)
PCB Antenna
Antenna Connector
Grid = 1 cm
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Main Board (Side 2)
Grid = 1 cm
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Main Board Cross-Section
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Substrate Data Substrates Assembly Name Antenna Board
Manufacturer
Unknown
Core Material
FR4
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Mfg. Technology
2 Layer conventional FR4 / HF
Area (cm²)
Layers
2
7.6
Min. Trace Pitch (mm) 1.28
Min. Trace Width (mm) 0.65
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ThruVia Land Dia (mm) 1.29
ThruVia Hole Dia (mm)
BlindVia Land Dia (mm)
0.81
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BlindVia Hole Dia (mm)
Thickness (mm) 1.6
Routing Density
Estimated Costs
3.1 $
0.11
BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 510
Passive Discrete Components Estimated Costs
Package Location
Qty
2
TOTALS
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Functional Description
Small Passive
Form
Pin Count
Cap, Res, Ferrite
2
2
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4
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Each
Total
$0.004
$0.008
$0.01
BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 511
Connectors Estimated Costs
Package Location
Antenna Board, Side 1
TOTALS
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Qty
1
1
Form
Jack: Antenna
Pin Count
Length (mm)
Width (mm)
1
23.50
8.57
Each
$1.140 $1.140
1
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Total
$1.14
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BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 512
Electronic Assembly Metrics
15.2
Assembly Weight (grams)
15.2
2
Avg. Pin Count
2
7.6
Connection Density (Connections/sq.cm)
Circuit Area (sq.cm)
7.6
System Totals
Component Density (Components/sq.cm)
Metal Layers
Antenna Board
Number of Connections
Substrate Area (sq.cm)
Main Electronics
Assembly Name
Number of Components
General Area
Routing Density (cm of routing per sq.cm of substrate)
Electronic Assembly Metrics by Assembly
3.1
3
5
0.4
0.7
1.7
4.90
3
5
0.4
0.7
1.7
4.90
NOTE: Occasional inconsistencies in totals may be present due to rounding error.
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Electronic Assembly Metrics
Card Test
Insertion
Substrates
Connector Components
Passive Components
Assembly Name
Total Main Electronics
Modular & Odd Form Components
Integrated Circuits
General Area
Small Active Components
Electronics Costs by Assembly
Antenna Board
$
1.35
$
-
$
-
$
-
$
0.01
$ 1.14
$
0.11
$
0.03
$
0.06
System Totals
$
1.35
$
-
$
-
$
-
$
0.01
$ 1.14
$
0.11
$
0.03
$
0.06
NOTE: Occasional inconsistencies in totals may be present due to rounding error.
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Electronic Assembly Metrics
IC Package Count
IC Connections
Modular/Odd Form Components
Modular/Odd Form Component Connections
Small Active Components
Small Active Component Connections
Passive Components
Passive Component Connections
Connectors
Connector Connections
Opportunities
Counts by Assembly
Antenna Board
0
0
0
0
0
0
2
4
1
1
8
System Totals
0
0
0
0
0
0
2
4
1
1
8
General Area
Main Electronics
Assembly Name
NOTE: Occasional inconsistencies in totals may be present due to rounding error.
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Electronic Costs Breakdown Estimated Cost of Electronics
(Includes Subsystem Electronics)
$1.35
Insertion 2%
Card Test 4%
Passive Components 1%
Substrates 8%
Connector Components 85%
NOTE: Occasional inconsistencies in totals may be present due to rounding error.
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Non-Electronic Cost Estimate Subsystem
Part ID No.
Qty
Miscellaneous
1 2 3 4 5
1 1 1 1 2
Total
Internal Support Cover Medium Label Small Label Screw
Fabrication Process Stamped + Formed Molded Die-Cut + Printed Die-Cut + Printed Cast + Machined
Material Metal PC Plastic Plastic Metal
Dimensions (mm)
Weight Est'd Cost Est'd (grams) Each Extended Cost
83.5 x 63.4 x 21.7 99.4 x 65 x 25.7 25 x 14.41 6.6 x 6.3 7.72 x 4 x 4
55.90 23.60 0.10 0.05 0.36
2.270 1.380 0.050 0.020 0.020
Estimated Cost
6
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Description
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2.270 1.380 0.050 0.020 0.040
$3.76
BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 517
Final Ass’y Labor & Test Cost Estimate
Final Assembly & Test Made in Number of parts Est'd number of steps Est'd time (seconds)
Est'd final assembly cost Est'd final test cost
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Mexico 7 26 96 $ $
0.08 0.20
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Cost Summary Estimated Cost Totals Main Electronic Assemblies Non-Electronic Parts Final Assembly & Test
Total
$ $ $
$
1.35 3.76 0.28
5.39
Cost Total Notes: Estimated final assembly cost includes labor only. Total cost does not include Non-recurring, R&D, G&A, IP licensing fees/royalties, software, sales & marketing, distribution. Assumes fully scaled production.
