Leonardo OS2 FLY - User's Guide - V3 [PDF]

Zitiervorschau

Leonardo OS2 FLY User’s Guide

SPEA SpA

16, Via Torino 10088 Volpiano – Italy Tel. : + 39 011 9825 400 Fax : + 39 011 9825 405 E-mail : [email protected] Web : www.spea.com

Code: 81191070.103 - Version 3 Original Instructions

Leonardo OS2 FLY User's Guide - Contents

Contents

1.  Getting Started  ........................................................................................... 5 1.1  Leonardo OS2 FLY launchpad............................................................... 5 1.2  Test Program Settings........................................................................... 7 1.3  Test Program Check Points Verification.............................................. 36 2.  Operating functions  ................................................................................ 37 2.1  Production Control Panel Elements..................................................... 38 2.2  Production Control Panel Advanced................................................... 45 3.  Engineering functions  ............................................................................ 59 4.  Qualification functions  ........................................................................... 60 4.1  Coverage Analysis............................................................................... 61 4.2  Test Plan Checker............................................................................... 86 4.3  Test Result Analyzer............................................................................ 91 4.4  Test Program Statistics...................................................................... 107 4.5  Board Testing Report......................................................................... 110 5.  Library functions  ................................................................................... 113 5.1  Component Data Editor......................................................................114 6.  Service functions  .................................................................................. 122 6.1  Model Library Editor........................................................................... 123 6.2  Mechanical Adjustment Panel........................................................... 131 7.  Admin functions  ..................................................................................... 132 7.1  Authorization Editor............................................................................ 133 7.2  License Recorder Wizard.................................................................. 141 7.3  Disk Organization Editor.................................................................... 142 8.  Admin functions  .................................................................................... 143 8.1  Nodal Waveform Capture App........................................................... 144

Code: 81191070.103 - Version 3

II

Leonardo OS2 FLY User's Guide - Revisions

Revisions

Version

Date

Remarks

V3

05.07.17

Added chapter: • Apps • Nodal Waveform Capture App Updated chapter: • Leonardo OS2 FLY launchpad

Code: 81191070.103 - Version 3

3

Leonardo OS2 FLY User's Guide - Introduction

Introduction

The information of this User’s Guide refers to: Software tool name: Leonardo OS2 FLY System: Flying Probe Testers

This document contains the information the User is required to know to use the Software Leonardo OS2 FLY effectively and independently.

Code: 81191070.103 - Version 3

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Leonardo OS2 FLY User's Guide - Getting Started

1.  Getting Started Leonardo OS2 FLY is the operating system for SPEA flying probe testers. It has been designed to allow also non-expert to quickly generate a test program, even if the board to be tested has thousands of nets. The data import of the board to be tested can be performed in a variety of sources: CAD, Bill of materials, netlists, etc. Board data can also be introduced through manual guided procedures. The automatic test program generator analyses the circuit description and generates the test for all the components on the board.

1.1  Leonardo OS2 FLY launchpad The Leonardo OS2 FLY launchpad is shown here below:

Figure 1. Leonardo OS2 FLY Launchpad

The software functions, described in the following chapters, are grouped according to the following classification: Classification

Description

Operating

Functions used by the operator to start and run the production of the board under test.

Engineering

Functions for the and debug of the test program.

Qualification

Functions for the certification of the results of the test program.

Library

Functions for the management of the libraries required for the correct use of Leonardo OS2.

Service

Functions for the correct interfacing between Leonardo OS2 and the system hardware.

Admin

Functions for the set up of the basic configurations required for the correct functioning of Leonardo OS2.

Apps

Stand alone utility applications for system options. Table 1. Functions classification

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Leonardo OS2 FLY User's Guide - Getting Started The lower bar includes the following items:

Release Notes

Click to open the pdf file with the Leonardo OS2 FLY release notes up to the currently installed version.

User Guide

Click to open the Equipment DocBook, collecting all the documentation available for the system in use.

Select Project

Click to open the SPEA Explorer and select the Test Program to open with Leonardo OS2 FLY.

SW Settings

Click to configure software-level settings.

Sys Settings

Click to configure system-level settings.

TPGM Settings

Click to configure test program-level settings. Refer to the TPGM Settings chapter for more information.

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 User's Guide - Test Program Settings

1.2  Test Program Settings Contents 1.2.1  What it is for........................................................................................ 7 1.2.2  On which systems it runs.................................................................... 7 1.2.3  Support, prerequisites and system settings....................................... 7 1.2.4  What to do to use it............................................................................. 8 1.2.4.1 General.................................................................................. 9 1.2.4.2  Test Mode............................................................................ 10 1.2.4.3  Test Output.......................................................................... 15 1.2.4.4 Datalogging......................................................................... 19 1.2.4.5  Serial Number..................................................................... 21 1.2.4.6  Board Layout....................................................................... 25 1.2.4.7 Fiducial................................................................................ 26 1.2.4.8 Automation.......................................................................... 29 1.2.4.9  Board Loader....................................................................... 33 1.2.4.10 NZT.................................................................................... 34 1.2.4.11  File functions bar................................................................ 35

1.2.1  What it is for The TPGM Settings is the environment for the management of the Test program execution parameters. Each Test program’s specific parameters are stored in the Test project. Through their customizations, it is possible to define how the Test projects will work when launched in the Production Control Panel.

1.2.2  On which systems it runs The TPGM Settings can be used on Bed of Nails and Flying Probe SPEA systems.

1.2.3  Support, prerequisites and system settings The user profile used must be Programmer Level 1 (50) or higher to allow the modification of the TPGM Settings. For more information on the user rights, refer to the Authorization Editor chapter.

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 User's Guide - Test Program Settings

1.2.4  What to do to use it To open the Test Program Settings, just click the TPGM Settings icon on Leonardo OS2 main panel. Note that, on Leonardo Advanced, it is possible to open the TPGM setting clicking System > System setup > Project operating mode setup edit:

Figure 1. Test Program Settings in Leonardo Advanced

The Test Program Settings panel appears as follows: • • • • • • • • • •

General Test Mode Test Output Datalogging Serial Number Board Layout Fiducial Automation Board Loader NZT

Each tab is described in the following chapters.

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 User's Guide - Test Program Settings

1.2.4.1  General The General tab contains the general information of the Test Program. It is possible to define the information that will be used for the productivity analysis and statistics of the board.

Figure 2. Test Program Settings General tab

Refer to the following table for the available operations. Project Info All Test Program Settings will be applied to all test programs with the same Enable project settings related by Tester number. system The Tester number can be set in Leonardo OS2 > Sys Settings panel. Product name of the test program. Product Name

These data will be displayed in RunPack/DebugPack and are required for a subsequent board productivity analysis. Notes

Notes

Specific remarks about the Test Program Table 2. General operations

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 User's Guide - Test Program Settings

1.2.4.2  Test Mode The Test Mode tab includes two sections: General Settings and Flying Probe. •

General Settings The General Settings section allows defining the main test configurations that will be made operative in the Test Program execution phase.

Figure 3. Test Program Settings Test Mode tab - General Settings

Refer to the following table for the available operations. Customized Operative mode This function is used to interface an external application (program) with RunPack/DebugPack. It enables/disables the Tester Customized Operating Mode function that allows to customize the test environment by executing an “OBJECT” in several operating phases.

Enable

In the SPEA operating system, RunPack is designed to execute the Test Programs. During this execution it is possible to run and interact with third party applications (programs). To run and interact with third party applications, it is necessary to customize RunPack/DebugPack. The customization is performed through the programs (called “OBJECT”) executed during the Test Program execution phases. The programs are written with the most common programming languages (e.g. Visual Basic, Builder C++, LabView, etc.). The customization is useful to manage additional functions that are not foreseen in the normal functioning of the test. These functions are customized and adjusted to the specific customer requirements.

Configurations

Click Configuration button to edit the “OBJECTS.INI” file.

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 User's Guide - Test Program Settings

Test execution settings Enable run selected mode

Enable to use the Run Selected Environment function from Runpack. This function is used to select which tests execute when Starting the test from Runpack.

Test only the boards that the previous system in the SMEMA automated line Enable Test only for previous SMEMA marked as PASS. Board PASS N.b.: Only for IL systems Do not test the boards that the previous system in the SMEMA automated Disable Test for previous SMEMA line marked as FAIL and report the disabled test on datalog. Board FAIL writing Datalog N.b.: Only for IL systems Stop test after errors

If the number of occurred errors reaches this value, the test execution is stopped. If the value is “0”, the test is entirely executed.

Set Anomaly after errors

After errors, show an anomaly warning in the Production Control Panel

Enable functional execution in local Save and run the functional test plan in local, even for test programs stored drive on server.

Execution check point qty:

Enable production statistics view

Check that the configured amount of check points have effectively been set in the test plan. For more information on this function, refer to the “Test Program Check Points Verification” chapter. Enable the Statistics data displayed in the Production Control Panel Test Result

When a board in a panel of boards is not detected by the Optical Mounting Optical Mounting Check result as Check, set the result as Not Mounted. If this checkbox is disabled, the result “Not Mounted” is set as “None”. Variant production Variant composition selection mode

It enables to select: • Keep composition name It uses the current variant composition. • Select composition from list At the Start test allows selecting the variant composition from a list. • Select composition according to SN It selects automatically the variant composition by reading the Serial Number. To configure the Serial Number, refer to the “Serial Number” chapter.

Skip test if variant not founded

If the variant is not found, skip the test automatically. If this checkbox is disabled, a panel will appear, prompting the user to manually select the variant.

Read composition from not filtered Variant composition reading from SN read before filter it with Start and End serial number characters. Product name composition by

It enables to select: • Product name • Variant • Product name + Variant • Variant + Product name

Length

Set the character length of the Lot Name (if 0, the check is not performed)

Configure valid char...

Configure the Lot Name expected characters in each position

Lot Name Check

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 User's Guide - Test Program Settings Recy on fail Enable recy on fail

Enables/Disables the recycle on test: • Enabled: When a Fail test occurs, the system recycles on it (according to the selections set in the following fields). • Disabled: The recycle on test is not performed.

Quantity

Number of measurement (or retouch & measurement) to execute.

Continue if PASS

Enables/Disables the automatic exit from the test when the test result is PASS.

Continue on time-out

If the test result is FAIL, and the recycle has been performed for the set Quantity time, it is set to FAIL and the test program execution proceeds with the next tests.

Use PASS/FAIL buttons

The operator will be able to set the PASS or FAIL result at his own discretion.

ReTouch (Only Flying Probe)

Enables/Disables the retouch for the number of times specified in Quantity item. The retouch consists on lifting (2000µ by default) the Z axis up and then to let the Z axis down, on the same coordinate (e.g.: the “retouch” can be used to contact a dirty pad).

Z Up-Down

Enables/Disables the retouch on Z axis.

X-Y shift

Enables/Disables the retouch on X-Y axes.

Q. ty

Number of retouches to execute.

Retouch soft landing

Executes retouch on X-Y axes, moving all probes with softlanding mode.

Retouch level

Z quote used for the retouch.

All probes at the same time

Select to execute the retouch with all probes at the same time

One Probe at Time

Select to execute the retouch with a single probe at a time Repeat task fail

Enable

Enables/Disables the execution of the instructions listed below for the repetition of Organizer Fail test. • RUNAFAILR • RUNFAILR OPTICAL_TEST • RUNFAILR ELECTRO_SCAN

Delay time

Delay between each repeated execution of the fail tasks Table 3. Test Mode - General Settings operations

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 User's Guide - Test Program Settings •

Flying Probe The Flying Probe section allows defining the main configurations related to flying probes included the motion profile.

Figure 4. Test Program Settings Test Mode tab - Flying Probe

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 User's Guide - Test Program Settings Refer to the following table for the available operations. Motion profile

Motion profile selection

It allows to select the motion profile suitable for the pads dimension on the board to be tested: • STD: standard • TRB I: turbo I • TRB II: turbo II • TRB III: turbo III Each increase in speed corresponds to a lower accuracy of touch.

Enable code check

Enable the check of the fixture code

Code

Expected fixture code to check

Disable probes movement

It disables the probes movements. It is used for projects that don’t need axes movement, e.g. diagnostic, functional and bed of nails programs. In this way, the projects can be executed with the axes door open.

Enable use of BCM

Enables/Disables the use of the BCM during the production.

Enable Z ultra soft landing

Enables/Disables the use of the ultra soft landing function for the Z-axes probes. The motion profile associated to ultra soft landing function is described by the following characteristics:

Fixture code

Flying probes

(*) No Mark Motion Profile (Soft Impact). In RunPack2 environments it is possible for the probes to touch either all the test points using “Z Ultra Soft Landing” mode or use “Z Ultra Soft Landing” mode only on the specified test points on the board. The second option allows the program to move the axes in “standard” mode, except where it is required to contact the specified test points using the “Z Ultra Soft Landing” mode. This allows minimizing the probe mark on contacted points. Enable use of UBSG Bottom Support Grid)

(Universal Enable the use of the Universal Bottom Support Grid hardware to compensate for any bending of the boards to be tested.

Enable IBL Adapter

Enable the use of the adapter hardware on the Interface board loader

Enable

Enables the phases management of the Test Cell that tests a product executing a part of test program for each system in sequence.

Phase quantity + Add button

Association between the system and the execution phase of the test program.

Test cell configuration

Table 4. Test Mode - Flying Probe operations

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 User's Guide - Test Program Settings

1.2.4.3  Test Output The Test Output tab allows configuring the tests output modalities.

Figure 5. Test Program Settings Test Output tab

Refer to the following table for the available operations. Input-Output devices Enable display

Enables/Disables the printing of the errors on the screen (Test messages window).

Enable printer

Enables/Disables the automatic printing of the Test message on the operator printer during the test execution.

Use command line for …

Some commands can be accepted or not in the command line, according to the following configuration: • SN reading Only the commands concerning the SN reading are available. • Input commands All the commands are admitted. Test certification

Enable Certification

Enables/Disables the printing of a certification file (according to the settings of the following items).

Edit

Edit the “CERTIFIC.TXT” file.

Type

Selections of the certification type: • Result_ALL Prints the certification for both board results (PASS & FAIL) • Result_FAIL Prints the certification only for boards with FAIL test result • Result_PASS Prints the certification only for boards with PASS test result • Loop_END

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 User's Guide - Test Program Settings

Devices

Enables/Disables the certification devices: • Operator printer Print the certification on LPT1 • System printer Print the certification on LPT1 • Remote Lan printer Print the certification on the configured Lan printer • File Print the certification on File

Pathname

If the Devices item is set to File, the complete pathname of the CERTIFIC.TXT file must be specified in this field. Print devices Enables/Disables the use, in the Test Program, of operator printer configured in the System configuration. For further information, refer to System configuration document.

Enable operator printer

Note: if disabled and the output devices enabled, the test message is not printed automatically, and the Print button do not print. Enables/Disables the use, in the Test Program, of the system printer configured in the System configuration. For further information, refer to System configuration document.

Enable system printer

Enables/Disables the error print on file. The generated file is similar to the output file created with the ASCII repair.

Enable print on file

Note: if enabled, the full pathname where the error print must be written must be specified.

Output on file

Print the error on file specified in the Print on File text box, in one of the following formats: • Test result format It follows the format of the Certification Data Collection file (CdColl). • CSV ASCII format CSV (Comma Separated Value) is a format only for a text file. In this file type, the data are contained in fields separated by semicolon. This makes the files easily transferable and convertible from any software. • Additional ASCII format

Enable highest failure

Enables/Disables the display of the most frequent FAIL tests.

Enable

Enable the storing of pictures taken by the camera during the Optical Test

Save mode

• • • •

Specific Path

Path for the storing of the pictures

Customized file name format

Set the filename format for the saved pictures

Product Statistics Optical Test Picture Save None: save only pictures for test with None result Fail: save only pictures for test with Fail result Pass: save only pictures for test with Pass result All: save pictures for all tests

Certification data collection output (CdColl) Enable certification data collection

Enables/Disables the certification on test measurements.

Enabled during debug

Enable the CdColl generation also during debug operations using Leonardo. When disabled, CdColl will be generated only during production.

Enable on test fail report

The detailed test measures are printed on the Runpack Test message area.

Enable on file

Write the Cdcoll in the specified file path or using the custom file name.

Disable on short float task

Enables/Disables the certification file on short float task.

Send data to repair station

Enables/Disables to send certification file to Repair station.

Enable on noerror task

Enables/Disables the certification file on noerror task.

Enable on TFF task

Enables/Disables the certification file on TFF task. Note: TFF defines the Temporary Fail Flag

Enable on Discharge task

Include in the CdColl data about the capacitance discharge tasks

Enable on NZT task

Enables/Disables the certification file on NZT task.

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 User's Guide - Test Program Settings

Write SN just after start

Enables/Disables the Serial Number writing inside the Cdcoll, just after START test. Usually the Serial Number is written at the end of the test. The Cdcoll file is compiled during the board test. • If the board Serial Number is available before START test, the Serial Number can be written in the Cdcoll file just after the START (check box enabled) or at the end (check box disabled). • If the board Serial Number must be generated during the test execution (board SN not available before START test), the Serial Number can be only written in the Cdcoll file at the end of the file (check box disabled). Note: When the Serial Number is written at the start test, it is not possible to change it in the CDCOLL file. This occurs also if it was modified (e.g.: by Leonardo F instructions) during the execution of the test program.