Final Assembly & Test 5%
Main Electronic Assemblies 25% Non-Electronic Parts 70%
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Cost Estimation Process (Overview & Discussion) Cost modeling is tricky business. Multiple variables affect the actual production costs a manufacturer will experience, including development expenses, unit volumes, supply-and-demand in component markets, die yield-curve maturity, OEM purchasing power, and even variations in accounting practices. Different cost modeling methods employ different assumptions about how to handle these and other variables, but we can identify two basic approaches: that which seeks to track short-term variations in the inputs to the production process, and that which strives to maintain comparability of the output of the model across product families and over time. TechInsights’ philosophy in cost modeling is to emphasize consistency across products and comparability over time, rather than to track short-term fluctuations. During the past eight years, we have developed an estimation process that, while necessarily lacking an insider’s knowledge of the cost factors that impact any one manufacturer, is reasonably accurate in its prediction of unit costs in high-volume production environments. We do not claim that the model will produce the “right” answer for your firm’s environment. However, TechInsights does give customers a key analytical tool with a complete set of data in our Bill of Materials (BOM). The BOM allows readers to 1) scrutinize the assumptions behind our cost model and 2) modify the results based on substitution of their own component cost estimates where they have better information based on inside knowledge. Our estimation process decomposes overall system cost into three major categories: Electronics, Mechanical, and Final Assembly. We begin by creating a complete electronics bill-of-materials (BOM). Each component from the largest ASIC to the smallest discrete resistor is entered into a BOM table with identifying attributes such as size, pitch, I/O count, package type, manufacturer, part number, estimated placement cost, and die size (if the component is an IC). Integrated circuit costs are calculated from measured die area. Using assumptions for wafer size, process type, number of die per wafer, defect density, and profit margin in combination with die area, an estimate of semiconductor cost is derived. Costs for discrete components and interconnect are derived from assumption tables which relate BOM line items to specific cost estimates by component type and estimates for part placement costs are included. For LCD display costs, we employ a model which tabulates expected cost from measurements of glass area, LCD type, and total pixel resolution. When market costs are available from alternative sources, LCD panel costs are taken from and referenced to these sources. Costs of non-electronic components such as molded plastic enclosures and metallic components are measured in terms of weight, size, thickness, type of material, and complexity to arrive at their estimated cost. Other system items such as optics, antennae, batteries and displays are costed from a set of assumption tables derived from a combination of industry data, average high volume costs, and external sources. For final assembly, we re-build the torn-down product, tabulating stepwise assembly times as the reconstruction proceeds, to reach a total assembly time. Using a labor rate assumption for the country of origin, we then calculate final assembly cost. The three major categories for system cost contributors can be broken down into the subcategories of ICs, other electronics parts, displays, batteries (as appropriate), camera modules, electronics assembly, non-electronic elements, and final assembly. By adding the cost estimates for each of these subcategories, an overall estimated cost is derived for the system under evaluation. Product packaging and accessories (CDs, cables, etc.) are also documented and estimated for their contribution to total cost as appropriate. We believe our cost estimates generally fall within 15 percent of the “right answer,” which itself can vary depending on the market and OEM-specific factors mentioned earlier. While the TechInsights cost model is imperfect, it yields important insights into technology and business dynamics along with good first-order contributions to system cost by component type. Additionally, the consistency of approach and gradual modification to assumptions (smoothing out frequently-shifting pricing factors) hopefully yields a credible, but user-modifiable, view of OEM high volume cost-to-produce. Please feel free to contact us at [email protected] with any comments, questions, or proposed corrections with respect to our cost estimates. We welcome your input.
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BMW i3 Back-up Antenna Asm. 2245 #15900-150224-PKb - Page 520
Metrics (Overview & Discussion) In our product teardowns, we gather a series of metrics for product profiling and comparison. Some metrics focus on system characteristics such as total silicon area, total system semiconductor storage capacity, and total connection count. Other metrics reflect more subtle aspects of electronics assembly such as connection density, average component I/O count, and silicon tiling density. Taken as a whole, the metrics allow deeper comparison and benchmarking across multiple disciplines and multiple products. Key metrics we gather on products are described below along with their definitions and what they tend to say about the system under study. Most metrics can be used both in comparing similar products for benchmarking purposes or for quantifying differences in levels of complexity between dissimilar product types. Data fall into two categories; either “raw” measured data or ratios of these measured data sets. Total Silicon Area : This metric describes the total area of silicon as measured from X-ray or direct measurement of ICs. The area is an expression of the enclosed bare die area and excludes packaging area. The aggregate silicon area is a good benchmark to show how integrated a design might be when making comparisons to similar systems. Total silicon area also reflects the major cost driver for most systems we examine. Silicon Tiling Density : Ratio of Total Silicon Area to total printed circuit board “projected” area (i.e. the simple board area and not the cumulative surface area of both sides of the board). This metric directly reflects the level of efficiency and aggressiveness in integrated circuit packing and placement. Single digit Silicon Tiling Density is typical but silicon coverage of 10% - 20% has been seen in some of the most advanced products we have examined. Higher Tiling Densities often correspond with the use of chip scale packaging (CSPs) or other small form-factor IC packaging technologies. High density circuit boards are also often a supporting technology. Number of Parts : Total component count including ICs, passives, modules, connectors, etc., each separated out in our reporting. Number of Connections : The total number of connections corresponds to the total number of interconnects introduced by the aggregate component set and reflects any electrical connection observed (solder joints, adhesive interconnect, or connector terminal interfaces). Opportunity Count : Opportunity Count is the total number of parts plus the total number of connections; the name reflects that each of these constituent elements represents an opportunity for failure. A high opportunity count means more complex and riskier electronics assembly. Average Pin Count (APC) : Ratio of total number of component terminals to total number of parts, at the system level. This metric reflects the ‘average’ terminal complexity of the components and often provide a signature of integration level and/or “digital-ness” of the overall product. Low APCs reflect a high number of discretes or other low-pincount devices often characteristic of analog circuitry. Conversely, high APCs are characteristic of highly integrated, high-pincount assemblies, often those composed largely of digital integrated circuits. Connection Density : This metric is a ratio of the total Number of Connections to total printed circuit board assembly area, in units of connections per sq. inch. The metric provides data related to the Silicon Tiling Density above, but with an emphasis on complexity of I/O interconnect. For example, with a fixed Connection Density, high tiling density of low-pincount memory chips is more readily achieved than comparable silicon tiling of high pincount logic. Part Density : This metric is a ratio of the total Number of Parts to total printed circuit board assembly area, in units of components per sq. inch. The metric provides data related to the Silicon Tiling Density and Connection Density as described above, but with an emphasis on density and complexity of component packing efficiency. For example, low Part Density of high-pincount devices can pose an equal challenge in Connection Density to high Part Density of low-pincount devices. High Part Density does reflect challenges in surface mount assembly in terms of (typically) precision of placement, number of placements, and engineering of part clearances. Routing Density (heuristic estimate) = 3*(Average Pin Count)*√Part Density. The Routing Density metric is an empirically derived relationship that characterizes the wiring density of the interconnect used to support the interconnection of components in a planar electronic assembly (i.e. the circuit board). Architectural issues such as bussing or other factors affecting the regularity of wiring impact the actual Routing Density needed to support a given application, but the metric provides a ready measure of wiring complexity.