Write HW configuration (valid form Report the Hardware configuration in the CdColl version 6) CdColl Data Format

Set the CdColl Data Format. For more information on the different versions, refer to the “Certification Data Collection” document. Select the Measure format used in the CdColl:

CdColl Measure Format

• •

Leonardo XA: values are displayed in text format (eg.: 5pF) Leonardo YA: values are displayed in exponential notation (eg.: 5e-12F)

Date Format

Set the date format on certification file with US or European format.

Specific file name

Prints the Cdcoll in ASCII format in the certification file specified in the File text box (by defining the path). Prints the Cdcoll in ASCII format in the customized certification file. The customization is performed by clicking Config button. The Cdcoll File name configuration window is displayed. It allows to set and save the file name composition as displayed in the figure:

Customize file name format

Figure 6. Filename Configurator It is possible to configure the File Name Composition by selecting the suitable key from the Key List table. Select the destination folder where the file must be saved. Enable secondary CdColl path

Set an additional path for saving the CdColl path for backup purposes.

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 User's Guide - Test Program Settings Print settings

Print mode

Selection of the print mode: • NORMAL: Normal format print • SHORT: Short format print (only header & end test) for both test results: PASS & FAIL • SHORT FAIL: As Short but only for FAIL test result • SHORT PASS: Idem as Short but only for PASS test result • ALWAYS: The print of the boards test results is always enabled. Through this modality, it is possible to print also the boards with PASS test result.

Enable detailed print

Enables/Disables the detailed print of the errors. If enabled, the test information printing will be executed.

Print net list

Enables/Disables the printing of the net list: • On All Task: For all the tasks • On Short-Float: Only for the analogue short circuit tests • OFF: Printing disabled

Print task part-number

Enables/Disables the printing of the part number in the analogue Test Fail diagnostic report.

Enable print product name

Enables/Disables the printing of the product name on the test message.

Enable print test point name

Enables/Disables the printing of the test point name on the test message.

Enables/Disables the printing of the measured test point name on the test Enable print only measured test point message. Enable print Board Result

Enables/Disables the printing of the board result on the test message. Table 5. Test Output operations

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 User's Guide - Test Program Settings

1.2.4.4  Datalogging The Datalogging allows managing all the information about the Datalogging. The Datalogging is a method to collect the information about the tested boards: • •

Results of Pass/Fail/Skipped tests Task/Test Fail

The information can be used for a subsequent board retest or production statistics purposes.

Figure 7. Test Program Settings Datalogging tab

Refer to the following table for the available operations. Datalogging for repair station Enables/Disables the datalogging concerning the executed tests. Enable Datalogging for Repair station If enabled, the datalog file is written in the path specified in the System configuration in order to transfer the information to the Repair station. On multi-test programs, consider the datalogging enable settings of each Datalogging enabled in each tpgm single test program. If disabled, only the overall setting of the multi test (multi-tpgm only) program will be considered. Enable CDCOLL datalog

Enable the generation of the CDCOLL file for analysis with QSoft.

Enable datalogging of Fixture codes

Enables the datalog file writing of the fixture, board and pressure codes.

Process name

Set the process name displayed in the datalog.

Enable datalogging of Optical test Include the pictures of fail Optical tests in the datalog file for QSoft. image fail Data required Lot Number

If enabled, the lot number has to be inserted in order to start the test program. Ascii repair

Enable Ascii Repair

Enable the generation of the datalog in Ascii Repair format

Pathname

Set the path to save the Ascii Repair datalog

Pass Result

Include the pass test results in the Ascii Repair datalog

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 User's Guide - Test Program Settings Test Report Enable Save At End Test Execution

Save the Test Report generated by the Production Control panel in txt format after the execution of the test plan.

Pathname

Set the path to save the Test Report Test authorization It enables the system operation. In a production line, the system requires the authorization for test to the stations of the process that precedes it.

Enable

The query to the station is performed through the command sent with the “QSoft Query Engine” protocol. The system waits the ACK to execute the test. For more information, refer to the “QSoft - Query Engine” document.

Product name

It identifies the name of the involved product.

Process name

It identifies the name of the involved process which stations will be queried for the test authorization. For more information, refer to the “REQ_TEST_ INFO” command described in the “Qsoft – Query Engine” document.

Working mode

It defines the working mode setup about: • Custom: defines the working mode profile • Retest on fail: this profile allows to repeat one time the test of failure board. • Test authorization check: allows to require to the system controller to continue a test.

Unauthorized Site Result

• • •

None PASS FAIL

Test pass board Test fail board Test none board

Test result present by the data base that can be tested.

Test reject board Enable Repeat none all

If all results are none, the request will be repeated until almost one board result is not none.

Skip if none allowed

Skip the panel of board test if all board are none.

Enable

If enabled, the tester requires information about the previous test result (Pass, Fail, repaired, rejected, etc.) related to the board that can be retested from the Repair station.

Execute only the failed test

If checked, only the failed tests are executed during re-test of the board.

Skip Optical Test

The Optical Test is automatically skilled during the retest of failed boards.

Retest of failed boards

Table 6. Datalogging operations

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 User's Guide - Test Program Settings

1.2.4.5  Serial Number The Serial Number tab allows configuring the use and managing of the Serial Number.

Figure 8. Test Program Serial Number General tab

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 User's Guide - Test Program Settings Refer to the following table for the available operations. Configurations Enable SN

Enables/Disables the serial number reading and use.

Length Check

Check the length of the Serial Number

SN Type

Selection of the serial number type: • NORMAL: to read a normal serial number. • MULTIPLE: to read the serial numbers of a panel of boards having the serial number of one board being part of it. The multiple is a fixed number, so the first serial number to be read must not be necessarily the first one. • MULTI_INC: to read the serial numbers of a panel of boards, with automatically increased serial numbers. For this type of serial number, the first one of several boards must be read, because the other ones are automatically calculated by increasing the read one. The first board of the panel is the top left one. • MULTI_INC_V2: to read the serial numbers of a panel of boards, with automatically increased serial numbers. For this type of serial number, the first one of several boards must be read, because the other ones are automatically calculated by increasing the read one. The first board of the panel is the bottom right one. • AUTOMATIC: the serial number is automatically assigned by the software (it is useful for applications without serial number, but an initialization in RunPack environment is required). It is possible to print the S/N label. • MULTI_DEC: to read the serial numbers of a panel of boards, which have serial numbers that are automatically decreased. For this type of serial number, the first one of several boards must be read, because the other ones are automatically calculated by decreasing the read one. The first board of the panel is the top left one. • MULTI_DEC_V2: to read the serial numbers of a panel of boards, which have serial numbers that are automatically decreased. For this type of serial number, the first one of several boards must be read, because the other ones are automatically calculated by decreasing the read one. The first board of the panel is the bottom right one. • USE_BCR_ID: to use the identification characters coming from barcode reader. • REPEATED: the serial number is the same for all boards set in Quantity

Quantity

Quantity of serial numbers to read and assign to the board.

Length

Character length Number to read.

Numeric Code Start

Numeric Code End

of

the

Serial Example: If a Serial Number like for example Start of the Serial Number numerical “a789” where “a” is the fixed part, the following options will be set. part.

End of the Serial Number numerical part. Figure 9. Serial Number example

Offset

Set the step to increase or decrease in MULTI_INC and MULTI_DEC Sn types.

Read Quantity

Set the amount of readings to do in order to set the Serial Numbers For MULTI_INC and MULTI_DEC Sn types.

Configure valid char…

It allows defining the valid character of the serial number. It can be used to check the type of board that must be tested.

Print only start SN (with multi SN)

Prints in the Fail Test report only the first generated serial number.

Allow start without SN

If enabled, the START test command is accepted even if any serial number has been read/inserted.

Bar code reader multi trigger

Enables/Disables multi Bar Code reading on an automatic line.

Delay time between two SN reads

Interval in milliseconds, concerning the delay time between two read serial numbers.

SN start/end position

Set the starting and ending point of the characters to check in the Serial Number

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 User's Guide - Test Program Settings Enable use of Dummy Serial Number Customize bar configuration

code

Enable to use a default serial number defined by operator

reader Select a file containing special settings for the barcode to be loaded with the test program Automatic SN generation

Automatic SN generation

It is the starting serial number for the automatic serial number generation. It is a simple incremental. Note: This function is enabled only if the Automatic serial number type is selected in the SN type combo box.

Enable board retest like single board

Enables/Disables to read again the serial numbers of the boards to be retested and to recalculate the serial numbers of new boards.

Generation mode

The following generation modes are available: • Standard: The serial number will be automatically generated as specified in “Configurations” section –> Configure valid char… • Customized: The automatic generation of the serial number will be performed as specified in the “Configure mask”. The Serial Number Mask Configurator, shown here below, allows to build the serial number choosing among several keys listed into the key list. Select the desired key and click on Add button. The panel shows the layout of the composed SN number and an example.

Configure mask

Figure 10. Serial Number mask configurator Communication devices Enable serial port 1

Enables/Disables the serial number reader connected in to serial port 1

Enable serial port 2

Enables/Disables the serial number reader connected in to serial port 2

Timeout reading barcode

It defines the timeout of reading barcode not responding case before a message occurs. 2d code by camera or barcode reader on head1

Enable

Enables/Disables the serial number reading with camera (2D-DATAMATRIX barcode). The Serial Number will be acquired at the start test, after the board alignment.

Read SN for each board of the panel

In case of panel of boards, it enables/disables the serial number reading with camera for each single board. This option is enabled and checked in relation to the SN Type and the Quantity.

Offset Adjust

Enables/Disables the serial number searching around the coordinates acquired. In the Offset Adjust text box, define the camera offset for the serial numbers search.

Retry Qty

Amount of retry attempts

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 User's Guide - Test Program Settings If enabled and the automatic reading of the 2dcode results Fail, the operator can: • Locate the 2D code manually. • Retry to read the code. Manual read code on serial number • Insert manually the Serial Number. KO or missing • Skip the reading of the Serial Number. • Set the brightness and contrast value of the displayed code image. • Set the area considered to read the code (ROI, Region of Interest). • Set the system lights to make the image clear. Insert before SN read

Characters to be added before the Serial Number read.

Insert after SN read

Characters to be added after the Serial Number read.

Reading retry number

Set the amount of attempts to read the Serial Number Table 7. Serial Number operations

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 User's Guide - Test Program Settings

1.2.4.6  Board Layout The Board Layout tab allows defining the panel of board information, the board image to display and special Test program settings.

Figure 11. Test Program Settings Board Layout tab

Refer to the following table for the available operations. Board Image

Enable automatic board display after project loading

If enabled, the selected board image is automatically displayed at the end of the Test Project loading, in RunPack/DebugPack. It is possible to create a list of board images in the Images name window. image • Click Add button to add an image to the list (the Select UUT image window appears: browse among the folder and select the file *.BMP of the image). • Click Delete button to delete an image from the list. Table 8. Board Layout operations

25

 User's Guide - Test Program Settings

1.2.4.7  Fiducial The Fiducial tab allows defining how the system must work during the Fiducials recognition phase.

Figure 12. Test Program Settings Fiducial tab

26

 User's Guide - Test Program Settings Refer to the following table for the available operations. Settings Disable align before START test

Disables the alignment procedure before Start test. The search is performed with the modalities set in Model selection strategy section. This setting executes a preliminary check of the fiducials positioning before the board alignment. If the sum of the X and Y fiducials positioning offsets results lower than the value set in the text box, the board is considered as “aligned”. Otherwise, the normal alignment procedure is performed. Example: Check board pos before align: 20µm X = 5µm (Fiducial 1) + 10µm (Fiducial 2) = 15µm Y = 0µm (Fiducial 1) + 15µm (Fiducial 2) = 15µm

Check board pos before align

The sum of the X and Y fiducials positioning offsets results lower than 20µm. The board is “aligned”.

Enable automatic board align

Enables/Disables the automatic fiducial recognition at the Start test.

Figure 13. Board positioning check Enables/disables the automatic fiducial search, if during the auto alignment operation a FAIL fiducial occurs. The camera is moved around in order to search for the fiducial on a different place.

Automatic search on fiducial fail

Figure 14. Automatic fiducial search Note: this search is recommended if the board is not placed in the same position.

27

 User's Guide - Test Program Settings Enables/Disables the fiducial recognition in manual mode at the Start test (suggested when the fiducial is a soldering point). Note: the Manual Board Align is run if the Automatic Board Align fails (if the Enable automatic board align function is enabled). The following flow chart represents the autoalignment procedure executed by RunPack/DebugPack in the 4040 Flying Probe systems.

Enable manual board align

Figure 15. Autoalignment flow Enable save fiducial for each system

If enabled, it saves the board fiducials of the system in use. This operation allows testing the same board on two systems with different hardware configuration. The fiducials are stored in accordance with the system ID.

Automatic position on First Fiducial When the board enters the test area, the probes will automatically move in on Board Input the optimal position to check Fiducial 1, instead of waiting in parking position. Enable Optical before align

Mounting

Check Execute the Optical Mounting check before the board alignment. Useful in case of panel of boards where one of the boards is not mounted/missing. Warpage

Enable measure warpage on board

Enable the automatic compensation of the positioning of the probes on X-Y-Z directions in function of UUT warpage.

Board width X/Y

Specification of board width X/Y in um. Panel of Board If this check box is enabled, it means that the condition of two fiducials for each board of the panel is chosen (refer to the figure).

Enable fiducials for each board of the panel – Autoalign only by organizer instruction (usesite)

Figure 16. Fiducials on each board of panel

Bottom side Enable bottom side alignment

It enables the bottom side alignment. Table 9. Fiducial operations

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 User's Guide - Test Program Settings

1.2.4.8  Automation The Automation tab allows configuring the ILR (In Line Receiver) transport:

Figure 17. Test Program Settings Automation tab

Refer to the following table for the available operations. Conveyor Enable Adjust

Automatic

Board

Enables the automatic positioning of the BTU to the board width defined in the Receiver Width text box. Width Note: This function can be used only if configured in the System configuration by Spea operator. For further information, refer to System configuration document.

Enable Homing Before Board Width Enable the homing of the conveyor before adjusting the width. Adjust Board width

Sets the board width.

Board length

Sets the board length.

Input / Output start delay

Delay time before move the board (input conveyor, output conveyor).

Test area / Test area2 start delay

Delay time before move the board in the test area (stage1, stage2).

Board position

If the boards to be tested are longer than standards, it shows in which position they must be placed. • Default: System settings (Position1) • Position1: Boards positioned in the test area • Position2: Boards positioned on the output sensor

Figure 18. Board positions Hole Filter

Set the diameter of the board holes that the board presence sensor mounted on the line has to ignore when the board moving on the line.

Speed Movement

Speed of the conveyor belts during the handling of the board

Speed Positioning

Speed of the conveyor belts during the repositioning of the board against the stoppers

29

 User's Guide - Test Program Settings Enable antirotation sensor transition Enable the antirotation sensor check check Enable use stopper

During the positioning in the test area, the board is stopped through mechanical stopper.

Enable use optimized movement

Optimized board loading in the test area.

Enable FOM Overturning

When the board present in test area is unloaded (at the end of test), the board present on input conveyor can be loaded in the test area. It enables the use of FOM (Flip Over mechanism). This instrument allows flipping the boards.

Enable custom line operativeness

Enables/Disables the use of the custom line operativeness. It is set in the Board Input / Board Output or Output Local Mode/ Output Remote Mode items. Board positioning in the test area

Mechanical stopper

Select if the board positioning in the test area is executed using stoppers mounted on the line

Board presence sensor

Select if the board positioning in the test area is executed without stoppers mounted on the line Flying probe settings

Use following Board Contrast quotes Mechanism Up position (BCM) Down position

Vacuum Settings

Board stretching

Enables/Disables the BCM contrast control quotes. specify the type of the installed BCM. Specifies the max up position of the selected BCM. Specifies the max down position of the selected BCM.

Enable vacuum bellows

Enable the use of the vacuum bellows to improve the stability of the board

Activate mode

Set when the vacuum bellows will be activated: • After Ready System • After Board Lock • After BCM UP • After Board Lock and BCM UP

Enable

Enable the Board stretching to adjust the conveyor to avoid board warpage . For more information, refer to the “Board stretching” chapter

Increase line width

Set the additional line width during board stretching (0.5 mm suggested)

Enable pneumatic fingers

Enables/Disables the pneumatic contrast fingers movement.

Allow the operator to handle the board from the front doors of the system Use system as front loading if RSL or in case the Removable Shuttle Loader or Removable Board Loader are RBL present equipped.

30

 User's Guide - Test Program Settings Removable shuttle loader Specifies the type of removable shuttle used: • None • SBL5XX • RSL6XX (IBL & BCM only) • RSL7XX (BSMH only) According to the selected type of shuttle, the following operations are executed: None 1

The board is loaded in the test area

2

The board is locked

3

Board test

4

The board is unlocked

5

The board is moved out SBL500

Shuttle type

1

The board is loaded in the test area.

2

The BCM is moved up.

3

The board is locked.

4

Board test.

5

The BCM is moved down.

6

The board is unlocked.

7

The board is moved out.

Note: If on the BCM there is a Bed of Nails, the points 2 and 3 position is inverted. SBL610 1

The board is loaded in the test area.

2

The board is locked.

3

The ZIF is moved up.

4

Board test.

5

The ZIF is moved down.

6

The board is unlocked.

7

The board is moved out.

1

The board is loaded in the test area.

2

The board is locked.

3

The BCM is moved up.

4

The ZIF is moved up.

5

Board test.

6

The BCM is moved down.

7

The ZIF is moved down.

8

The board is unlocked.

9

The board is moved out.

RSL710

Enable use of ZIF

During the RSL lock phase, if in the system there is a ZIF (Zero Insertion Force) interface, it is brought in up position.

Enable use of selected RSL

Enables using the selected RSL.

Enable use of board on BTU or RSL

It allows testing the board by positioning it directly on the BTU or by RSL. The functioning changing is performed through the selection from RunPack.

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 User's Guide - Test Program Settings

Removable board loader Type

• • •

None RBL8xx RBL9xx Tag R/W

Enable Tag R/W

Enables/Disables the use of transponder for the selected TPGM and the Edit Tag parameters button.

Edit Tag parameters…

Shows the Tag parameters window where it is possible to acquire the code directly from the transponder and insert it in Tag table control code.

It is possible to use the Tag reader writer (Tag R/W), only if the transponder is installed and configured in the System configuration. For further information, refer to System configuration document. Ramp Configure

Open the panel for the configuration of the system conveyor speed. Table 10. Automation operations

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 User's Guide - Test Program Settings

1.2.4.9  Board Loader The Board Loader tab allows configuring the parameters of Device connected via CAN.

Figure 19. Test Program Settings Board Loader tab

Refer to the following table for the available operations. CAN Units CAN Units

CAN unit to be configured.

Rack type

Rack type selection. The rack type is configured in the System configuration. For further information, refer to System configuration document.

Lower edge to 1 slot

Distance between the lower edge of the rack and the first board position.

Slot pitch

It indicates the pitch between each slot.

Rack board number

Number of boards present in the selected rack.

First board position

Position of the first loaded board.

Board Step

It indicates the step between each board.

Top rack

If enabled, it allows unloading the boards in the Top rack.

Bottom rack

If enabled, it allows unloading the boards in the Bottom rack.

Pass/Fail selection

If enabled, it allows unloading the boards resulted Pass/Fail in different racks. This setting is configured in the System configuration. For further information, refer to System configuration document. Table 11. Board Loader operations

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 User's Guide - Test Program Settings

1.2.4.10  NZT The NZT tab appears as follows:

Figure 20. Test Program Settings NZT tab

Refer to the following table for the available operations. Fault identification Enable fault analysis

Enable the fault analysis in case of NZT failed tasks

High Speed

Enables short-circuit test with reduced time and coverage identical to the “traditional” one.

High Speed and Fault Identification

Besides High Speed test characteristics it enables to identify the net whose impedance diverges from the stored one.

High Short Circuits Coverage

Guarantees short-circuit coverage as a Bed of Nails system, taking less time than the “traditional” short circuit detection.

High Coverage Fault Parts and Short It combines the High Speed and Faults Identification and High Short Circuits Circuits Coverage tests characteristics. Enable Groups

Enables/Disables the use of groups data during the Fault Analysis.

Enable Print of not executable Short Enable the print of the not executable Short Circuits in the Test Report Circuits displayed on the Production Control Panel Enable stop execution

Automatically stop the execution of the fault analysis after the set amount of time (in minutes). Table 12. NZT operations

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 User's Guide - Test Program Settings

1.2.4.11  File functions bar The Test Program Settings panel provides the following file functions: Fault identification Help

Displays the Help.

Import

Allows copying in the present Test program, the TpgmCfg.ini configuration file previously saved. The information contained in the file will be used in the present Test project.

Export

The present TpgmCfg.ini configuration file is saved in a chosen path.

Save to library …

Allows saving in a SPEA library defined from operator a copy of the selected project configuration.

Copy from library …

Allows importing the project configuration previously saved by selecting it from a determined SPEA library.

Save

Saves on the selected Test project all the defined settings.

Exit

Exit to program. Table 13. Test Program Settings file functions

35

 User's Guide - Test Program Check Points Verification

1.3  Test Program Check Points Verification Contents 1.3.1  What it is for...................................................................................... 36 1.3.2  On which systems it runs.................................................................. 36 1.3.3  What to do to use it........................................................................... 36 1.3.4  Using the function: a practical example............................................ 36

1.3.1  What it is for The “Test Program Check Points Verification” function verifies that all the test plans of the test project with the check point instruction have been executed.

1.3.2  On which systems it runs The “Test Program Check Points Verification” function can be used on Flying Probe or Bed of Nails SPEA systems.

1.3.3  What to do to use it The function must be enabled as follows: 1. Click TPGM Settings on Leonardo OS2 launchpad to open the Test Program Settings 2. Click Test Mode - General Settings tab 3. Set the number of Check points expected in the Test Plan:

Figure 1. Number of Check points to check

1.3.4  Using the function: a practical example To verify a check point, the following function must be call in the Organizer or in the Functional Test Plan: CheckPointSet (Site, CheckpointID) For more information, refer to the Organizer Help or the Functional Test Help.

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User's Guide - Operating functions

2.  Operating functions The Operating functions are used by the operator to start and run the production of the board under test. The following chapters describe the functions listed below: • •

Production Control Panel Advanced Production Control Panel Elements

37

 User's Guide - Production Control Panel Elements

2.1  Production Control Panel Elements Contents 2.1.1  What it is for....................................................................................... 38 2.1.2  What it achieves................................................................................ 38 2.1.3  On which systems it runs.................................................................. 38 2.1.4  When to use it and when not to......................................................... 38 2.1.5  Support, prerequisites and system settings...................................... 38 2.1.6  What to do to use it........................................................................... 39 2.1.7  Using the function: a practical example............................................ 44

2.1.1  What it is for The “Production Control Panel Elements” is the simplified test execution environment used for production. During production, the real time statistical information displayed on screen inform the user about the current productivity.

2.1.2  What it achieves Using “Production Control Panel Elements” it is possible to manage and control the production in a very user-friendly environment that allows the rapid identification of the main functions. The stored test results are used for data processing from repair or data analysis stations.

2.1.3  On which systems it runs The “Production Control Panel Elements” function can be used on all Flying Probe SPEA systems.

2.1.4  When to use it and when not to This function can be used whenever the system is testing boards. The layout of its panels and buttons makes it particularly useful on system equipped with touchscreen monitors, since no keyboard or mouse are required to use it.

2.1.5  Support, prerequisites and system settings A fully-generated test program must be available to use this function.

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 User's Guide - Production Control Panel Elements

2.1.6  What to do to use it Click on the “Production Control Panel Elements” icon of Leonardo OS2 to use the function:

Figure 1. Leonardo OS2 Main Panel Overview

It is also possible to setup the default execution of the function at each start of Leonardo OS2 through the following steps: 1. 2. 3. 4.

Click Sys Settings on Leonardo OS2 main panel Click Operating Mode Setup Click the Production Panel tab Select Elements from the drop down menu in the General section:

Figure 2. Elements selection

39

 User's Guide - Production Control Panel Elements The “Production Control Panel Elements” environment appears as follows: Operating Mode

System Status

Statistics

Layout

Productivity

Navigation Tools Service Tools

Com m and line

Figure 3. Production Control Panel Elements overview

When the Production Control Panel is started, the following checks are automatically executed: 1. Loading of the drivers required by the system 2. Instrument availability check; if changes in the expected instrument configuration are detected, a message will appear. The system Administrator can, at this point, update the system configuration. 3. Initialization of the mechanical components 4. Loading of the parameters required for the execution of the selected test project. The main window is composed by the areas described below. •

Operating Mode Click to select one of the Operating Modes listed in the following table: Operating Mode

Description

Manual

Used for the test program debug. The operator will have to perform the following operations: 1. Test program execution 2. Execution of the debug commands, if any, through command line

Automatic

The operator just has to command the execution of the Test Program.

In Line

Used to operate in automatic mode on In-Line systems. The UUT movements on the automation line are managed by the SMEMA protocol. The task of the operator is to supervise and take care of the line logistics (handling of the board under test).

Bypass

Used to operate in automatic mode on In-Line systems without testing the boards. The boards move through the system (which will then act as a simple conveyor) to the next equipment or conveyor without being tested. Table 14. Automation Operating Modes

40

 User's Guide - Production Control Panel Elements •

System Status Displays the current system status and the result of the last test program executed. The possible states are listed in the following table: Status

Description

LOAD

Settings are being loaded. It is displayed during the initialization of the system and after the selection of the test project.

READY

The system is waiting for commands. It is displayed after the LOAD phase

TEST

The system is testing

STOP

The test has been interrupted

PASS

The test result is PASS. It is displayed at end of the test

FAIL

The test result is FAIL. It is displayed at end of the test No loading executed.

FREE

Notice

If the system status remains FREE even after loading, verify the Organizer generation result. Table 15. System states

•

Statistics This area displays a pie chart of the boards tested since the last reset with the share and total amount for each possible result (Pass, Fail, None).

•

Layout This area displays the layout of the board or panel of boards being tested. The color of each site is yellow when under test, green when PASS and red when FAIL:

Table 16. Layout of a panel of boards

Click on the layout to display testing and yield statistics about each single site:

Table 17. Site by site statistics

It is possible to double-click on any site to disable it and avoid testing it at the next start.

41

 User's Guide - Production Control Panel Elements •

Productivity The productivity panel includes the statistics listed in the following table: Statistic

Description

Board *h

Total board tested per hour

Test Time

Total test time since last reset

Test *s

Tests executed per second

Movement *s

Axes movements per second Table 18. Productivity statistics

•

Service Tools The service tools are always available to all operators and include the following buttons: Item

Description

Login

Open the panel to insert User Name and password of the operator

Keyboard

Display the on-screen keyboard for command input on touch screen monitors

Automation Console

Show the Automation Console. See the “Using the Automation Console” chapter in the Production Control Panel Advanced User’s Guide for more information.

Self Diagnostic

Check the system integrity (modules or system parts), through the automatic execution of a selected compilation of diagnostic test programs. All test results are stored in a Report File, which can be opened directly from the diagnostic panel.

Homing Axes

Start the system homing procedure

Park for needle change

Move the tester axes to park position for spring probes replacement

Mechanical Alignment

Open the panel for the execution of the axes mechanical alignment

Board Align

Move the axes above the fiducial to execute the system autoalignment procedure

Fixed fingers positioning

Start the function for the “Fixed fingers positioning with laser”. Refer to the function User’s Guide for more information. Table 19. Service tools

42

 User's Guide - Production Control Panel Elements •

Navigation tools The navigation tools include the following buttons; some of them may require Administrator-level rights to be used: Item

Description

Board Testing

Display messages about the current test in execution such as information about the Test project (e.g.: measured value, remarks etc.), test execution time and test result. View and insert the alphanumeric code that identifies the board during all its production cycle. The traceability through Serial Number is essential to check the production and for the quality of process and product throughout its life. The Serial number can be read: • Manually: the operator writes the Serial Number in the Command Line • Automatically: a bar code reader reads the Serial Number and sends it to Leonardo OS2 The blue bar confirms the SN reading:

Serial Number

Figure 4. Serial Number reading Notice

Before testing the board, the “Serial Number” and “Command Line” configurations must be enabled and defined in the “Project operating mode setup” editor.

Open the Test Selection panel and use the green arrow buttons to select which of the tests in the Test Plan will be executed.

Test Select

Figure 5. Test Select panel It is also possible to tweak single tests to account for specific or temporary situations without modifying the test plan coverage (e.g. modifying the test time, tolerance thresholds, swapping test points etc). Move the camera on axis above each of the components that resulted in Fail during the last execution of the test.

Test Fail Check

Figure 6. Test Fail Check panel In this panel, the operator can visually check the situation (e.g. missing components etc.) and choose to force a Pass result or confirm the Fail.

43

 User's Guide - Production Control Panel Elements Item

Description The button is enabled at the end of the test program execution only if there are tests with Fail result. Click on it to open the “Production Test Editor” and display the tasks list with the tests fail results.

Test Fail Adjust

Figure 7. Test Fail Adjust panel Here, it is also possible to tweak single tests to account for specific or temporary situations without modifying the test plan coverage (e.g. modifying the test time, tolerance thresholds, swapping test points etc). Test Fail Repeat

Repeat the tests that resulted in Fail during the previous test program execution. Table 20. Navigation tools description

•

Command line The command line is used by the operator to directly enter the commands listed in the following table: Command

Description

SN

Define board Serial Number

$START [Qty]

Start the test and execute it [Qty] times

VRC [Composition|#CompNum]

Insert the variant composition code

LN

Define the board production lot number Table 21. Commands list

2.1.7  Using the function: a practical example To load and execute the test program, just execute the following steps:

1. Click Open to select the Test Program to be executed Figure 8. Open button

2. Click Start to launch the execution of the Test At any time, it is possible to click: • •

Stop to interrupt the test program execution and move the axes to park position at any time Skip to avoid executing the ongoing test and move on to the next one

44

Figure 9. Operating buttons

 User's Guide - Production Control Panel Advanced

2.2  Production Control Panel Advanced Contents 2.2.1  What it is for...................................................................................... 45 2.2.2  What it achieves............................................................................... 46 2.2.3  On which systems it runs................................................................. 46 2.2.4  When to use it and when not to........................................................ 46 2.2.5  Support, prerequisites and system settings..................................... 46 2.2.6  What to do to use it........................................................................... 47 2.2.6.1  Operating Mode................................................................... 48 2.2.6.2  Menu bar............................................................................. 49 2.2.6.3  System status...................................................................... 50 2.2.6.4  General information............................................................. 51 2.2.6.5  Command line..................................................................... 52 2.2.6.6  Operating buttons................................................................ 52 2.2.6.7  Production summary........................................................... 53 2.2.6.8  Report and devices settings................................................ 53 2.2.6.9  Test Report.......................................................................... 53 2.2.6.10  System Log........................................................................ 54 2.2.6.11  Shortcut buttons................................................................. 54 2.2.7  Using the function: a practical example............................................ 55 2.2.7.1  Operator Login..................................................................... 55 2.2.7.2  Test Program Loading and Execution................................. 55 2.2.7.3  Using the Automation Console............................................ 56 2.2.7.4  Using the Debug Console.................................................... 57 2.2.7.5  Using the Pin Finder............................................................ 58 2.2.7.6  Handling errors messages................................................... 58

2.2.1  What it is for The “Production Control Panel Advanced” is the main test execution function and can be used both during test program debug and during production.

45

 User's Guide - Production Control Panel Advanced

2.2.2  What it achieves Through its subfunctions, the “Production Control Panel Advanced” achieves the results listed in the following table: Function

Description

Operator console

Manually check the board handling, if not automatically performed.

Last failed task display

Display the tasks resulting in fails after the testing of each board.

Automatic recycle on faulty test

Loop the execution of “Fail” tests; “Pass” result can also be forced.

Adjustment graphic bar

View the measured value during the test execution so to adjust potentiometers or allow other interventions by the test operator.

Board layout and TP viewer

Display the board layout. View the net routing on the printed circuit (information must be available on CAD files). View and search for components, test points and nets.

Execution of Test program for panel of boards

Execute test programs designed for panels of boards (several boards on the same support) and generated with PanelGen.

Execution of variant test program

Execute test programs for variant boards generated with VariantGen.

Test project automatic loading

Load and execute the test program according to the serial number of the board.

Multi Test program execution

Execute to test the same board with different test programs.

Test Information Exchange

DLL set for the interaction between high level programs and the system.

Functional program execution

Execute functional test programs generated with high-level programming languages.

Certification data report

Store the values measured during the test program execution (on paper or file). The certificate format can be set by the programmer.

Panel test result display

Display the test result of each single board of the panel.

Customized operating mode

Customize the test program execution environment through the execution of programs during the test program development.

Customized task list execution

Customize the task list execution through programs written with any Windows-based languages (e.g. Visual Basic, C++, LabView); for example, it is possible to execute only the tests involving given components or the parts of the board that underwent a repair.

Automatic Serial Number assignment

Automatically generate the board Serial Number before executing the Test program.

Real Time Production Displayer

Display the system productivity in real time (Pass and Fail tests).

Leonardo F Driver System Instrumentation

Control the system instrumentation in the functional test program.

Leonardo F Driver Optical Test Instrumentation

Control the optical test instrumentation in the functional test program.

Leonardo F Driver FT1000 Instrumentation

Control the FT1000 instrumentation in the functional test program. Table 22. Production Control Panel - Advanced functions

2.2.3  On which systems it runs The “Production Control Panel Advanced” function can be used on Flying Probe SPEA systems.