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Appendix
Click Here to Return to Cost Analysis Page 130
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522
Deep Dive Report BMW i3 Electrical Digital Motor Assembly 2249
Report #15900-150210-SBb
Product Description The Digital Motor Control Assembly is part of the system electronics for the 2014 BMW i3. It is responsible for control of the engine torque, accelerator pedal, shifting, electric fans, power management for the electrical systems, and the vacuum pump. The Digital Motor Control Assembly is connected to the CAN, LIN, and FlexRay busses. The Infineon TC1793 Microcontroller is used to process information going through the NXP Semiconductor CAN, LIN, and FlexRay transceivers.
DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information. Copyright © 2015, TechInsights. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of TechInsights.
www.teardown.com [email protected]
Product Overview Product Description
Integrated Circuit Metrics
Product Type
Automotive
IC Die Count
11
Brand
Delphi
IC Package Count
10
Product Name & Model # Electrical Digital Motor Assembly 28446920
Cost Metrics
Official Release Date
5/2/2014
Weight (grams) Product Dimensions (mm)
283.2
Retail Price
151.07 x 136.3 x 33.37
Total Manufacturing Cost
$47.50
Electronics Cost
$39.10
Product Features
Manufacturing Cost Breakdown
Microcontrollers
Infineon #TC1793 32-Bit Single-Chip Microcontroller, Freescale #Unknown Microcontroller Integrated Circuits
Transceivers
NXP Semiconductor #TJA1021 LIN Transceiver, #TJA1082 FlexRay Node Transceiver, #TJA1042 CAN Transceiver
Communication
CAN, LIN, FlexRay Busses
$27.97
58.9%
Modules, Discretes & Connectors
$7.01
14.8%
Substrates
$1.62
3.4%
Component Insertion
$1.70
3.6%
Card Test
$0.81
1.7%
Non-Electronic Parts
$7.72
16.3%
Final Assembly & Test
$0.67
1.4%
Total $47.50 100.0%
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BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 524
Block Diagram
1 - Infineon #TC1793 32-Bit Single-Chip Microcontroller
4 - Freescale #MC9S08SG8 8-bit Microcontroller
2 - Unknown #Unknown Power Supply ASIC
11 - NXP Semiconductor #TJA1021 LIN Transceiver
10 - NXP Semiconductor #TJA1082 FlexRay Node Transceiver 3 - Infineon #TLE7233G Four Channel LowSide Relay Switch
6 - Infineon #BTS3410G Low Side Power Switch
Pin Connector Port
9 - NXP Semiconductor 9 - NXP #TJA1021 Semiconductor CAN Transceiver #TJA1042 CAN Transceiver
Estimated block diagram based on observation of this specific product implementation, manufacturer’s data sheets where available, and best engineering judgment. Certain details of the interface circuitry are not reflected in this block diagram. Partitioning and connectivity are speculative.
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Product Labels
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Exterior Features
Pin Connector Port
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Major Components (Side 1)
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Major Components (Side 2)
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Component Arrangement
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Teardown Sequence
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Teardown Sequence
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Teardown Sequence
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Main Board (Side 1)
Grid = 1 cm Copyright © 2015, TechInsights
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BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 534
Main Board (Side 1 IC Identification) 6 - Infineon #BTS3410G Low Side Power Switch (2-Die Pkg.)
3 - Infineon #TLE7233G Four Channel Low-Side Relay Switch
5 - STMicroelectronics #VNS7NV04PTR-E Fully Autoprotected Power MOSFET
11 - NXP Semiconductor #TJA1021 LIN Transceiver 9 - NXP Semiconductor #TJA1042 ? CAN Transceiver 10 - NXP Semiconductor #TJA1082 FlexRay Node Transceiver 2 - Unknown #Unknown Power Supply ASIC
Grid = 1 cm Copyright © 2015, TechInsights
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4 - Freescale #MC9S08SG8 8-bit Microcontroller
1 - Infineon #TC1793 32-Bit Single-Chip Microcontroller
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? = Unconfirmed BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 535
Main Board (Side 2)
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BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 536
Main Board Cross-Section
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Substrate Data Substrates Assembly Name Main Board
Manufacturer
Unknown
Core Material
FR4
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Mfg. Technology
4 Layer Conventional FR4 / HF
Area (cm²)
Layers
4
108.1
Min. Trace Pitch (mm) 0.48
Min. Trace Width (mm) 0.15
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ThruVia Land Dia (mm) 0.62
ThruVia Hole Dia (mm)
BlindVia Land Dia (mm)
0.24
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BlindVia Hole Dia (mm)
Thickness (mm) 1.4
Routing Density
Estimated Costs
20.2 $
1.62
BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 538
Integrated Circuit Components Package Info
Estimated Costs
Die Info
Location Pkg Ref. #
Pkg Qty
Brand Name
1 2 3 4 5
1 1 1 1 1
Infineon Unknown Infineon Freescale STMicroelectronics
6
1
9 10 11
2 1 1
Main Board, Side 1
Totals
Part Number
Pkg Description
TC1793 Unknown TLE7233G MC9S08SG8 VNS7NV04PTR-E
32-Bit Single-Chip Microcontroller Power Supply ASIC Four Channel Low-Side Relay Switch 8-bit Microcontroller Fully Autoprotected Power MOSFET
Infineon
BTS3410G
Low Side Power Switch
NXP Semiconductor NXP Semiconductor NXP Semiconductor
TJA1042 ? TJA1082 TJA1021
CAN Transceiver FlexRay Node Transceiver LIN Transceiver
10
Form
Pin Count
Length (mm)
BGA SOP SOP SOP SOP
416 44 24 16 8
26.98 15.86 8.84 5.21 5.03
26.96 10.78 3.87 4.23 3.96
1.96 3.31 1.88 1.04 1.60
MCP - 2 Chips
8
4.81
3.86
1.94
SOP SOP SOP
8 14 8
5.06 5.14 5.12
4.13 4.31 4.34
1.59 0.99 1.50
Width (mm)
Height (mm)
554
Die Ref #
Die Qty
1.1 2.1 3.1 4.1 5.1 6.1 6.2 9.1 10.1 11.1
1 1 1 1 1 1 1 1 1 1
Brand Name Infineon Unknown Infineon Freescale STMicroelectronics Infineon Infineon NXP Semiconductor NXP Semiconductor NXP Semiconductor
Part Number 2F0?PC12 C2PS_2 IO TLE7233G M84G LQ02 ?25N? ERYO M? NK Cf1361D cF1401B cF1271B
11
Description 32-Bit Single-Chip Microcontroller Power Supply ASIC Four Channel Low-Side Relay Switch 8-bit Microcontroller Fully Autoprotected Power MOSFET Power Switch Power Switch CAN Transceiver FlexRay Node Transceiver LIN Transceiver
Length (mm)
Width (mm)
9.39 5.27 2.20 2.30 2.54 1.58 1.59 2.09 2.52 1.76
7.56 4.07 1.64 2.06 2.10 1.35 1.37 1.46 1.91 1.39
Each
Total
$ 21.090 $ 21.090 $ 4.070 $ 4.070 $ 0.320 $ 0.320 $ 1.133 $ 1.133 $ 0.140 $ 0.140 $ 0.130 $ 0.130 $ 0.130 $ 0.130 $ 0.220 $ 0.440 $ 0.340 $ 0.340 $ 0.180 $ 0.180
$27.97
Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.