2.2.4  When to use it and when not to This function can be used whenever the system is testing boards.

2.2.5  Support, prerequisites and system settings A fully-generated test program must be available to use this function.

46

 User's Guide - Production Control Panel Advanced

2.2.6  What to do to use it Click on the “Production Control Panel Advanced” icon of Leonardo OS2 to use the function:

Figure 1. Leonardo OS2 Main Panel Overview

It is also possible to setup the default execution of the function at each start of Leonardo OS2 through the following steps: 1. 2. 3. 4.

Click Sys Settings on Leonardo OS2 main panel Click Operating Mode Setup Click the Production Panel tab Select Advanced from the drop down menu in the General section:

Figure 2. Advanced selection

47

 User's Guide - Production Control Panel Advanced The “Production Control Panel Advanced” environment appears as follows: Menu bar

Test report

Operating Mode

Shortcut buttons System status

General information

Command line Operating buttons Production Summary

Report and devices settings

System Log

Figure 3. Production Control Panel Advanced overview

When the Production Control Panel is started, the following checks are automatically executed: 1. Loading of the drivers required by the system 2. Instrument availability check; if changes in the expected instrument configuration are detected, a message will appear. The system Administrator can, at this point, update the system configuration. 3. Initialization of the mechanical components 4. Loading of the parameters required for the execution of the selected test project. The main window areas are described in the following chapters.

2.2.6.1  Operating Mode Click to select one the Operating Modes of the system automation. The following options are available: Operating Mode

Description

Manual

Used for the test program debug. The operator will have to perform the following operations: 1. Test program execution 2. Execution of the debug commands, if any, through command line

Automatic

The operator just has to command the execution of the Test Program.

In Line

Used to operate in automatic mode on In-Line systems. The UUT movements on the automation line are managed by the SMEMA protocol. The task of the operator is to supervise and take care of the line logistics (handling of the board under test).

Bypass

Used to operate in automatic mode on In-Line systems without testing the boards. The boards move through the system (which will then act as a simple conveyor) to the next equipment or conveyor without being tested. Table 23. Automation Operating Modes

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 User's Guide - Production Control Panel Advanced

2.2.6.2  Menu bar Click to select one of the Operating Modes listed in the following table: Item

Description

System Initialize

Run the system composition check. The system is initialized to check that all the instruments available in the system are those expected. Any update detected about the system instruments will be notified with aa message. During the system composition check, the firmware of the CPU is not loaded again.

Last System Initialization Report

Show the detailed report of the last system initialization executed.

Last Load Report

Show the detailed report of the last loading of the Test program.

Test Project Tools

Exit

Exit the Production Control Panel.

Load

Reload the opened Test project.

Open

Enter Spea Explorer and select the Test project to load

Automation Console

Show the Automation Console. See the “Using the Automation Console” chapter for more information.

Automation I/O Monitor

Check the functioning of all the system inputs and outputs (e.g. lights etc)

AutoProbe Console

Check the current position of the x and y axes. Show the Debug Console panel for the setting of the optional debugging console connectable to the front panel of the system.

Debug Console

The debugging console is based on a printed circuit with several test points that can be connected to a signal and, during debugging, are used for the connection of the scope probes. Through the Debug Console panel, it is possible to set which signals will be sent to the test points to be debugged with the probe scope. See the “Using the Debug Console” chapter for more information.

Pin Finder

Check the correct connection between system channels and test points on board. See the “Using the Pin Finder” chapter for more information.

View Board Image

Show any picture attached to the test program (e.g. instruction for board loading etc)

Board Navigator

Show the main data about the board under test (e.g.: electrical diagrams, board layout, etc.), useful for test programming and debug.

Organizer Editor

Open the Organizer Editor. Refer to the Organizer Editor user’s Guide for more information.

Buffer Setup

Setup of the conveyor’s optional buffer (including speed etc)

Shuttle Setup

Panel for the setup of the optional shuttle on system

Eddris Setup

Panel for the setup of the optional Eddris board to customize line speed etc.

Run Selected Environment

Select which of the tests in the Test Plan will be executed

Functional Testplan Execution

Start only the functional part of the loaded test program for debug purposes.

Visual Debugger

Debug panel to check the functioning for the Zpromea boards mounted on axes.

Smart Obp Configurator

Start the Smart OBP environment. Refer to the function User’s Guide for more information.

System Composition

Show the list of the instruments currently detected by the software in a dedicated panel.

Service...

Open the Service panel including the system operating time since last maintenance etc.

Leonardo Debug

Open the Test Plan editor. Refer to the function User’s Guide for more information

Logbook Panel

Display the system logs

Command Line

Open the command line

Login...

Open the operator login panel. See the “Operator Login” panel for more information.

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 User's Guide - Production Control Panel Advanced Item

Description

Diagnostic Self Diagnostic

Check the system integrity (modules or system parts), through the automatic execution of a selected compilation of diagnostic test programs. All test results are stored in a Report File, which can be opened directly from the diagnostic panel.

Diagnostic

Select and run the desired system instruments diagnostics

Calibration

Panel for the calibration of the Zpromea board mounted on axes

Adjustment

Panel for the adjustment of the Zpromea board mounted on axes

TPGM Memory Contents Verify...

Start the CPU memory diagnostics

RAM Test...

Run the diagnostics of the system instruments RAM.

Notice

Flying Probe

Help

For detailed information about the system diagnostic programs, refer to the 3030 Diagnostic programs document.

Homing Axes

Start the system homing procedure

Park for needle change

Move the tester axes to park position for spring probes replacement

Board Align

Move the axes above the fiducial to execute the system autoalignment procedure

Fixed fingers positioning...

Start the guided procedure for the placement of the support fingers using the camera and/or laser equipped on system

Mechanical Alignment

Open the panel for the execution of the axes mechanical alignment

Optical Adjust

Camera pixel-micron calibration

Movement Tables Runner

Run the movement tables for axes stress test

Z Ultra-Soft Landing

Enable the soft landing to avoid damage to the board pads

Retouch

Enable the retouch of the pads for failed tests

About...

Information about the currently installed release. Table 24. Menu bar items description

2.2.6.3  System status Displays the current system status and the result of the last test program executed. The possible states are listed in the following table: Status

Description

LOAD

Settings are being loaded. It is displayed during the initialization of the system and after the selection of the test project.

READY

The system is waiting for commands. It is displayed after the LOAD phase

TEST

The system is testing

STOP

The test has been interrupted

PASS

The test result is PASS. It is displayed at end of the test

FAIL

The test result is FAIL. It is displayed at end of the test No loading executed.

FREE

Notice

If the system status remains FREE even after loading, verify the Organizer generation result. Table 25. System states

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 User's Guide - Production Control Panel Advanced

2.2.6.4  General information This area shows data about the currently selected board and Test project. The available information is listed in the following table: Item

Description

Test Project(s)

Paths and names of the current Test project(s) List of the Board Serial numbers that are expected to be read by the system. The Serial numbers read appear in the area of the window highlighted in figure:

Figure 4. Serial numbers read

Serial Number(s)

SN xx/yy SN xx, where xx: Number of acquired Serial numbers yy: Number of Serial numbers that can be managed by the project during each Start. SN xx/yy (OK) will appear when all expected Serial number have been read. Notice

In this area is also available additional info about the Operator Name and sites:

Figure 5. Operator name and sites Site xx/yy xx: Site number in use yy: Total sites available Unit Name

Name of the specific unit

Lot Number

Production lot number of the board Table 26. General information items

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 User's Guide - Production Control Panel Advanced

2.2.6.5  Command line Through the Command Line bar, the operator is able to directly enter the commands to execute. Commands must be maximum 256 characters long; click the arrow button or press enter to apply the entered command. Note that some commands may not be accepted, according to the Project Operative Mode settings. The following table lists the available commands: Command syntax

Fast Key

CLEAR LOG|REPORT

Command line

Description

Enable

Disable

-

þ

-

Clear the log or the error report

-

þ

-

Switch to debug mode

$DEBUG

-

-

þ

EXIT

-

þ

-

Close the Production Control Panel

HEAD

-

þ

-

Select the head

HELP

-

þ

-

Show commands list

DEBUG

Switch to debug mode if command line is disabled

HOME

-

þ

þ

LOAD

-

þ

-

Select Project

RECYFA [ON|OFF]

-

þ

-

Enable/disable Recy on fail

SN

-

þ

-

Specify the board Serial Number

START [Qty]

F3

þ

-

Test execution (for Qty times)

$START [Qty]

-

þ

þ

CLEAR LOG|REPORT

-

þ

-

STOP

F3

þ

þ

TEST

-

þ

-

Switch to test mode

USEPROJECT [TestProject]

-

þ

-

Set the current project in a multiproject

USESITE

-

þ

-

Select the site

VRC [Composition|#CompNum]

-

þ

þ

Execute system homing

Test execution if command line is disabled (for Qty times) Clear the log or the error report Interrupt the test

Insert the code for a given variant composition

Table 27. Commands list

2.2.6.6  Operating buttons The operating buttons described in the following table are used for the execution of the test: Button

Description

Stop

Interrupt the test project execution and move the axes to parking position.

Start

Start the test program execution. This button can be programmed to allow the operator to make special choices about the test execution.

Skip

Skip the current test and execute the next one. This button is used to allow the interaction between operator and system during calibration, when the measurement or adjustment is over and the Test Plan execution continues. Table 28. Operating buttons description

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 User's Guide - Production Control Panel Advanced

2.2.6.7  Production summary The production summary area shows data about the production trend of the units in pie chart form. In addition, it provides the following information: Item

Description

Units Tested

Total units tested during the current session of the Production Control Panel

Units Passed

Total units tested with PASS result during the current session of the Production Control Panel

Units Failed

Total units tested with FAIL result during the current session of the Production Control Panel

Units per hour

Average amount of units tested per hour. Table 29. Production summary data

2.2.6.8  Report and devices settings The available report and devices settings include the items listed in the following table: Item

Description

Report Settings

Enable/Disable datalogging on repair station Notice

If the datalog saving path is located on a temporarily offline LAN, the Datalog will be saved on a temporary folder. When the LAN is back online, click Flush Datalog to automatically load the temporary data on the LAN:

Datalog

The data will be transferred anyway at the following test program execution.

Output Devices Input Devices

CDCOLL

Enable/Disable the certification on tests measurements

Certification

Enable/Disable the printing of a certification file

Display

Enable/Disable the visualization of the report in the Test Report area.

Printer

Enable/Disable the printing of the errors through system printer

Keyb Commands

Enable/Disable the use of the Command Line. If disabled, the Command Line will only accept the Serial Number.

Serial port

Enable/Disable the reading of the Serial Number through serial line (e.g. Barcode Reader). Table 30. Report and devices settings items

2.2.6.9  Test Report The Test Report area shows the messages about the current test being executed by the system. The messages contain the information about: • • •

Test project (e.g.: measured value, remarks etc.) Test execution time Test result

Moreover, the following buttons are available: Button

Description

Print

Print the report on paper through the system’s printer

Copy to clipboard

Copy on the clipboard the data currently displayed in the Test Report Table 31. Test report area buttons

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2.2.6.10  System Log The System Log area shows service messages about the current status of the system. Moreover, the following button is available: Button

Description

Copy to clipboard

Copy on the clipboard the data currently displayed in the System Log Table 32. System Log buttons

2.2.6.11  Shortcut buttons The shortcut buttons allow the quick execution of the commands listed in the following table: Item

Description

Open

Enter Spea Explorer and select the Test project to load

Login

Open the operator Login panel. See the “Operator Login” chapter for more information.

Job Panel

Open the Production Startup panel to start a new startup session and stabilize the testing when beginning a new production.

Automation Console

Show the Automation Console. See the “Automation Console” chapter for more information. The button is enabled at the end of the test program execution only if there are tests with Fail result. Click on it to open the “Production Test Editor” and display the tasks list with the tests fail results.

Test Fail Adjust

Figure 6. Test Fail Adjust panel Here, it is also possible to tweak single tests to account for specific or temporary situations without modifying the test plan coverage (e.g. modifying the test time, tolerance thresholds, swapping test points etc). Test Fail Repeat

Repeat the tests that resulted in Fail during the previous test program execution.

Elements

Switch to Production Control Panel - Elements

Leonardo

Go back to the Leonardo OS2 main window

Exit

Exit the Production Control Panel Advanced Table 33. Shortcut buttons description

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 User's Guide - Production Control Panel Advanced

2.2.7  Using the function: a practical example The following chapters describe the most common operations that can be executed through the “Production Control Panel Advanced” function. • • • • • •

Operator Login Test Program Loading and Execution Using the Automation Console Using the Debug Console Using the Pin Finder Handling error messages

2.2.7.1  Operator Login The Login operation is required only once. It is possible to log in as a different operator at any moment by executing one of the following operations: • •

Click the Login shortcut button Click Tools > Login on the menu bar

The panel appears as follows:

Proceed as follows:

Figure 7. Operator Login panel

1. Select your name in the Operator Name combo box 2. Enter the password (if required) in the Password text box 3. Click Ok

2.2.7.2  Test Program Loading and Execution 1. Click Open to select the Test Program to be executed Figure 8. Open button

2. Click Start to launch the execution of the Test At any time, it is possible to click: • •

Stop to interrupt the test program execution and move the axes to park position at any time Skip to avoid executing the ongoing test and move on to the next one

55

Figure 9. Operating buttons

 User's Guide - Production Control Panel Advanced

2.2.7.3  Using the Automation Console The Automation Console is the panel for the control and monitoring of the system automations. Open it in one of the following ways: • •

Click the Automation Console shortcut button Click Tools > Automation Console on the menu bar

The panel is divided in the Element and Advanced tabs. •

Automation Console Elements The Elements tab appears as follows:

Figure 10. Automation Console - Elements tab

The tab includes the items listed in the following table: Item Functions

Description Door Open

Unlock the door

RSL Settings

Enable or disable the Removable Shuttle Loader equipped on system

Lock

Lock the board

Unlock

Unlock the board Click to read all the Serial Number of the boards to be tested. It is usually used for the calibration and correct positioning of the Bar Code Reader on the system.

BCR Enable

This function can be used only if the system is equipped with a Bar Code Reader for the reading of the board Serial Number. Conveyor

Status

OUT

Convey the board out of the test area

IN

Convey the board into the test area

BCM Up

Move up the Bottom Contrast Mechanism

BCM Down

Move down the Bottom Contrast Mechanism

Board Present

Green when the board is detected as present

Board Lock

Green when the board is detected as locked

Door Closed

Green when the doors are detected as closed

Drawer Closed

Green when the drawer is detected as closed

Safety Ok

Green when the safety devices are enabled

Homing Done

Green when the homing has been correctly executed

RSL 6xx Present

Green when the system is equipped with the Removable Shuttle Mechanism series 6xx

RSL 7xx Present

Green when the system is equipped with the Removable Shuttle Mechanism series 7xx

BON Adapter Present

Green when the BCM adapter is present

Table 34. Automation Console - Elements tab items

56

 User's Guide - Production Control Panel Advanced •

Automation Console Advanced The Advanced tab appears as follows:

Table 35. Automation Console - Advanced tab

The tab includes the additional items listed in the following table: Item Conveyor

Description Width

Set the width between the branches of the conveyor in mm

Goto

Move the branches at the selected width value

TPGM

Move the branches to the width set up in the Test Program

Step

Move the branches according to the entered value in mm

Homing

Execute the automation homing Table 36. Automation Console - Advanced tab items

2.2.7.4  Using the Debug Console In the Debug Console panel the user can select which send to a certain Test Point of the debug console. Probes scopes can then be connected to that Test Point for debugging purposes. To display the Debug Console, click Tools > Debug Console on the menu bar.

Enable the Test Points on the Debug Console

Select the signal to m ake available on the Test Points

Figure 11. Debug console panel

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 User's Guide - Production Control Panel Advanced

2.2.7.5  Using the Pin Finder The Pin Finder is a tool for checking the correct connection between the system channels and the test points on board. To display the Pin Finder panel, click Tools > Pin Finder on the menu bar; the panel will appear as follows:

Figure 12. Pin finder panel

The panel includes different views of the board layout and tools to assist the operator in finding the test points and channels. The Info table provides the following data: Item

Description

TP

Number of the test point currently selected in the layout

CH

Number of channel associated to the test point

STRIP

Number of the slot of the scanner for the selected channel Figure 13. Pin Finder panel items description

2.2.7.6  Handling errors messages SPEA systems are equipped with sensors and devices for the detection the physical status of the systems. In case of incoherent status, a message is displayed; click Help to display additional information about the error:

Figure 14. Error panel

The Help includes the following information: • • • •

Error Description Cause of occurrence Sensors and devices involved with pictures Troubleshooting

58

User's Guide - Engineering functions

3.  Engineering functions The Engineering consists of the following software packages for the generation and debug of the test programs:

Software Package

Feature

Leonardo Board Learn

Immediate test program generation through autolearning from a golden board even without Cad files.

Leonardo Cad Builder

Reverse engineering of CAD files and electronic circuit information of the board to be tested.

Leonardo Express

Test programs development in a guided, easy and intuitive way.

Leonardo Advanced

Test programs advanced development.

Leonardo Autoprogram

Immediate test program generation through autolearning from a golden board. 
File CAD are necessary.

Leonardo PCB

Test program generation for test of printed circuit boards with no components.

Leonardo BackPlane

Development and the execution of test programs for backplanes.

Notice

Refer to the specific User’s Guide of the Software Package for information about the Engineering functions.

 

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User's Guide - Qualification functions

4.  Qualification functions The Qualification functions include a range of tools to certify the results of the test program. The following chapters describe the functions listed below: • • • • •

Coverage Analysis Test Plan Checker Test Result Analyser Test Program Statistics Board Testing Report

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 User's Guide - Coverage Analysis

4.1  Coverage Analysis Contents 4.1.1  What it is for....................................................................................... 61 4.1.2  What it achieves................................................................................ 61 4.1.3  On which systems it runs.................................................................. 61 4.1.4  When to use it and when not to......................................................... 61 4.1.5  Support, prerequisites and system settings...................................... 62 4.1.6  What to do to use it........................................................................... 62 4.1.6.1  Components coverage......................................................... 64 4.1.6.2  Nets coverage...................................................................... 66 4.1.6.3  Open Pins coverage............................................................ 67 4.1.6.4  Pins coverage...................................................................... 67 4.1.7  Using the function: a practical example............................................ 68 4.1.7.1 Header.................................................................................. 68 4.1.7.2  Tested Parts graph sheet..................................................... 69 4.1.7.3  Parts Resume sheet............................................................. 69 4.1.7.4  Test Plan Tests graph sheet................................................. 70 4.1.7.5  Tested Parts per Family graph sheet................................... 70 4.1.7.6  Parts Summary sheet........................................................... 71 4.1.7.7  Nets Summary sheet............................................................ 73 4.1.7.8  Test Points Summary sheet................................................. 74 4.1.7.9  Parts Details sheet............................................................... 75 4.1.7.10  Nets Details sheet............................................................... 77 4.1.7.11  Analog Test Plan Details sheet........................................... 78 4.1.7.12  Open Pins Details sheet..................................................... 80 4.1.7.13  Manually Added Tasks sheet.............................................. 83 4.1.7.14  Customize Filters sheet...................................................... 84 4.1.7.15  Customize Fields sheet....................................................... 85

4.1.1  What it is for The “Coverage Analysis” function provides information about the coverage achieved by a fully debugged and released test program. It is different from the Testability Analysis data, which provides theoretical coverage information before the debugging process. The coverage analysis is performed on all the test plans (analog, open pin, optical…) that compose a test program and shows if each component is covered by a test or not.

4.1.2  What it achieves Using the “Coverage Analysis” function results in a report that can be exported to a Microsoft Excel file to simplify customization and compatibility with other data analysis packages. The report fills a series of sheets with summary and detailed information about the tested components.

4.1.3  On which systems it runs The “Coverage Analysis” function can be used on Bed of Nails and Flying Probe SPEA systems.

4.1.4  When to use it and when not to The “Coverage Analysis” function is useful for all test programs. 61

 User's Guide - Coverage Analysis

4.1.5  Support, prerequisites and system settings The fully debugged and released test program must be available in order to use the “Coverage Analysis” function.

4.1.6  What to do to use it Click on the “Coverage Analysis” icon of Leonardo OS2 to use the function:

Figure 1. Leonardo OS2 Main Panel overview

It is also possible to reach it in the following way: •

Leonardo Advanced Click on the “Certification” icon on the left side of the screen. 1. Click on the “Test coverage analysis” button on the right:

Figure 2. Test Coverage Analysis in Leonardo Advanced

62

 User's Guide - Coverage Analysis The “Coverage Analysis” environment will appear as follows:

Figure 3. Coverage Analysis environment overview

The Coverage Analysis result table contains the result of the detailed coverage related to: • • • •

Components Nets Open Pins Pins

The following chapters describe the data available for each of them.

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 User's Guide - Coverage Analysis

4.1.6.1  Components coverage By selecting the Components tab, the table containing the information concerning the result of the components coverage is displayed. The fields contained in the table are described below: Field

Description

Drawing reference

Refers to the name of the component.

Variant

If the project is a variant one the composition name is displayed, otherwise 0 is displayed.

Part Number

Part Number of the component to which SPEA libraries refer.

Device Name

Commercial name of the component to which SPEA libraries refer.

Device Type

Identifies the type of component (example: Resistors, Capacitors, Digital Devices, Diodes etc.). The possible values are:

Analog

“X”: If the component was tested in Analog Test Plan. Internal: If the internal parts of the Array type component (resistor array, diode array, etc.) were tested in the Analog Test Plan. The

Parallel

Optimized

possible

values

are:

“X”: If the component was included in a parallel. Masked: If the current component was included in a parallel but its absence could not be detected. For example a capacitor of low value in parallel with a high value component. Indicates the Test Plan used to optimize the component analog test. The possible value is: NZT: The NZT Test Plan was used to optimize the component analog test.

Nzt

Contains an "X" if the component is tested in the NZT Test Plan.

Digital

Contains an "X" if the component is tested in the Digital Test Plan.

Escan

Contains an "X" if the component is tested in the ElectroScan Test Plan.

Cscan

Contains an "X" if the component is tested in the CurrentScan Test Plan.

Jscan

Contains an "X" if the component is tested in the JunctionScan Test Plan.

Bscan

Contains an "X" if the component is tested in the Boundary Scan program. Indicates the type of optical test used to test the component. The possible values are:

Optical

Presence: The component Presence test consists in verifying that the mounted component image characteristics, viewed through video camera, are conformable to a reference model. Not empty: The Not empty place test consists in checking that the mounted component image, viewed through the video camera, is different from the reference model characteristics, where there is not the component. Operator check: The Operator inspection consists in the operator check of the mounted component image. The image is viewed through the video camera and it must correspond to what expected. Component shape Ext: The Component shape ext test consists in verifying that the shape characteristics (perimeter and area) of the mounted component image, viewed through the video camera, are conform to a reference model. Component shape: The test type component shape is used only for compatibility with programs developed with an Optical Test version earlier than 3.10. Character verify: Character verification consists in checking that the character sequence, viewed through the video camera, corresponds to a sequence considered as learned and stored reference (model).

Laser

If the component is present (programmed) in the HLT Test Plan, it contains an “X”

OBP

If the component is present (programmed) in the OBP Test Plan, it contains an "X"

Functional

If the component is present (programmed) in the Functional Test Plan, it contains an “X”

64

 User's Guide - Coverage Analysis If the contains

Not Test

component a short

is not present in a Test Plan, description of the reason; possible

this column values are:

Not accessible: The component is not accessible, so it cannot be contacted by the probes. Not Test Model Found: The library model associated to the component test was not found. Hidden Part: The component was not tested for circuit reasons, as for example in case of an inductance in parallel with a capacitance. Wrong Description: The component description in Board Data is wrong (e.g. one component pin is not described). Not generated: The test for the component is not present in any Test Plan. Please pay attention to the fact that in case of top/bottom optimized test projects the secondary program contains the Not generated value if the task has been removed, due to its presence in the primary program. Disabled: The error detection in the Test Plan has been disabled, for example if the tested component is faulty, no error message will be generated during the program execution. Not Mounted: The test of this component is not a Test Plan, due to the fact that it is not mounted on the tested PCB version.

Nominal value

Component nominal value.

Nominal Tol+/Tol-

Value of the nominal positive/negative tolerance.

Tested value

Indicates the tested value.

Offset Value

Indicates the actual offset value.

Tested Tol+/Tol-

Positive/Negative test tolerance applied to the component.

Test Model

Name of the used test model.

Library Name

Name of the used library.

Device Pins

Number of pins on the tested device.

Escan Tested Pins

Number of pins tested using the ElectroScan technique.

Cscan Tested Pins

Number of pins tested using the CurrentScan technique.

Jscan Tested Pins

Number of pins tested using the JunctionScan technique.

Programmer Remark

Programmer remark that can be edited during the debug activity.

Task Name

Task name generated by Leonardo

Special Task

The possible values are: “X”: If the task is a special task. Special: A task is marked as Special during the debug activity if some modifications are applied to it at low level using the Visual debugger. Table 37. Component coverage

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 User's Guide - Coverage Analysis

4.1.6.2  Nets coverage By selecting the Nets tab, the table containing the information concerning the result of the nets coverage is displayed. The fields contained in the table are described below: Field

Description

Net Name

Name of the net connected to the pin.

Test Point Number (only for ICT)

Indicates the Test point associated to the net.

Test Point Count

Total number of Test points present on the specified net.

Master Count

Total number of Master Test points present on the specified net.

Kelvin Count

Total number of Kelvin Test points present on the specified net.

Dummy Count

Total number of Dummy Test points present on the specified net.

Power Count

Total number of Power Test points present on the specified net.

Parallel Count

Total number of Parallel Test points present on the specified net.

Master Used Count

Total number of Master Test points used on the specified net.

Kelvin Used Count

Total number of Kelvin Test points used on the specified net.

Dummy Used Count

Total number of Dummy Test points used on the specified net.

Power Used Count

Total number of Power Test points used on the specified net.

Parallel Used Count

Total number of Parallel Test points used on the specified net.

Short Test Count

Total number of short circuit task generated for the specified net.

Status (only for ICT)

Indicates the net coverage status in the short test. The possible values are: Total: The total coverage of the net is assured Not covered: The net coverage in the short test is not assured Partial: The short test of the selected net is checked only for some nets

Nzt Res. Test

Contains an "X" if the net is tested with the NZT resistive test.

Nzt Cap. Test

Contains an "X" if the net is tested with the NZT capacitive test.

Nzt Ind. Test

Contains an "X" if the net is tested with the NZT inductor test.

Nzt Jun. Test

Contains an "X" if the net is tested with the NZT junction test. Table 38. Nets Coverage

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 User's Guide - Coverage Analysis

4.1.6.3  Open Pins coverage By selecting the Open Pins tab, the table containing the information concerning the result of the open pins coverage is displayed. The fields contained in the table are described below: Field

Description

Drawing Reference

Refers to the name of the component.

Variant

If the project is a variant one the composition name is displayed, otherwise 0 is displayed.

Pin Name

Component pin name. The Open Pin Scan Test Plan on which the pin is present. The possible values

Test Plan

Not Tested

are:

ElectroScan: The pin is present in the ElectroScan Test Plan. CurrentScan: The pin is present in the CurrentScan Test Plan. JunctionScan: The pin is present in the JunctionScan Test Plan. Contains an “X” if the component is not tested. If the pin should be manually verified for efficacy this field is filled with one of the following values:

Critical Test

Nearlc: If the distance between the signal injection probe and ElectroScan probe is less than the minimum allowed distance (5mm). On Pin: If the probe is injecting the ElectroScan signal directly on the tested pin. These cases can happen only on flying probe testers that are using the flying ElectroScan probes or on bed of nails testers that are using bottom side ElectroScan probes. Table 39. Open Pins Coverage

4.1.6.4  Pins coverage By selecting the Pins tab, the table containing the information concerning the result of the component’s pins coverage is displayed. The fields contained in the table are described below: Field

Description

Drawing Reference

Refers to the name of the component.

Variant

If the project is a variant one the composition name is displayed, otherwise 0 is displayed.

Pin Name

Component pin name.

Analog Digital Escan Cscan Jscan Bscan

Contains an “X” if the pin is tested with the specific test type. Note: the Digital field is automatically filled according to the pin’s activity status reported in the Vector Coverage.

Optical OBP Nzt Functional Table 40. Pins Coverage

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 User's Guide - Coverage Analysis

4.1.7  Using the function: a practical example In order to execute the Coverage Analysis perform the following operations: 1. Click the Execute Test Coverage Analysis button or select the Test Coverage Analysis… item in the Data men. 2. The following message will appear: . Click Yes to confirm. The result of the test coverage analysis can be exported to Microsoft Excel; the sequence of required operations are listed below: 1. Click the Export Test Coverage Analysis to Excel button. 2. A security warning message box about the use of Macros could appear. The message box appearance depends on the level of Macro protection that is selected in Microsoft Excel®. If the message box appears, click Yes to run the COVERAGE.XLS file. 3. The COVERAGE.XLS file is created automatically. This is the file that the programmer can use to analyse the coverage achieved by the test project. At the end of the export process the Excel file created includes the following sheets: • • • • • • • • • • • • • • •

Header Parts Details Tested Parts graph Nets Details Parts Resume Analog Test Plan Details Test Plan Tests graph Open Pin Details Tested Parts per Family graph Manually Added Tasks Part Summary Customize Filters Nets Summary Customize Fields Test Points Summary

The next chapters will explain the data content for each of the sheets created.

4.1.7.1  Header By selecting the Header sheet the cover for the complete document is displayed. In this sheet the general information about the analysed test project (such as the programs that compose the test projects) are printed.

This button builds or re-builds the Excel data sheets from the program data.

Figure 4.

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 User's Guide - Coverage Analysis

4.1.7.2  Tested Parts graph sheet By selecting the Tested Parts graph sheet, Test Plan coverage (in %) of the board (Tested, Not Tested and Not Mounted components) is viewed in the following diagram:

Figure 5.

4.1.7.3  Parts Resume sheet By selecting the Parts Resume sheet, data concerning the test program coverage (Tested, Not Tested and Not Mounted components) of each family of components available on the board are viewed In order to consult and graphically view the coverage (in %) of each family of components, it is required to point with the mouse the row of the family to view information about.

Figure 6.

Field

Description

Device Type

Identifies the type of component (example: Resistors, Capacitors, Digital Devices, Diodes etc.).

Component Count

Number of components belonging to the defined board family.

Tested

Number of tested components.

Not Tested

Number of not tested components.

Not Mounted

Number of not mounted components. Table 41. Parts Resume sheet

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 User's Guide - Coverage Analysis

4.1.7.4  Test Plan Tests graph sheet Considering the total of tested components, by selecting the Test Plan Tests graph sheet, the values (in %) of the several types of Test Plan used to test the components (Analog Test, Nzt, Digital Test, Escan, Jscan, Optical Test, OBP), are viewed in the following diagram.

Figure 7.

4.1.7.5  Tested Parts per Family graph sheet By selecting the Tested Parts per Family graph sheet the numerical values of the tested, not tested, not mounted components of each family of the board are viewed in the following diagram.

Figure 8.

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 User's Guide - Coverage Analysis

4.1.7.6  Parts Summary sheet By selecting the Parts Summary sheet the cover for the summary of the tested components is displayed. For every device type present in the test project Data Editor, the total amount of tested devices (regardless of which test plan) is listed. In this sheet the Refresh Part Summary button is present. This button enables to recalculate the values of data contained in the Parts Summary sheet in case of modifications performed in one of the following sheets: • •

Parts Details Analog Test Plan Details

The diagrams concerning the following sheets are furthermore updated: • • • •

Tested Parts graph Parts Resume Test Plan Tests graph Tested Parts per Family graph

Figure 9.

71

 User's Guide - Coverage Analysis The sheet contains the following data: Field

Description

Device Type

Identifies the type of component (example: Resistors, Capacitors, Digital Devices, Diodes etc.).

Component Count

Number of components belonging to the board defined family.

Tested

Number of tested components.

Tested in more test plan

Number of components tested in several Test Plans. Count

Number of not tested components.

Count - Not Mounted

Number of components present on board and not tested.

Not Executed

Number of not executed components.

Masked

Number of components that are included in a parallel but whose absence could not be detected. For example a capacitor of low value in parallel with a high value component.

Disabled

Number of disabled components. The error detection in the Test Plan has been disabled, for example if the tested component is faulty, no error message will be generated during the program execution.

Not Generated

Number of not generated components. The test for the component is not present in a Test Plan. Please pay attention to the fact that in case of top/bottom optimized test projects, the secondary program contains the Not Generated value if the task has been removed, due to its presence in the primary program.

Not Mounted

Number of not mounted components.

Not Accessible

Number of not accessible components, so, that cannot be contacted by the probes.

No Test Model Found

Number of components whose library model has not been found.

Hidden Part

Number of components not tested for circuit reasons as, for example, in case of an inductance in parallel with a capacitance.

Wrong Description

Number of components whose description in Board Data is wrong (e.g. wrong description of a pin of the component).

Not Tested

Analog Test

Number of components tested in the Analog Test Plan.

Nzt

Number of components tested in the NZT Test Plan.

Digital Test

Number of components tested in the Digital Test Plan.

Open pin test

Escan

Number of pins tested using the ElectroScan technique.

Cscan

Number of pins tested using the CurrentScan technique.

Jscan

Number of pins tested using the JunctionScan technique.

Boundary Scan

Number of components tested in the Boundary Scan program.

Optical Test

Number of components tested in the Optical Test Plan.

OBP

Number of components tested in the OBP Test Plan.

Cluster

Number of components tested using the Cluster technique. Table 42. Parts summary

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4.1.7.7  Nets Summary sheet By selecting the Nets Summary sheet the cover for the summary about the tested nets, basically the number of nets present in the Data Editor, the number of nets accessible and not accessible is displayed.

Figure 10.

Field

Not Tested

Open pin test

Description Count

Number of not tested components.

Count - Not Mounted

Number of components present on board and not tested.