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Modular Components Estimated Costs
Package Location
Main Board, Side 1
TOTALS
Qty
1
Unknown
Part Number
None
Description
Crystal: Ceramic
1
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Brand Name
Pin Count
Length (mm)
Width (mm)
4
3.24
2.50
4
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Each
Total
$ 0.200 $ 0.200
$0.20
BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 540
Active Discrete Components Package Location
Qty
Functional Description Form
Main Board, Side 1
1 2 2 2 2 1 2 1 1 1 2 1 2
Small Active Small Active Small Active Small Active Small Active Small Active Small Active Small Active Large Active Small Active Small Active Small Active Small Active
Diode, SMT Diode, SMT Diode, SMT Diode, SMT Diode, SMT Diode, SMT Transistor, Small Transistor, Small Diode, DIODE VARACTOR Transistor, Small MOSFET MOSFET,Dual Transistor, Small
Main Board, Side 2
1 1 1 1 1 1
Small Active Small Active Small Active Small Active Small Active Small Active
MOSFET Diode, SMT Diode, SMT Diode, SMT Transistor, Small MOSFET
TOTALS
Top Marking
Pin Count
Length (mm)
Width (mm)
D5F 98 48 KR 88 41 KQ F2F S5 44 67 90 K0 TAN 43 YBS 30 55 84 KQ A4W 41 .42 1CS FPE3AS FDS 4141 WJS 42
2 2 2 2 2 2 3 3 2 3 6 8 3
2.59 4.31 4.07 2.62 4.20 4.08 2.86 3.01 6.81 2.85 2.06 5.09 2.88
1.69 3.42 2.52 1.65 3.43 2.49 1.11 1.28 5.84 1.20 1.68 3.85 1.28
$0.015 $0.040 $0.040 $0.015 $0.040 $0.040 $0.030 $0.030 $0.390 $0.030 $0.090 $0.090 $0.030
$0.015 $0.080 $0.080 $0.030 $0.080 $0.040 $0.060 $0.030 $0.390 $0.030 $0.180 $0.090 $0.060
.42 WPS 98 48 KR 84 96 KQ F2F Tan 43 K2 80
6 2 2 2 3 1
2.05 4.30 4.12 2.65 2.83 2.94
1.16 3.35 2.58 1.50 1.24 1.89
$0.090 $0.040 $0.040 $0.015 $0.030 $0.090
$0.090 $0.040 $0.040 $0.015 $0.030 $0.090
26
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Estimated Costs
76
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Each
Total
$1.47
BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 541
Passive Discrete Components Estimated Costs
Package Location
Qty
Functional Description Form
Main Board, Side 1
11 138 1 1 1 2 1
Main Board, Side 2
4 Small Passive 129 Small Passive
TOTALS
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Small Passive Small Passive Coil Coil Coil Coil Coil
Pin Count
Each
Total
Inductor Cap, Res, Ferrite SMT, Dual Coil SMT, Dual Coil SMT,Dual Coil SMT, Power Inductor SMT, Power Inductor
2 2 4 4 4 2 2
$0.008 $0.004 $0.080 $0.080 $0.080 $0.400 $0.400
$0.088 $0.552 $0.080 $0.080 $0.080 $0.800 $0.400
Inductor Cap, Res, Ferrite
2 2
$0.008 $0.004
$0.032 $0.516
288
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582
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$2.63
BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 542
Connectors Estimated Costs
Package Location
Main Board, Side 1
TOTALS
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Qty
1
1
Form
Connector, Pin Port
Pin Count
Length (mm)
Width (mm)
Each
Total
48
55.25
11.36
$2.700
$2.700
48
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$2.70
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BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 543
Electronic Assembly Metrics
Assembly Weight (grams)
432.28
Avg. Pin Count
432.3
4
Connection Density (Connections/sq.cm)
4
108.1
Component Density (Components/sq.cm)
108.1
System Totals
Number of Connections
Circuit Area (sq.cm)
Main Board
Number of Components
Metal Layers
Main Electronics
Assembly Name
Substrate Area (sq.cm)
General Area
Routing Density (cm of routing per sq.cm of substrate)
Electronic Assembly Metrics by Assembly
20.2
326
1264
3.0
11.7
3.9
55.50
326
1264
3.0
11.7
3.9
55.50
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights
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BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 544
Electronic Assembly Metrics
Card Test
Insertion
Substrates
Connector Components
Passive Components
Assembly Name
Total
Main Electronics
Modular & Odd Form Components
Integrated Circuits
General Area
Small Active Components
Electronics Costs by Assembly
Main Board
$
39.10
$
27.97
$
0.20
$
1.47
$
2.63
$
2.70
$
1.62
$
1.70
$
0.81
System Totals
$
39.10
$
27.97
$
0.20
$
1.47
$
2.63
$
2.70
$
1.62
$
1.70
$
0.81
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights
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BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 545
Electronic Assembly Metrics
IC Package Count
IC Connections
Modular/Odd Form Components
Modular/Odd Form Component Connections
Small Active Components
Small Active Component Connections
Passive Components
Passive Component Connections
Connectors
Connector Connections
Opportunities
Counts by Assembly
Main Board
10
554
1
4
26
76
288
582
1
48
1590
System Totals
10
554
1
4
26
76
288
582
1
48
1590
General Area
Main Electronics
Assembly Name
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights
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Electronic Assembly Metrics
123.8
554
123.8
Non-Volatile Memory (KBytes)
554
10
Volatile Memory (KBytes)
10
11
Package Connections per sq.cm of Package Area
Die Area (sq.mm)
11
System Totals
Die Area/Package Area Ratio
Number of Package Connections
Main Electronics
Assembly Name
Package Area (sq.mm)
IC Package Count
Main Board
General Area
Substrate Tiling Density (die area / substrate area)
IC Die Count
IC Metrics
0.01
1079.3
0.11
51.3
0
0
1079.3
0.11
51.3
0
0
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights
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BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 547
Electronic Costs Breakdown Estimated Cost of Electronics
(Includes Subsystem Electronics)
$39.10
Passive Components 7%
Connector Components 7%
Substrates 4%
Insertion 4%
Card Test 2%
Small Active Components 4% Modular & Odd Components 1%
Integrated Circuits 71%
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights
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Vendor IC Cost Distribution Pkg. Brand Infineon Unknown Freescale NXP Semiconductor STMicroelectronics
Cost $21.67 $4.07 $1.13 $0.96 $0.14
Freescale 4%
NXP Semi 3%
STMicro 1%
Unknown 15%
Infineon 77%