Not Executed

Number of not executed components.

Escan

Number of pins tested using the ElectroScan technique.

Cscan

Number of pins tested using the CurrentScan technique.

Jscan

Number of pins tested using the JunctionScan technique. Table 43. Nets Summary

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4.1.7.8  Test Points Summary sheet By selecting the Test Points Summary sheet, it is viewed the number of contact types of each test point available on board.

Figure 11.

Field

Contact Type / Count

Description TH pin

Number of Test points positioned on the “Through Hole” components pins.

SMD pad

Number of Test points positioned on “SMD” components pads.

Pad

Number of Test points positioned on “Pad” type components.

Via

Number of Test points positioned on “Via” type components.

Connector

Number of Test points positioned on the “Connectors” pins.

Test Point

Number of Test points positioned on “Test point” type components.

Test Point Count

Number of positioned Test points.

Table 44. Test Points Summary

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4.1.7.9  Parts Details sheet By selecting the Parts Details sheet, the cover for the complete document is displayed. In this sheet the general information about the analysed test project (such as the programs that compose the test projects) are printed. In this sheet the following buttons are present: •

Customize This button allows the programmer to customize (with Spea pre-defined view) the sheet layout and displayed information. This button allows to apply to the current sheet some customization, in order to display in a different way the information about the component coverage. For a detailed explanation about the possible customization, refer to the “Customize Filters sheet “ paragraph.

•

Find This button allows the programmer to define and search for a certain value contained in a specific column of the table. By clicking on the button, the search row (yellow highlighted) is automatically viewed.

Figure 12.

Field

Description

Drawing reference

Refers to the name of the component.

Variant

If the project is a variant one the composition name is displayed, otherwise 0 is displayed.

Device Name

Commercial name of the component to which SPEA libraries refer.

Device Type

Identifies the type of component (example: Resistors, Capacitors, Digital Devices, Diodes etc.).

Nominal value

Component nominal value.

Nominal Tol+/Tol-

Value of the nominal positive/negative tolerance. Contains the Test program type on which the device is tested. Possible values are:

Test Project

Main For Top/Bottom optimized test projects primary program. Secondary For Top/Bottom optimized test projects secondary program.

Analog Test

Contains an "X" if the component is tested in the Analog Test Plan.

Nzt

Contains an "X" if the component is tested in the NZT Test Plan.

Digital Test

Contains an "X" if the component is tested in the Digital Test Plan.

Electro Scan

Contains an "X" if the component is tested in the ElectroScan Test Plan.

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Contains an "X" if the component is tested in the CurrentScan Test Plan.

Junction Scan

Contains an "X" if the component is tested in the JunctionScan Test Plan.

Boundary Scan

Contains an "X" if the component is tested in the Boundary Scan program. Indicates the type of optical test the component has been tested with. The possible values are:

Optical Test

OBP

Presence The component presence test consists in verifying that the mounted component image, viewed through the video camera, has characteristics, which are conformable to a reference model. Not empty The not empty place test consists in checking that the image of the mounted component, viewed through the video camera, is different from the reference model characteristics, where there is not the component. Operator check The operator inspection consists in checking, by means of the operator, that the image of the mounted component, viewed through the video camera, corresponds to what expected. Component shape Ext Component shape ext test consists in verifying that the mounted component image, viewed through the video camera, has shape characteristics (perimeter and area), which are conform to a reference model. Component shape The test type component shape is used only for compatibility with programs developed with an Optical Test version earlier of 3.10. Character verify Character verification consists in checking that the character sequence, viewed through the video camera, corresponds to a sequence considered as learned and stored reference (model). Contains an "X" if the component is present (programmed) in the OBP Test Plan. If the component is not present in a Test Plan, this column contains a short description of the reason, possible values are:

Not Test

Not accessible The component is not accessible so it cannot be contacted by the probes. Not Test Model Found The library model associated to the component test was not found. Hidden Part The component is not tested for circuit reasons as for example in case of an inductance in parallel with a capacitance. Wrong Description The description of the component in Board Data is wrong (e.g. one component pin is not described). Not generated The test for the component is not present in any Test Plan. Please pay attention to the fact that in case of top/bottom optimized test projects the secondary program contains the value Not generated if the task has been removed, due to its presence in the primary program. Disabled The error detection in the Test Plan has been disabled, for example if the tested component is faulty, no error message will be generated during the program execution. Not Mounted The test of this component is not a Test Plan, due to the fact that it is not mounted on the tested PCB version.

Device Pins

Number of pins on the tested device.

Tested Escan Pins

Number of pins tested using the ElectroScan technique.

Tested Cscan Pins

Number of pins tested using the CurrentScan technique.

Tested Jscan Pins

Number of pins tested using the JunctionScan technique. Table 45. Parts Details

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4.1.7.10  Nets Details sheet By selecting the Nets Details sheet the cover for the detailed result of Test Coverage Analysis with reference to each net is displayed.

Figure 13.

Field

Description

Net Name

Name of the net connected to the pin.

Long Name

View of long net name.

Test Point Number (only for ICT)

Indicates the Test point number associated to the net name.

Composition Name

Name of the composition to which the components are associated.

Test Point Count

Total number of Test points present on the specified net.

Short Test Count

Total number of short circuit task generated for the specified net. Indicates the net coverage status in the short test. The possible values are:

Status (only for ICT)

Test Point not check

Nodal Z Impedance Test

Total

The total coverage of the net in the short test is assured.

Not covered

In the short test, no net coverage is assured.

Partial

The short test of the selected net is checked only for some nets.

Indicates for which Test points the net is not tested. Resistance

Contains an “X” if the net is tested with the NZT resistive test.

Capacitance

Contains an “X” if the net is tested with the NZT capacitive test.

Inductance

Contains an “X” if the net is tested with the NZT inductor test.

Junction

Contains an “X” if the net is tested with the NZT junction test. Table 46. Nets Details

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4.1.7.11  Analog Test Plan Details sheet By selecting the Analog Test Plan Details sheet the cover for the detailed result of the Test Coverage Analysis about the Analog test is displayed. In this sheet the following buttons are present: •

Customize This button allows the programmer to customize (with Spea pre-defined view) the sheet layout and displayed information. This button allows to apply to the current sheet some customization, in order to display in a different way the information about the component coverage. For a detailed explanation about the possible customization, refer to the paragraph 3.14.

•

Find This button allows the programmer to define and search for a certain value contained in a definite column of the table. By clicking on the button, the search row (yellow highlighted) is automatically viewed.

Figure 14.

Field

Description

Drawing reference

Refers to the name of the component.

Variant

If the project is a variant one the composition name is displayed, otherwise 0 is displayed.

Device Name

Commercial name of the component to which SPEA libraries refer.

Device Type

Identifies the type of component (example: Resistors, Capacitors, Digital Devices, Diodes etc.). Contains the Test program type on which the device is tested. Possible values are:

Test Project

Main

For Top/Bottom optimized test projects primary program.

Secondary

For Top/Bottom optimized test projects secondary program.

The possible values are: Analog Test

“X”

If the component is tested in Analog Test Plan.

Internal

If the Array type component internal parts (resistor array, diode array, etc.) have been tested in the Analog Test Plan.

The possible values are: Parallel Tested

“X”

If the component is included in a parallel.

Masked

If the current component is included in a parallel but its absence could not be detected. For example a capacitor of low value in parallel with a high value component.

78

 User's Guide - Coverage Analysis Indicates, for the component analog test, the Test Plan employed to optimize it. The possible value is:

Optimized

NZT

The component analog test was optimized with the NZT Test Plan.

The possible values are: Special Task

Cluster (manual edit) Manually Added (manual edit)

"X"

If the task is a special task.

Special

A task is marked as Special during the debugging activity if some modifications are applied to it at low level using the Visual debugger.

Number of components tested using the Cluster technique. Tasks

Total manually edited tasks. If the component is not present in a Test Plan, this column contains a short description of the reason, possible values are: The component is not accessible, so, it cannot be contacted by the probes.

Not accessible Not Test Found

Not Test

Model

The library model associated to the component test was not found.

Hidden Part

The component was not tested for circuit reasons like, for example, in case of an inductance in parallel with a capacitance.

Wrong Description

The component description in Board Data is wrong (e.g. one component pin is not described).

Not generated

The test for the component is not present in any Test Plan. Please pay attention to the fact that in case of top/bottom optimized test projects the secondary program contains the value Not generated if the task has been removed, due to its presence in the primary program.

Disabled

The error detection in the Test Plan has been disabled, for example if the tested component is faulty, no error message will be generated during the program execution.

Not Mounted

The test of this component is not any Test Plan, due to the fact that it is not mounted on the tested PCB version.

Nominal Value

Component nominal value.

Nominal Tol+/Tol-

Value of the nominal positive/negative tolerance.

Tested value

Indicates the tested value.

Tested Tol+/Tol-

Positive/Negative test tolerance applied to the component.

Test Model

Name of the used test model.

Library Name

Name of the used library.

Task Name

Task name generated by Leonardo

Programmer Remark

Programmer remark that can be edited during the debug activity. Table 47. Analog Test Plan Details

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4.1.7.12  Open Pins Details sheet By selecting the Open Pins Details sheet the cover for the detailed result of the Test Coverage Analysis about the open pin scan test is displayed. In this sheet the Find button is present. This button allows the programmer to define and search for a certain value contained in specific column of the table. By clicking on Find button, the search row (yellow highlighted) is automatically viewed.

Figure 15.

Field

Description

Drawing Reference

Refers to the name of the component.

Variant

If the project is a variant one the composition name is displayed, otherwise 0 is displayed.

Pin Name

Component pin name.

Test Project

Name used for the Test Project. The Open Pin Scan Test Plan on the pin is present. The possible values are:

Test Plan

ElectroScan

The pin is present in the ElectroScan Test Plan.

CurrentScan

The pin is present in the CurrentScan Test Plan.

JunctionScan

The pin is present in the JunctionScan Test Plan.

Not Tested

If the pin is not tested this field is filled with a short description about the reason, used value are indicated in the following tables. The values change in accordance with the type of used Test Plan (ElectroScan, CurrentScan or JunctionScan).

Critical Tested

If the pin should be manually verified for efficacy this field is filled with one of the values indicated in the following tables. The values change in accordance with the type of used Test Plan (ElectroScan, CurrentScan or JunctionScan). Table 48. Open Pins Details

80

 User's Guide - Coverage Analysis The description of the possible values that can be found in each field is reported below: Electro Scan Field

Description The possible values are:

Not Tested

Disable by programmer

If the pin has been disabled by the programmer during the debugging activity, for example due to a too low measured level.

Power Supply

If the pin is a power supply pin. All the pins of an IC connected to a power supply net (regardless of function in the open pin scan test) are automatically disabled during the open pin test plan generation. The list of power supplies nets must be filled in Data Editor.

On Pin*

If the probe is injecting the ElectroScan signal directly on the tested pin.

Nearlc*

If the distance between the signal injection probe and ElectroScan probe is less than the minimum allowed distance (5mm).

Conflict (only for Flying Probe)

If the pin is not reachable by the forcing probe, due to some mechanical constrictions

Under V

If the pin voltage value is < 0V.

Over V

If the pin voltage value is > 10V.

No Test Point

The net cannot be contacted because the pin is not validated.

Guard

The net of the pin to test is a guard point.

The possible values are:

Critical Tested

On Pin1

If the probe is injecting the ElectroScan signal directly on the tested pin.

Nearlc1

If the distance between the signal injection probe and ElectroScan probe is less than the minimum allowed distance (5mm).

Conflict (only for Flying Probe)

If the pin is not reachable by forcing the probe, due to some mechanical constrictions.

Under V

If the pin voltage value is < 0V.

Over V

If the pin voltage value is > 10V.

No Test Point

The net cannot be contacted because the pin is not validated.

Guard

The net of the pin to test is a guard point.

Current Scan Field

Description The possible values are:

Not Tested

Power Supply

If the pin is a power supply pin. All the pins of an IC connected to a power supply net (regardless of function in the open pin scan test) are automatically disabled during the open pin test plan generation. The list of power supplies nets must be filled in Data Editor.

Not generated

If the pin under test cannot be contacted with test probe (or test point).

The possible values are:

Power Supply

If the pin is a power supply pin. All the pins of an IC connected to a power supply net (regardless of function in the open pin scan test) are automatically disabled during the open pin test plan generation. The list of power supplies nets must be filled in Data Editor.

Not generated

If the generator detects a critical or not realizable circuit condition.

Critical Tested

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 User's Guide - Coverage Analysis Junction Scan Field

Description The possible values are:

Not Tested

Power Supply

If the pin is a power supply pin. All the pins of an IC connected to a power supply net (regardless of function in the open pin scan test) are automatically disabled during the open pin test plan generation. The list of power supplies nets must be filled in Data Editor.

Vcc tied

If the pin under test is tied to Vcc.

Gnd tied

If the pin under test is tied to Gnd.

C o n f l i c (only for Flying Probe)

t If the pin is not reachable by the forcing probe, due to some mechanical constrictions.

No Test Point

If on a certain pin there are no Test points.

Digital/Diode connected

If the pin is connected to other digital components or to one or several pins.

Digital connected

If the pin is connected to other digital components.

Diode connected

If the pin is connected to one or several diodes.

The possible values are:

Critical Tested

Vcc tied

If the pin under test is tied to Vcc.

Gnd tied

If the pin under test is tied to Gnd.

C o n f l i c (only for Flying Probe)

t If the pin is not reachable by the forcing probe, due to some mechanical constrictions.

No Test Point

If on a certain pin there are no Test points.

Digital/Diode connected

If the pin is connected to other digital components or to one or several pins.

Digital connected

If the pin is connected to other digital components.

Diode connected

If the pin is connected to one or several diodes.

Table 49. Electro Scan possible values

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4.1.7.13  Manually Added Tasks sheet By selecting the Manually Added Tasks sheet the cover for the detailed list of task that has been manually added after the automatic test program generation is displayed.

Figure 16.

Field

Description

Task Name

Task name that has been manually added. Contains the Test program type on which the device is tested. Possible values are:

Test Project

Main

For Top/Bottom optimized test projects primary program.

Secondary

For Top/Bottom optimized test projects secondary program. Table 50. Manually Added Tasks

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4.1.7.14  Customize Filters sheet By selecting the Customize Filters sheet it is possible to customize the layout and the display format on all the sheet and in particular of the “Analog Test Plan Details” and “Parts Details” sheets In order to apply the selected filter view, it is required to click one of the available pushbuttons and then click Refresh button.

It refers to the Analog Test Plan Details sheet It refers to the Parts Details sheet It refers to the all sheet

Figure 17.

Analog Test Plan sheet Button

Description

Not Tested / Critical

This button displays all the polarized capacitors, all the tasks that have a programmer remark and all the components that are not tested in the Analog Test Plan. It can be used to have the list of the devices that are not tested in the Analog Test Plan.

Nominal and Tested Value This button displays all the components that are present in the Analog Test Plan and tested Difference with a value different from the nominal one. Nominal and Tested Tolerance Differences

This button displays all the components that are present in the Analog Test Plan and tested with positive and/or negative tolerance different from the nominal. In order to apply the selected display mode a filter in the Analog Test Plan sheet, it is applied to all the tolerances that have a difference between tolerances that are bigger than what is defined in the Tolerance table present in the sheet.

Parts details sheet Button

Description

Not Tested

This button allows to display all the polarized capacitors, all the tasks that have a programmer remark and all the components that are not tested in the Analog Test Plan. This is helpful, in order to identify if the components that are not tested in the Analog Test Plan are tested in some other Test Plans (such as Optical, ElectroScan, etc.). It can be used even to check if the polarized capacitors are tested or if the programmer during the debugging activity has added some specific remark on some tasks.

All sheets Button

Description

Top/Bottom

This button is usable in case of a top/bottom optimized program. It displays all the components that are present in the Analog Test Plan, regardless of which side they are on.

All view

This button allows to remove all the filters applied in the Test Coverage Report sheets. Table 51. Customize filter sheets

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4.1.7.15  Customize Fields sheet By selecting the Customize Fields sheet it is possible to customize the view of the columns in the “Parts Details” and “Analog Test Plan Details” sheets. In this sheet the Save settings button is present. This button allows to save the current columns configuration. In order to apply the current view of the considered sheet, it is required to select the Customize Filter sheet and then click Refresh button.

Reference sheets

Figure 18.

Field

Description

Column Type

Name of the columns contained in the sheet.

Show

The possible value is: “X”

View of the information concerning the considered column. Table 52. Customize filter sheets

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4.2  Test Plan Checker Contents 4.2.1  What it is for...................................................................................... 86 4.2.2  What it achieves............................................................................... 87 4.2.3  On which systems it runs.................................................................. 87 4.2.4  When to use it and when not to........................................................ 87 4.2.5  Support, prerequisites and system settings..................................... 87 4.2.6  What to do to use it........................................................................... 87 4.2.7  Using the function: a practical example............................................ 88 4.2.7.1  Classes of Error Messages.................................................. 90

4.2.1  What it is for The “Test Plan Checker” function verifies if the ICT Test Plan programming is correct and doesn’t endanger the system and/or the board under test (UUT). The performed Test Plan Checking includes the following checks: •

Programming checks: check if the programming of the instrument is coherent with that of the instrument described in the current Hardware Configuration of the system. E.g.: Check that Driver I5V voltage limit. 8. Suspected Programming Dangerous for the System (SSYS): One on more external parameter could damage the system. E.g.: Connect the driver with the reference = External. If the Voltage source is >0V voltage the relays could be damaged. 9. Critical programming for the System (SYS): One on more external parameter could damage the system. E.g.: Connect the driver, programmed with current limit greater than 100mA, to a machine channel. 10. Suspected Forbidden Programming (SFP): One on more external parameter could damage the system and/ or the UUT. E.g.: Program on the driver with output stage equal to Signal and the reference = External. If the Voltage source is >5V voltage, the Signal stage is damaged. 11. Forbidden Programming (FP): Programming damages the system and/or the UUT. E.g.: Program on the driver the >10mA current limit with output stage equal to Signal. Notice

•

• • •

•

The U.U.T. safety check use the parameter Vmin, Vmax, Imax e Vknee written in IC component data. If the IC is not present, the default value defined by the programmer are used instead. The test with one or more parameter influenced by not detectable external factor (E.G.: voltage of the U.U.T.) is marked with a suspected error (4,6,8,10). Undetectable parameter are indicates as Parameter = ? E.g.: Vsource = ?. The presence of error type 1 forbids the test plan execution; the programmer will have to execute the ICT to fix it. The presence of error types 4 to 10 forbids the test plan execution; the programmer will have to validate (if his Authorization level is 60 or higher – Programmer Level 2) or correct the test. With the validation, the programmer force the test programming despite the error detected. Leonardo will store the username of the validator. The presence of error type 11 forbids the test plan execution; the programmer will have to correct the test to fix it.

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4.3  Test Result Analyzer Contents 4.3.1  What it is for...................................................................................... 91 4.3.2  What it achieves............................................................................... 92 4.3.3  On which systems it runs.................................................................. 92 4.3.4  When to use it and when not to........................................................ 92 4.3.5  Support, prerequisites and system settings..................................... 92 4.3.6  What to do to use it........................................................................... 93 4.3.6.1  TRA Configuration............................................................... 95 4.3.6.2  TRA Loader......................................................................... 97 4.3.6.3  TRA Toolbar........................................................................ 98 4.3.6.4  TRA statistical analysis....................................................... 99 4.3.6.5  Production summary analysis............................................. 99 4.3.6.6  Worksheet analysis........................................................... 100 4.3.6.7  Device correlation analysis................................................ 103 4.3.7  Using the function: a practical example.......................................... 104 4.3.7.1  Measure stability analysis.................................................. 104 4.3.7.2  Gauge Repeatability & Reproducibility data import........... 105 4.3.7.3 Reports.............................................................................. 106

4.3.1  What it is for The “Test Result Analyser” (TRA) function allows to perform statistical analysis of test data results collected by the tester in the CdColl (Certification Data Collection file). The test engineer that develops the test program will use the TRA for analyzing the acquired measures (accuracy, stability, distribution …) and quickly adjust the test program according to the TRA reports. At the end of this adjustment, the TRA will be used for generating reports for test program certification. TRA can be also used to monitor production efficiency and fault distribution.

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4.3.2  What it achieves The “Test Result Analyzer” function generates some reports for test program certification according to the executed analysis type. All reports are selectable by the “Report” menu. Selecting the desired report, the software will generates an HTML file that can be opened with all the browsers. The available reports are: •

Summary

•

Measure correlation

•

Worksheet

•

MSC analysis

•

Test details

Figure 1. Reports overview

4.3.3  On which systems it runs The “Test Result Analyzer” function can be used on Bed of Nails and Flying Probe SPEA systems.

4.3.4  When to use it and when not to The TRA is useful within the whole test program development process from the debug to the certification phase and for production control. For these reasons, it is recommended to run it each time.

4.3.5  Support, prerequisites and system settings The fully-generated test program has to be ready before using the “Test Result Analyzer” function.

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4.3.6  What to do to use it Click on the “Test Result Analyzer” icon of Leonardo OS2 to use the function:

Figure 2. Leonardo OS2 Main Panel overview

It is also possible to reach it in the following ways: •

Leonardo Express 1. Click on “Qualification” on the left side of the screen. 2. Click on the “Test result analyzer” icon.

•

Leonardo Advanced 1. Click on the “Certification” icon on the left side of the screen. 2. Click on the “Test result analyzer” button on the right:

Figure 3. Test result analyzer in Leonardo Advanced

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 User's Guide - Test Result Analyzer The “Test result analyzer” environment will appear as follows:

Figure 4. TRA environment overview

The TRA software package is composed by three main parts: • • •

TRA Loader TRA Statistic Analyzer TRA Delete Data

First of all, before performing statistical analysis, the test results collected in the CdColl file is automatically imported in the TRA Database by the TRA Loader. The test results or parts of them, contained in the database, can be analyzed by the TRA Statistic Analyzer. This will generate graphic charts and reports in order to perform the desired analysis. The results contained in the database concern the Analogue, NZT and Optical tests. In the following figure is shown the TRA Block Diagram:

Figure 5. TRA Block Diagram

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4.3.6.1  TRA Configuration The Leonardo CD contains the installation of the MSDE software in order to create a local database. The MSDE software installation has to be performed with the required MSDE operating steps. After the installation of MSDE software, if no databases are available, a new database will be automatically created, during the first access to TRA software, only if the user is ADMINISTRATOR. Clicking on View | Configuration to open the following configuration panel and set up the parameters for the TRA (Tool Result Analysis) software package. •

Database connection

Figure 6. TRA Configuration window, Database connection

•

Enter a server name: This field is filled with the name of the server where the database is located. The name of the database is automatically fixed by the software as AtosC2_TRA.

•

Enter a path name: This field is filled with the local server path name where the database is located. This path must be an existing path present in the server.

•

Enter information to log on a server: • • •

Use Windows NT integrated security: If this field is enabled, the Windows NT integrated security will be used to log on a server. Use a specific username and password: If this field is enabled, to log on a server will be necessary to enter User name and password defined in the “User name” and “Password” items. Blank password: If this field is enabled, to log on a server no password is required.

•

Test connection: verify the connection of the server.

•

Create database: create an empty database.

•

Delete database: delete an existing database.

•

Local settings (only when software running from network disk): If the software is running from network disk, it is required to set the file used by the TRA to import the datalog.

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 User's Guide - Test Result Analyzer •

General

Figure 7. TRA Configuration window, General

• • • •

•

During the import datalog use timestamp for lot number empty or not available: If this flag is checked, the lot name will be composed by date and time of the lot, in case of the lot number is not available in the datalog. In the char distribution join the die and create only one series: If this flag is checked, all the dies are compressed into only die during worksheet analysis. Aggregate the “add analysis” data into existing analysis: If this flag is checked, all existing analysis will be influenced by “Add analysis” data. Stop automatically the server service at TRA closure: If this flag is checked, the SQL service will be disabled in order to not use the PC’s memory. At the new TRA starting, the SQL service will be automatically enabled.

Worksheet

Figure 8. TRA Configuration window, Worksheet

• • • • •

Decimal places: This field contains the number of decimal digits that will be displayed into the measures. Statistical process index 1: It defines the statistical process indexing to be used in the “worksheet analysis”. It is possible to select the Cp or Cpk (Process Capability ratiostatistical parameter). Statistical process index 2: In addition to the statistical process indexing 1, it defines the other statistical parameter to be used. It is possible to choose between: Cpk, %EV or %A&R. The %EV is a way to describe the accuracy of a (repetitive) test. In this aspect stands for Equipment Variation. Test rating based on: It defines which statistical parameters have to be considered in order to calculate the test rating in the “worksheet analysis”. It is possible to choose between: • Statistical process index 1 (Cp) • Statistical process index 2 (Cpk or %EV) 96

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•

Cp limit / Cpk / limit Rating good limit: If the “Cp”, “Cpk” calculation of the measure is higher than this threshold, the box plot of the “worksheet analysis” will be colored in “green”. • Rating acceptable limit: If the “Cp”, “Cpk” or “Cgk” calculation of the measure is lower than this threshold, the box plot of the “worksheet analysis” will be colored in “red”. %EV / %A&R limit • Rating good limit: If the “%EV” or “%A&R” calculation of the measure is higher than this threshold, the box plot of the “worksheet analysis” will be colored in “green”. • Rating acceptable limit: If the “%EV” or “%A&R” calculation of the measure is lower than this threshold, the box plot of the “worksheet analysis” will be colored in “red”.

4.3.6.2  TRA Loader The TRA Loader allows to import the CdColl file into the TRA database. The TRA loader can work in two different ways: •

Automatic Load: At each test program opening, the software automatically detects new CdColl file and import them in the TRA Database without user intervention.

•

Interactive Load: The user has to click the “Import Datalog…” button. The “TRA file loader” panel will be displayed where it will be possible to select the format and the CdColl file to import as shown in the following figure:

Figure 9. TRA Loader

The CdColl file to be imported is located at the following path: C:\$SPEAFLY1\PRJ\\\PROGRAM\stability__.txt

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4.3.6.3  TRA Toolbar All functions of the TRA are available through the buttons of the “TRA” toolbar.

Figure 10. TRA toolbar

This toolbar is displayed at the top of the screen opening the TRA software. The Toolbar buttons perform the following functions: Import a new datalog. Delete one or more datalogs.

Perform a new analysis. Add a new analysis to an analysis previously selected. If checked, the analysis will be performed using results of all tests (pass and fail). If checked, the analysis will be performed using results of only pass test(s). If checked, the analysis will be performed using results of only pass test(s). Perform an analysis search by test name or test number. Clicking on this button, the following toolbar will be open on the bottom side of the window:

Change search

Figure 11. Test Name / Test No. search switch

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4.3.6.4  TRA statistical analysis The TRA statistical analysis is a tool that allows to analyze the test results previously loaded in the TRA Database. The following possible analyses that can be executed: • • •

Production summary Worksheet analysis Device correlation analysis

4.3.6.5  Production summary analysis The Production summary panel displays information in order to evaluate production efficiency. It is composed by two panels: •

Board summary It displays statistics about the tested boards included in the data selection. • • • • •

•

N Board tested: It identifies the total number of tested boards. N Board retested: It identifies the number of total retest made on the boards. Total pass: It identifies the total Pass results of the test program. Total fail: It identifies the total Fail results of the test program. Yield: It identifies the yield of the production.

Productivity chart The Productivity chart shows graphically the production summary analysis. It displays the percentage of pass and fail results calculated on the total tested.

Figure 12. Productivity chart

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4.3.6.6  Worksheet analysis The worksheet panel displays for each test some statistical parameters calculated on the related measure.

Figure 13. Worksheet analysis

The statistical parameters concern in detail the following information: • • • • • • • • • • • • •

Test Name: Name of test Test No.: Number of test Type: Test type (Analog, Optical or NZT tests) UM: Base measurement Th high: High threshold test value Th low: Low threshold test value Nominal value: Test nominal value N.Meas: Number of measurement executed Mean: Mean of the executed measures Std Dev: Standard deviations Cp: Cp value Cpk: Cpk value Box plot: This box allows to know the trend of the measures of the selected task. It displays the parameter previously selected in the “statistical process index” option of the “TRA Configuration” panel. Furthermore, it is colored according with the “Rating limit” values defined in the “TRA Configuration” panel. -3sigma

Mean

Thr Low

+3sigma

Thr High

Figure 14. Box plot

As shown in the following figure, after double clicking on any test, a graphical chart of the selected test is displayed for detailed evaluation on the executed measures:

Figure 15. Test details

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Frequency distribution This graph shows a frequency distribution of the measurements performed on the selected test. Three markers identify on the chart the following distribution value: • • •

Mean -3sigma +3sigma

Figure 16. Frequency distribution graph

Tight and tall frequency distribution means that the measures have a good stability. Otherwise, a large distribution means a bad stability. The distribution of two or more measures that are equal will be overlapped. •

Measure distribution This graph shows the measure distribution for each measurement. Three markers identifies: • • •

Threshold high Threshold low Mean

This graph allows to analyze the trend of the measurements. The distribution of two or more equal measures will be overlapped. Double clicking on the chart, the y axis is automatically scaled to the minimum and maximum measure value for a quick zoom.

Figure 17. Measure distribution chart

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 User's Guide - Test Result Analyzer Clicking and dragging the mouse from top left corner to right bottom corner, it is possible to zoom the selected area of the chart. Clicking and dragging the mouse from right bottom corner to top left corner, it is possible to zoom out.

Figure 18. Zoom on chart

•

Table All the measures of the selected test are resumed in a table format. This is useful to export all the measurement to a .CSV file for custom analysis calculation. If one or more measures are fail, the related cell will be colored in red.

Figure 19. Table of measures

•

Measure correlation This graph shows the correlation between two measures. All values of the first and second measures are shown on the X and Y axes. As shown in the following figure, all values that coincide are represented with a blue point.

Figure 20.

Clicking and dragging the mouse from top left corner to right bottom corner, it is possible to zoom the selected area of the chart. Clicking and dragging the mouse from right bottom corner to top left corner, it is possible to zoom out.

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MSC analysis This graph shows the measurements stability correlation. It shows in detail the measure distribution for each measurement. Three markers identifies: • • •

Threshold high Threshold low Mean

This graph allows to analyze the trend of the measurements. The distribution of two or more equal measures will be overlapped. Double clicking on the chart, the y axis is automatically scaled to the minimum and maximum measure value for a quick zoom.

Figure 21. MSC graph

Clicking and dragging the mouse from top left corner to right bottom corner, it is possible to zoom the selected area of the chart. Clicking and dragging the mouse from right bottom corner to top left corner, it is possible to zoom out.

4.3.6.7  Device correlation analysis The Device correlation panel contains all the measures of the tested device. These data written in a table can be exported in the excel format in order to perform customized analysis and calculation. This table support maximum 250 tested device and 65500 tests (standard excel limits).

Figure 22. Device correlation panel

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4.3.7  Using the function: a practical example The chapters below will guide the user to execute the following operations using the Test Result Analyzer: • • •

Measure stability analysis Gauge Repeatability & Reproducibility data import Reports

4.3.7.1  Measure stability analysis The measure stability analysis is generally used in debug phase to verify the stability of the measurement method. With the TRA software package it is possible to verify the distribution of the measurement values. Tight and tall frequency distribution means that measure has a good stability and repeatability, while a large distribution means a bad stability. Execute the following steps to carry out the stability analysis: 1. “n” measures will be made on the board using a Golden device and a CdColl file will be generated. 2. Open the TRA software package. Click Worksheet in order to see the statistical parameter of the selected measure; Use the “Box plot” and the “Frequency distribution” to define if this measure is stable or not. Tight and tall frequency distribution means that the measures have a good stability and repeatability. In the following figure is an example of frequency distribution:

Figure 23. Frequency distribution

3. If it is required to compare the measurements with others performed on the same board, perform the following operations: a. b.

Click the “Import Datalog…” button to display the “TRA file loader” panel. Select the format and the CdColl file to import. The file *.txt to be selected is located at the following path: C:\$SPEAFLY1\PRJ\\\PROGRAM\



At this path it is possible to select the new and the previous CdColl file generated automatically by the TRA software package. The file has the following format: stability _ _ .txt

4. In order to compare the measurements and define if this measures are stable or not, in the “Worksheet” there are available the “Measure correlation” and the “MSC analysis” charts. For more details, refer to the Worksheet chapter.

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4.3.7.2  Gauge Repeatability & Reproducibility data import To carry out a Gauge Repeatability & Reproducibility (GR&R) analysis, first acquire the data to analyze following these steps: 1. Start the Production Control Panel from Leonardo Suite 2. Click the GR&R button on the top bar: the following panel appears:

Figure 24. GR&R Manual Operating Panel

3. 4. 5. 6. 7.

Fill the fields in the Settings section: Click Begin Session Enter the name of operator 1 Click Continue: GR&R status will change to running... Click Start on the Production control Panel to start the production cycle:

Figure 25. Production Control Panel

8. Wait until the GR&R session is terminated 9. Open the TRA and click File > Import Datalog to display the “TRA file loader” panel. 10. Select the generated GR&R csv CdColl file

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4.3.7.3  Reports The TRA software package generates some reports for test program certification according to the executed analysis type. All reports are selectable by the “Report” menu. Selecting the desired report, the software will generates an HTML file that can be opened with all the browsers. The available reports are: • Summary • Worksheet • Test details • Measure correlation • MSC analysis • Gauge R&R

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4.4  Test Program Statistics Contents 4.4.1  What it is for.................................................................................... 107 4.4.2  What it achieves............................................................................. 107 4.4.3  On which systems it runs................................................................ 107 4.4.4  When to use it and when not to...................................................... 107 4.4.5  Support, prerequisites and system settings................................... 107 4.4.6  What to do to use it......................................................................... 108 4.4.7  Using the function: a practical example.......................................... 109

4.4.1  What it is for The “Test Program Statistics” function estimates the time needed for the execution of the generated test program.