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights
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Non-Electronic Cost Estimate Subsystem
Part ID No.
Qty
Enclosures
3 4
1 1
Bottom Aluminum Enclosure Top Enclosure
Cast Molded + Pulls
Aluminum PC + GF30
Miscellaneous
1 2
1 1
Label Label
Die-Cut + Printed Die-Cut + Printed
Plastic + Adhesive Plastic + Adhesive
Total
Fabrication Process
Material
Dimensions (mm) 151.1 x 113.64 x 8.99 132.94 x 113.03 x 25.53 69.82 x 32.32 x 0.07 45.9 x 13.33 x 0.08
Weight Est'd Cost Est'd (grams) Each Extended Cost 116.40 105.10
2.450 5.140
2.450 5.140
0.30 0.10
0.090 0.040
0.090 0.040
Estimated Cost
4
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Description
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$7.72
BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 550
Final Ass’y Labor & Test Cost Estimate
Final Assembly & Test Made in Number of parts Est'd number of steps Est'd time (seconds)
Est'd final assembly cost Est'd final test cost
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Hungary 6 20 69 $ $
0.17 0.50
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Cost Summary Estimated Cost Totals Main Electronic Assemblies Non-Electronic Parts Final Assembly & Test
Total
$ $ $
39.10 7.72 0.67
$ 47.50
Cost Total Notes: Estimated final assembly cost includes labor only. Total cost does not include Non-recurring, R&D, G&A, IP licensing fees/royalties, software, sales & marketing, distribution. Assumes fully scaled production.
Final Assembly & Test 1%
Non-Electronic Parts 16%
Main Electronic Assemblies 83%
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Cost Estimation Process (Overview & Discussion) Cost modeling is tricky business. Multiple variables affect the actual production costs a manufacturer will experience, including development expenses, unit volumes, supply-and-demand in component markets, die yield-curve maturity, OEM purchasing power, and even variations in accounting practices. Different cost modeling methods employ different assumptions about how to handle these and other variables, but we can identify two basic approaches: that which seeks to track short-term variations in the inputs to the production process, and that which strives to maintain comparability of the output of the model across product families and over time. TechInsights’ philosophy in cost modeling is to emphasize consistency across products and comparability over time, rather than to track short-term fluctuations. During the past eight years, we have developed an estimation process that, while necessarily lacking an insider’s knowledge of the cost factors that impact any one manufacturer, is reasonably accurate in its prediction of unit costs in high-volume production environments. We do not claim that the model will produce the “right” answer for your firm’s environment. However, TechInsights does give customers a key analytical tool with a complete set of data in our Bill of Materials (BOM). The BOM allows readers to 1) scrutinize the assumptions behind our cost model and 2) modify the results based on substitution of their own component cost estimates where they have better information based on inside knowledge. Our estimation process decomposes overall system cost into three major categories: Electronics, Mechanical, and Final Assembly. We begin by creating a complete electronics bill-of-materials (BOM). Each component from the largest ASIC to the smallest discrete resistor is entered into a BOM table with identifying attributes such as size, pitch, I/O count, package type, manufacturer, part number, estimated placement cost, and die size (if the component is an IC). Integrated circuit costs are calculated from measured die area. Using assumptions for wafer size, process type, number of die per wafer, defect density, and profit margin in combination with die area, an estimate of semiconductor cost is derived. Costs for discrete components and interconnect are derived from assumption tables which relate BOM line items to specific cost estimates by component type and estimates for part placement costs are included. For LCD display costs, we employ a model which tabulates expected cost from measurements of glass area, LCD type, and total pixel resolution. When market costs are available from alternative sources, LCD panel costs are taken from and referenced to these sources. Costs of non-electronic components such as molded plastic enclosures and metallic components are measured in terms of weight, size, thickness, type of material, and complexity to arrive at their estimated cost. Other system items such as optics, antennae, batteries and displays are costed from a set of assumption tables derived from a combination of industry data, average high volume costs, and external sources. For final assembly, we re-build the torn-down product, tabulating stepwise assembly times as the reconstruction proceeds, to reach a total assembly time. Using a labor rate assumption for the country of origin, we then calculate final assembly cost. The three major categories for system cost contributors can be broken down into the subcategories of ICs, other electronics parts, displays, batteries (as appropriate), camera modules, electronics assembly, non-electronic elements, and final assembly. By adding the cost estimates for each of these subcategories, an overall estimated cost is derived for the system under evaluation. Product packaging and accessories (CDs, cables, etc.) are also documented and estimated for their contribution to total cost as appropriate. We believe our cost estimates generally fall within 15 percent of the “right answer,” which itself can vary depending on the market and OEM-specific factors mentioned earlier. While the TechInsights cost model is imperfect, it yields important insights into technology and business dynamics along with good first-order contributions to system cost by component type. Additionally, the consistency of approach and gradual modification to assumptions (smoothing out frequently-shifting pricing factors) hopefully yields a credible, but user-modifiable, view of OEM high volume cost-to-produce. Please feel free to contact us at [email protected] with any comments, questions, or proposed corrections with respect to our cost estimates. We welcome your input. Copyright © 2015, TechInsights
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BMW i3 Electrical Digital Motor Assy. #15900-150210-SBb - Page 553
Metrics (Overview & Discussion) In our product teardowns, we gather a series of metrics for product profiling and comparison. Some metrics focus on system characteristics such as total silicon area, total system semiconductor storage capacity, and total connection count. Other metrics reflect more subtle aspects of electronics assembly such as connection density, average component I/O count, and silicon tiling density. Taken as a whole, the metrics allow deeper comparison and benchmarking across multiple disciplines and multiple products. Key metrics we gather on products are described below along with their definitions and what they tend to say about the system under study. Most metrics can be used both in comparing similar products for benchmarking purposes or for quantifying differences in levels of complexity between dissimilar product types. Data fall into two categories; either “raw” measured data or ratios of these measured data sets. Total Silicon Area : This metric describes the total area of silicon as measured from X-ray or direct measurement of ICs. The area is an expression of the enclosed bare die area and excludes packaging area. The aggregate silicon area is a good benchmark to show how integrated a design might be when making comparisons to similar systems. Total silicon area also reflects the major cost driver for most systems we examine. Silicon Tiling Density : Ratio of Total Silicon Area to total printed circuit board “projected” area (i.e. the simple board area and not the cumulative surface area of both sides of the board). This metric directly reflects the level of efficiency and aggressiveness in integrated circuit packing and placement. Single digit Silicon Tiling Density is typical but silicon coverage of 10% - 20% has been seen in some of the most advanced products we have examined. Higher Tiling Densities often correspond with the use of chip scale packaging (CSPs) or other small form-factor IC packaging technologies. High density circuit boards are also often a supporting technology. Number of Parts : Total component count including ICs, passives, modules, connectors, etc., each separated out in our reporting. Number of Connections : The total number of connections corresponds to the total number of interconnects introduced by the aggregate component set and reflects any electrical connection observed (solder joints, adhesive interconnect, or connector terminal interfaces). Opportunity Count : Opportunity Count is the total number of parts plus the total number of connections; the name reflects that each of these constituent elements represents an opportunity for failure. A high opportunity count means more complex and riskier electronics assembly. Average Pin Count (APC) : Ratio of total number of component terminals to total number of parts, at the system level. This metric reflects the ‘average’ terminal complexity of the components and often provide a signature of integration level and/or “digital-ness” of the overall product. Low APCs reflect a high number of discretes or other low-pincount devices often characteristic of analog circuitry. Conversely, high APCs are characteristic of highly integrated, high-pincount assemblies, often those composed largely of digital integrated circuits. Connection Density : This metric is a ratio of the total Number of Connections to total printed circuit board assembly area, in units of connections per sq. inch. The metric provides data related to the Silicon Tiling Density above, but with an emphasis on complexity of I/O interconnect. For example, with a fixed Connection Density, high tiling density of low-pincount memory chips is more readily achieved than comparable silicon tiling of high pincount logic. Part Density : This metric is a ratio of the total Number of Parts to total printed circuit board assembly area, in units of components per sq. inch. The metric provides data related to the Silicon Tiling Density and Connection Density as described above, but with an emphasis on density and complexity of component packing efficiency. For example, low Part Density of high-pincount devices can pose an equal challenge in Connection Density to high Part Density of low-pincount devices. High Part Density does reflect challenges in surface mount assembly in terms of (typically) precision of placement, number of placements, and engineering of part clearances. Routing Density (heuristic estimate) = 3*(Average Pin Count)*√Part Density. The Routing Density metric is an empirically derived relationship that characterizes the wiring density of the interconnect used to support the interconnection of components in a planar electronic assembly (i.e. the circuit board). Architectural issues such as bussing or other factors affecting the regularity of wiring impact the actual Routing Density needed to support a given application, but the metric provides a ready measure of wiring complexity. Copyright © 2015, TechInsights
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Appendix
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555
Deep Dive Report BMW i3 Hybrid Pressure Refueling ECU 2253
Report #15900-150204-RRb Product Description This report concerns the Hybrid Pressure Refueling Electronic Control Unit (ECU) of the 2014 BMW i3. This device monitors the vehicle’s current operating condition via a pressure temperature sensor in the fuel tank and then controls the pressure reduction by opening a valve. The Hybrid Pressure Refueling ECU then activates the fuel filler flap, which allows the vehicle to be refueled. This device features a Renesas #uPD70f3548 32-bit microcontroller, NXP semiconductor #TJA1043T high-speed CAN transceiver, Atmel #ATA6663 LIN transceiver, ON Semiconductor #NCV4299 150 mA lowdropout voltage regulator, and STMicroelectronics #VND5050AJ-E double-channel high side driver with analog current sense.
DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information. Copyright © 2015, TechInsights. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of TechInsights.
www.teardown.com [email protected]
Product Overview Product Description
Integrated Circuit Metrics
Product Type
Automotive
IC Die Count
9
Brand
BMW
IC Package Count
8
Product Name & Model # i3 Hybrid Pressure Refueling ECU Official Release Date
5/2/2014
Weight (grams) Product Dimensions (mm)
69.7 (Measured) 99.62 x 63.6 x 31.84 (Measured at Longest/Widest/Thickest Points)
Product Features Connectivity
NXP Semiconductor #TJA1043T High-Speed CAN Transceiver, Atmel #ATA6663 LIN Transceiver
Processor
Renesas #uPD70f3548 32-Bit Microcontroller
Voltage Regulation
ON Semiconductor #NCV4299 150 mA LowDropout Voltage Regulator
Cost Metrics Retail Price Total Manufacturing Cost
$23.38
Electronics Cost
$21.67
Manufacturing Cost Breakdown Integrated Circuits
$12.78
54.7%
Modules, Discretes & Connectors
$6.64
28.4%
Substrates
$0.84
3.6%
Component Insertion
$0.99
4.2%
Card Test
$0.42
1.8%
Non-Electronic Parts
$1.48
6.3%
Final Assembly & Test
$0.23
1.0%
Total $23.38 100.0%
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Block Diagram 4 - STMicroelectronics #VND5050AJ-E Double-Channel High Side Driver w/ Analog Current Sense 3 - STMicroelectronics #VND5160J-E Double-Channel High Side Driver
1 - Renesas #uPD70F3548 32-Bit Microcontroller
2 - NXP Semiconductor #TJA1043T CAN Transceiver
7 - Atmel #ATA6663 LIN Transceiver
Vehicle Wiring Connector
Estimated block diagram based on observation of this specific product implementation, manufacturer’s data sheets where available, and best engineering judgment. Certain details of the interface circuitry are not reflected in this block diagram. Partitioning and connectivity are speculative.
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Product Label
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Exterior Features
Connects to Range Extender Module
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Exterior Features
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Major Components (Side 1)
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Major Components (Side 2)
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Component Arrangement
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Teardown Sequence
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Main Board (Side 1)
Grid = 1 cm Copyright © 2015, TechInsights
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Main Board (Side 1 IC Identification)
4 - STMicroelectronics #VND5050AJ-E Double-Channel High Side Driver
3 - STMicroelectronics #VND5160J-E Double-Channel High Side Driver
1 - Renesas #uPD70F3548 32-Bit Microcontroller
5 - STMicroelectronics #S3VN04DP Power MOSFET (2-Die Pkg.) 10 - Unknown #Unknown LDO?
2 - NXP Semiconductor #TJA1043T CAN Transceiver
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Main Board (Side 2)
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Main Board (Side 2 IC Identification)
6 - ON Semiconductor #NCV4299 150 mA LDO Regulator 7 - Atmel #ATA6663 LIN Transceiver
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Main Board Cross-Section
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Substrate Data Substrates Assembly Name Main Board
Manufacturer
Helbako
Core Material
FR4
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Mfg. Technology
4 Layer Conventional FR4 / HF
Area (cm²)
Layers
4
45.6
Min. Trace Pitch (mm) 0.45
Min. Trace Width (mm) 0.13
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ThruVia Land Dia (mm) 0.60
ThruVia Hole Dia (mm)
BlindVia Land Dia (mm)
0.30
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BlindVia Hole Dia (mm)
Thickness (mm) 1.7
Routing Density
Estimated Costs
20.4 $
0.84
BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 571
Integrated Circuit Components Package Info
Estimated Costs
Die Info
Location Pkg Ref. #
Pkg Qty
Brand Name
Main Board, Side 1
1 2 3 4 5
1 1 1 1 1
Renesas NXP Semiconductor STMicroelectronics STMicroelectronics STMicroelectronics
uPD70F3548 TJA1043T VND5160J-E VND5050AJ-E VNS3NV04DP-E
32-Bit Microcontroller CAN Transceiver Double-Channel High Side Driver Double-Channel High Side Driver Power MOSFET
Main Board, Side 2
6 7
1 1
ON Semiconductor Atmel
NCV4299 ATA6663
Main Board, Side 1
10
1
Unknown
Unknown
Totals
8
Form
Pin Count
Length (mm)
Width (mm)
Height (mm)
Die Ref #
Die Qty
Length (mm)
Width (mm)
QFP SOP SOP SOP MCP - 2 Chips
100 14 12 12 8
13.87 8.72 4.86 4.91 4.95
13.84 3.95 3.71 3.73 3.71
1.57 1.55 1.50 1.49 1.41
1.1 2.1 3.1 4.1 5.1
1 1 1 1 2
Renesas NXP Semiconductor STMicroelectronics STMicroelectronics STMicroelectronics
70F4002 TJA1043T VNG2A None VN56A
32-Bit Microcontroller CAN transceiver Double-Channel High Side Driver Double-Channel High Side Driver MOSFET
6.52 2.50 2.95 3.82 2.32
5.51 1.65 1.48 1.84 1.67
$ 10.780 $ 10.780 $ 0.283 $ 0.283 $ 0.272 $ 0.272 $ 0.399 $ 0.399 $ 0.211 $ 0.422
150 mA LDO Regulator LIN Transceiver
SOP SOP
14 8
8.77 4.93
3.71 3.63
1.55 1.41
6.1 7.1
1 1
ON Semiconductor Atmel
NCV4299A ATA6863
150 mA LDO Regulator LIN Transceiver
2.81 1.64
2.61 1.22
$ $
0.433 $ 0.143 $
0.433 0.143
Unknown
SOP
6
3.01
1.46
0.87
10.1
1
Unknown
T305B
Unknown
0.58
0.56
$
0.046 $
0.046
Part Number
Pkg Description
174
Brand Name
Part Number
9
Description
Each
Total
$12.78
Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.
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Modular Components Estimated Costs
Package Location
Main Board, Side 1
TOTALS
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Qty
1
Brand Name
NDK
Part Number
NX8045GE
Description
Crystal: Ceramic
1
Pin Count
Length (mm)
Width (mm)
2
7.11
4.41
2
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Each
Total
$ 0.200 $ 0.200
$0.20
BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 573
Active Discrete Components Package Location
Qty
Estimated Costs
Functional Description Form
Top Marking
Pin Count
Length (mm)
Width (mm)
Each
Total
Main Board, Side 1
1 4 5
Small Active Small Active Small Active
MOSFET Diode, SMT Transistor, Small
QJ463 Siliconix Logo AA(TRIANGLE) W38B SG 39 General Semiconductor 37 75 V3, 74 s 3N, 31 WE s, 1FW 3d, tAN 41,
5 2 3
4.54 4.06 2.84
4.30 2.49 1.30
$0.280 $0.015 $0.030
$0.280 $0.060 $0.150
Main Board, Side 2
2 1 2 6
Small Active Small Active Small Active Small Active
MOSFET MOSFET Transistor, Small Transistor, Small
7NV04P ST Logo GF349 SG 1325 N ST4140 2D WE s 37 75 V3, Y6 9, 1FW 39, YA s 3N
4 4 3 3
6.48 6.56 1.99 2.72
3.36 3.36 1.49 1.19
$0.440 $0.440 $0.030 $0.030
$0.880 $0.440 $0.060 $0.179
TOTALS
21
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$2.05
BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 574
Passive Discrete Components Estimated Costs
Package Location
Qty
Functional Description Form
Each
Total
Main Board, Side 1
3 1 1 1 1 4 16 58
Small Passive Misc Coil Capacitor Capacitor Small Passive Small Passive Small Passive
Diode Array Fuse SMT, Small Electrolytic, Small Electrolytic, Small Cap, Res, Ferrite Array Res Cap, Res, Ferrite
6 2 4 2 2 8 2 2
$0.040 $0.085 $0.750 $0.050 $0.060 $0.007 $0.004 $0.004
$0.120 $0.085 $0.750 $0.050 $0.060 $0.030 $0.064 $0.232
Main Board, Side 2
3 22 48
Small Passive Small Passive Small Passive
Cap, Res, Ferrite Array Res Cap, Res, Ferrite
6 2 2
$0.007 $0.004 $0.004
$0.022 $0.088 $0.192
TOTALS
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Pin Count
158
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366
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$1.69
BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 575
Connectors Estimated Costs
Package Location
Qty
Main Board, Side 1
TOTALS
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1
1
Form
Connector: Vehicle Wiring
Pin Count
Length (mm)
Width (mm)
Each
Total
26
51.81
29.86
$2.700
$2.700
26
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$2.70
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Electronic Assembly Metrics
Assembly Weight (grams)
182.32
Avg. Pin Count
182.3
4
Connection Density (Connections/sq.cm)
4
45.6
Component Density (Components/sq.cm)
45.6
System Totals
Number of Connections
Circuit Area (sq.cm)
Main Board
Number of Components
Metal Layers
Main Electronics
Assembly Name
Substrate Area (sq.cm)
General Area
Routing Density (cm of routing per sq.cm of substrate)
Electronic Assembly Metrics by Assembly
20.4
189
632
4.2
13.9
3.3
36.80
189
632
4.1
13.9
3.3
36.80
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights
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Electronic Assembly Metrics
Card Test
Insertion
Substrates
Connector Components
Passive Components
Assembly Name
Total
Main Electronics
Modular & Odd Form Components
Integrated Circuits
General Area
Small Active Components
Electronics Costs by Assembly
Main Board
$
21.67
$
12.78
$
0.20
$
2.05
$
1.69
$
2.70
$
0.84
$
0.99
$
0.42
System Totals
$
21.67
$
12.78
$
0.20
$
2.05
$
1.69
$
2.70
$
0.84
$
0.99
$
0.42
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 578
Electronic Assembly Metrics
IC Package Count
IC Connections
Modular/Odd Form Components
Modular/Odd Form Component Connections
Small Active Components
Small Active Component Connections
Passive Components
Passive Component Connections
Connectors
Connector Connections
Opportunities
Counts by Assembly
Main Board
8
174
1
2
21
64
158
366
1
26
821
System Totals
8
174
1
2
21
64
158
366
1
26
821
General Area
Main Electronics
Assembly Name
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 579
Electronic Assembly Metrics
68.9
174
68.9
Non-Volatile Memory (KBytes)
174
8
Volatile Memory (KBytes)
8
9
Package Connections per sq.cm of Package Area
Die Area (sq.mm)
9
System Totals
Die Area/Package Area Ratio
Number of Package Connections
Main Electronics
Assembly Name
Package Area (sq.mm)
IC Package Count
Main Board
General Area
Substrate Tiling Density (die area / substrate area)
IC Die Count
IC Metrics
0.02
335.9
0.20
51.8
0
0
335.9
0.20
51.8
0
0
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 580
Electronic Costs Breakdown Estimated Cost of Electronics $21.67 Connector Components 12%
Substrates 4%
Insertion 5%
Card Test 2%
Passive Components 8%
Small Active Components 9%
Integrated Circuits 59% Modular & Odd Components 1%
NOTE: Occasional inconsistencies in totals may be present due to rounding error. Copyright © 2015, TechInsights
7 June 2017
Copyright © Munro & Associates, Inc. 2015
www.LeanDesign.com
BMW i3 Hybrid Pressure Refueling ECU #15900-150204-RRb - Page 581
Vendor IC Cost Distribution Pkg. Brand Renesas STMicroelectronics ON Semiconductor NXP Semiconductor Atmel Unknown
Cost $10.78 $1.09 $0.43 $0.28 $0.14 $0.05
ONSemi 3%
NXP 2%
Atmel 1% Other