4.4.2  What it achieves Running the “Test Program Statistics” function will provide a test time estimation for all systems (4050/4030) and all motion profiles (STD / TRB1 / TRB2 / TRB3) to be used for production timing optimization purposes.

4.4.3  On which systems it runs The “Test Program Statistics” function can be used on Bed of Nails and Flying Probe SPEA systems.

4.4.4  When to use it and when not to The data provided by the “Test Program Statistics” function can be gathered from all test programs for all boards.

4.4.5  Support, prerequisites and system settings The fully-generated Test Program must be available before using the “Test Program Statistics” function.

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4.4.6  What to do to use it Click on the “Test Program Statistics” icon of Leonardo OS2 to use the function:

Figure 1. Leonardo OS2 Main Shell

It is also possible to reach it in Leonardo Advanced following the steps below: 1. Click on the “Certification” icon on the left side of the screen. 2. Click on the “Test Program Statistics” button on the right:

Figure 2. Test Program Statistics in Leonardo Advanced

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4.4.7  Using the function: a practical example The “Test Program Statistics” environment will appear as follows: Test Project visualization: Test tim e is displayed for each test plan. Details for the analogue tests are grouped by Type of com ponent tested (Passive, Discrete, etc.) Analogue Test Plan visualization: Detailed data about the Analogue Test Plan tim es is grouped by com ponent tested (Resistor, Capacitor, Diode etc)

Figure 3. Test Program Statistics Overview

Here below a detailed description of the columns of the Test Program Statistics: •

Test Plan Information



Test Plan: Type of Test Plan. It is possible to display data for all Test Plan types (Total) or narrow the data, for example, to Analogue or Optical test plan only.



Task type: Type of Task or group of Tasks. It is possible to display data for all Tasks (All) or narrow the data, for example, to tasks specific types of components such as Resistors, Capacitors, Passive components, etc.



Total Task: Total number of Tasks for the Test Plan / Task Type selected.



Total Test: Total number of Tests for the Test Plan / Task Type selected. •

Estimated Test Time



Total: Total test time, considering both measurement time and movement time.



Measure: Time needed for the measurements performed for the tests.



Movement Time: Time needed for the motion of the axes,



Movement Count: Total number of movements.

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4.5  Board Testing Report Contents 4.5.1  What it is for.................................................................................... 110 4.5.2  What it achieves............................................................................. 110 4.5.3  On which systems it runs................................................................ 110 4.5.4  When to use it and when not to...................................................... 110 4.5.5  Support, prerequisites and system settings................................... 110 4.5.6  What to do to use it..........................................................................111 4.5.7  Using the function: a practical example...........................................112

4.5.1  What it is for The Board Testing Report indicates in detail the test coverage of each single component. Each component appears marked according to the test plan and test type providing its coverage.

4.5.2  What it achieves The Board Testing Report produces a list of all the parts mounted on the board under test with the correspondent coverage for a rapid overview of the displayed data.

4.5.3  On which systems it runs The Board Testing Report can be used on Bed of Nails and Flying Probe SPEA systems.

4.5.4  When to use it and when not to The Board Testing Report is useful for all the boards whose test program has been generated with Leonardo OS2.

4.5.5  Support, prerequisites and system settings No particular prerequisites or settings are required to display the Board Testing Report.

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4.5.6  What to do to use it Click Board Testing Report of the Leonardo OS2 main panel to use the function:

Figure 1. Leonardo OS2 Main Panel Overview

The Board Testing Report environment appears as follows:

Figure 2. Board Testing Report overview

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4.5.7  Using the function: a practical example For each component, the Board Testing Report provides the following information: Field

Description

Drawing Reference

Name of the component

Presence

Components tested with: • Nominal values different from the board data • Higher tolerance (to the net of system tolerances) than the board data • Multitest with at least one test in “no error” • Operator check, Presence or Component Shape optical tests

Value

Components tested with: • Nominal values equal to the board data • Tolerance equal (to the net of system tolerances) than the board data: this check has to be optional • OCV optical test

Functioning

Components checked for functionality (e.g. discrete, digital components, …). The coverage can be: • Complete (green tick): all tests of the task are executed • Partial (yellow tick): only some tests required by the task are executed.

Pin Short

Components with pins tested by other short circuit test. The coverage can be: • Complete (green tick): all pins of the component are tested (it is present at least one short or NZT test) • Partial (yellow tick): only some pins are tested. In this case; between “( )” brackets are displayed the number of pins tested on whole pins

Soldering

Components with pins tested by soldering check test. The coverage can be: • Complete (green tick): all pins of the component are tested • Partial (yellow tick): only some pins are tested. In this case; between “( )” brackets are displayed the number of pins tested on whole pins

No Test

Components that: • are not been tested in the test program • have “disable” or “no error” status • are present in the test plan but are not executed (e.g.: end, jump, etc.)

Programmer Remark

Any additional remark manually inserted by the programmer

Coverage test type

Info debug

Test plan used to coverage

Mark with a blue tick the component according to the test plan providing its coverage: • ICT • Open Pin • NZT • Optical • Laser • OBP Table 53. Board Testing Report information

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5.  Library functions The Library functions are used to manage the libraries required for the correct use of the Leonardo OS2 software. The following chapters describe the functions listed below: • •

Model Library Editor Component Data Editor

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5.1  Component Data Editor Contents 5.1.1  What it is for......................................................................................114 5.1.2  What it achieves...............................................................................114 5.1.3  On which systems it runs.................................................................114 5.1.4  When to use it and when not to........................................................114 5.1.5  Support, prerequisites and system settings.....................................114 5.1.6  What to do to use it..........................................................................115 5.1.7  Using the function: a practical example.......................................... 116 5.1.7.1  Part Number Data Editor.................................................... 119 5.1.7.2  Integrated Library Editor..................................................... 120 5.1.7.3  Not integrated Library Editor.............................................. 121

5.1.1  What it is for The “Component Data Editor” function is used when it is necessary to create, cancel or modify the component descriptions, their pins, the Internal Parts and the test models associated to the components themselves.

5.1.2  What it achieves Using the “Component Data Editor” function results in customized component descriptions that can be used with Leonardo OS2 to better suit the test requirements of the boards for which the test program will be generated.

5.1.3  On which systems it runs The “Component Data Editor” function can be used on Bed of Nails and Flying Probe SPEA systems.

5.1.4  When to use it and when not to The “Component Data Editor” function can be productively used when preparing the test generation of any kind of board.

5.1.5  Support, prerequisites and system settings No particular prerequisites are needed before completing the “Component Data Editor”.

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5.1.6  What to do to use it Click on the “Component Data Editor” icon of Leonardo OS2 to use the function:

Figure 1. Leonardo OS2 Main Panel overview

It is also possible to reach it in the following ways: •

Leonardo Express 1. Click on “Tools” on the Leonardo Express main panel. 2. Click on “Component Data Editor”:

Figure 2. Component Data Editor in Leonardo Express

•

Leonardo Advanced 1. Click on the “Library” menu on top of the screen. 2. Click “Edit Component Data”:

Figure 3. Component Model Editor in Leonardo Advanced

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5.1.7  Using the function: a practical example The “Component Data Editor” function environment will appear as follows:

Data presence icons

Component Data

Pin information about the selected component

Figure 4. Component Data Editor environment overview

•

Component Data The following table lists the information contained in the fields of the Component Data: Item

Description

Device Name

The name of the component as defined by the constructor of the component itself on the data-sheet. The Device Name in Board Data must be identical to the Device Name for the recognition of the component in the library.

Device Type

Indicates the family membership of the component. The Device Type in Board Data must be identical to that of the Component Data. Otherwise the data-check of the Board Data will highlight the incoherence.

Case Name

Indicates the Case of the component and can be selected between the provided values. It is descriptive information to select between SMD and Through-hole Case (see Case Type).

Case Type

Indicates if the Case is SMD or Through-Hole type. It is compiled automatically, based on the selected Case Name.

Technology

Indicates the construction technology of the component. It is purely descriptive information.

Pin No.

Indicates the number of pins of the component. It is compiled automatically, based on the inserted or cancelled component pins.

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Description

Indicates the function of the component. It is purely descriptive, compiled by copying the information in the data-sheet heading. The name of the producer is indicated between round brackets at the bottom of the description.

Disable Expression

Indicates how to disable the Three-state, Bidirectional and Open Collector outputs of the component. It is a formula which explains to other software, in a compact form, which component pins can be disabled and how to disable them.

Created

Indicates the date of creation of the information on the component. It is compiled automatically when the component is created.

Modified

Indicates the date of the last modification to the information on the component. It is compiled automatically every time the component is modified.

Operator

Indicates the name of the operator. It is compiled automatically every time the component is modified.

Equivalent

Lists the components equivalent to the one selected. These components share all the information except for: device Name, Case Name, Technology and Description.

Boundary Scan

Indicates that the component possesses Boundary Scan [#1] architecture. With this information the Boundary Scan chains in the Boundary Scan environment of the Simulation can be recognized.

Bscan File name

The name of the del BSDL file of the Boundary Scan [#1] component. The information is only present for Boundary Scan components and serves to identify the correct description file of a Boundary Scan component.

Bscan Device Package

The type of package present in the BSDL file of the Boundary Scan [#1] component. The information is only present for Boundary Scan components and serves to identify the correct layout of the Boundary Scan component.

Bscan Note

The so-called “DESIGN WARNING” present in the BSDL file of the Boundary Scan [#1] component. The information is present only for Boundary Scan components and is used to highlight information which is important for the Boundary Scan component test.

[#1] Indicates that the information is compiled automatically during the Import process of a BSDL file. Table 54. Component Data

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Data Presence icons The icons displayed in the first four fields of the Component Data Editor contain information on the eventual presence of Internal Parts, data-sheet and models associated to the component itself, besides highlighting the components tagged for multiple modifications. The following legend details the meanings of the various icons:

Figure 5. Component Data

•

Pin information The following table lists the information contained in the fields of the Pin information area. Item

Description

Pin Name

The name of the pin. This information will be numerically progressive except for the PGA/BGA component pins, where is expressed as alphanumeric value (A1, F15, etc.).

Pin Class

Identifies if the pin is Analogue or Digital. The information is used for the calculation process of the digital guards.

Pin Type

Indicates the type of pin. It can have values such as: Input, Output, Voltage, Open Collector, Base, Three-state, etc. that the software will use for circuit analyses.

Logic Function

Contains the logic function of the pin. It is only compiled for Boundary Scan components and identifies the 4 or 5 pins of the so-called TAP.

Logic Family

Identifies the voltage levels of the pin. It can have the following values: Analogue, BZL, CMOS, ECL, High Logic, Low Voltage 1.2, Low Voltage 1.5, Low Voltage 1.8, Low Voltage 2.5, Low Voltage 3.3, PECL and TTL. This information is used for the distribution of the fixture channels.

Section

Identifies a component subset (for example one of the 4 sections AND of a logic port). It is purely descriptive information compiled with consistent values to identify the various sections.

Bus Id

Identifies the bus of the component (address-bus, data-bus, etc.). The information is used for the calculation process of the digital guards.

Pin Description

Is the description of the pin. It is purely descriptive information compiled with the information indicated for each pin on the data-sheet of the component. Table 55. Pin information

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5.1.7.1  Part Number Data Editor This environment, while showing wide range of information on the component, only allows the modification of the information not inherited from the Component Data.

Figure 6. Part Number Data Editor

•

Editable information Information such as the value and tolerances of the selected component can be changed, as can the height, width and length of the case.

Figure 7. Component case editor

•

Non-editable information Other information on the component, however, are not editable, because it has been inherited from the Component Data. For example, it is not possible to modify the Device Type, or the Case and its Type. If it is essential to modify a part of this information, the modification should be carried out through the Component Data editor. The same modifications will appear automatically in the Part Number Data editor.

•

Internal Parts description As with the Board Data environment within the Preparation, it is possible to describe parts contained inside the selected component. In the example, the selected component is a Diode Array containing 6 diodes and a connection between the pins 2 and 3.

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Figure 8. Internal parts

These Internal Parts, being contained in the Part Number Data inside the Component Data, are used automatically for each Board Data component. This occurs when the component is present in the Component Data and contains Internal Parts. In this case the Internal Parts of the component will be immediately copied into the Internal Parts table of the Board Data.

5.1.7.2  Integrated Library Editor The Library editor integrated in the Component Data Editor environment allows to visualize, write and modify the models associated to the selected component. Double click the icon highlighted in the following picture to open the integrated Library Editor:

Figure 9. Library editor icon in Component Data Editor

The integrated Library Editor will appear as follows:

Figure 10. Integrated Library Editor environment overview

This new environment shows all the associated components linked to the main component with the relative parameters and pins.

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 User's Guide - Component Data Editor The Integrated Library editor has a series of automatic functions that allow to work in Component Data maintaining the connections with the associated models. For example, the copy of a component from “source” to “target” ensures that the target component is automatically linked to the models. Example: The function “Save component as” of a component has been modified adding the “Manage component-model link” check box.

Figure 11. Save component as

If the box is checked, the component will be provided with a new set of models, automatically copied from those linked to the original component but renamed in order to be totally independent from it. The visualization changes as shown in the following picture: the associated models are recognizable because they have a tick in the check box in the first column.

Figure 12.

In this way the library administrator can decide whether to associate/disassociate one of more of the models to the component selected.

5.1.7.3  Not integrated Library Editor It is possible to open the Library Editor in “not integrated” mode in order to work on all existing libraries and not only on those related to a specific component. For specific information about the use of this environment, please refer to the “Model Library Editor” chapter.

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6.  Service functions The Service functions include the tools required to manage the correct interfacing between the Leonardo OS2 software and the system hardware. The following chapters describe the functions listed below: •

Mechanical Adjustment Panel

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6.1  Model Library Editor Contents 6.1.1  What it is for..................................................................................... 123 6.1.2  What it achieves.............................................................................. 123 6.1.3  On which systems it runs................................................................ 123 6.1.4  When to use it and when not to....................................................... 123 6.1.5  Support, prerequisites and system settings.................................... 123 6.1.6  What to do to use it......................................................................... 124 6.1.7  Using the function: a practical example.......................................... 125 6.1.7.1  Library opening................................................................... 125 6.1.7.2  New library creation........................................................... 126 6.1.7.3  Adding new components to Library.................................... 126 6.1.7.4  Models associated to Main and Internal parts................... 127 6.1.7.5  Model editing...................................................................... 127 6.1.7.6  Ties editor........................................................................... 129 6.1.7.7  Digital Test Pattern editor................................................... 129

6.1.1  What it is for The “Model Library Editor” function is used when it is necessary to create, cancel or modify the test models present on libraries. The In-circuit library contains prewritten tests that can be used to start the test generation. Different models in the library are used to generate tests for different types of component. The libraries contain all SPEA test models (information on the characteristics of standard circuit components). A test model for integrated circuits, for instance, is a sequence of instructions (pattern) required to test the component. For every model all the linked components are tested. The component test is generated automatically by the system using a library model chosen according to the name of the component and the circuit configuration.

6.1.2  What it achieves Using the “Model Library Editor” results in customized libraries that can be used with Leonardo OS2 to better suit the test requirements of the boards for which the test program will be generated; for instance, customized libraries can be used when you are using some unusual or specially-designed components, and you want these component descriptions available for multiple test projects.

6.1.3  On which systems it runs The “Model Library Editor” function can be used on Bed of Nails and Flying Probe SPEA systems.

6.1.4  When to use it and when not to The “Model Library Editor” function can be productively used when preparing the test generation of any kind of board.

6.1.5  Support, prerequisites and system settings No particular prerequisites are needed before completing the “Model Library Editor”.

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6.1.6  What to do to use it Click on the “Model Library Editor” icon of Leonardo OS2 to use the function:

Figure 1. Leonardo OS2 Main Panel overview

It is also possible to reach it in the following ways: •

Leonardo Express 1. Click on “Tools” on the Leonardo Express main panel. 2. Click on “Library Editor”:

Figure 2. Library Model Editor in Leonardo Express

•

Leonardo Advanced 1. Click on the “Library” menu on top of the screen. 2. Click “Edit Library Data”:

Figure 3. Library Model Editor in Leonardo Advanced

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6.1.7  Using the function: a practical example The “Model Library Editor” function environment will appear as follows: Library ex plorer tree

Test Model List

List of components linked to the selected model Test parameters for the selected device

Figure 4. Model Library Editor environment overview

The Library editor has an explanatory legend, as you can see below.

Figure 5. Legend

Test Patterns or Test Models for customized components must be created inside new libraries. The following chapters explain how to perform the required operations.

6.1.7.1  Library opening Execute the following steps to open a Library: 1. From the Library Editor toolbar, use the Library explorer tree to choose the library you want to work on. 2. Now you can select one library simply clicking on its name.

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6.1.7.2  New library creation Execute the following steps to create a new Library: From the Library Editor toolbar, right-click on the Library explorer tree box. 1. Select the “New library” to create a new library. 2. Fill all the requested information (Test Concept, Library Type, Test Model Type, etc.) to select the kind of library you need. Note that selecting a library of the same kind of the one you need to create, all the information required during creation will be already filled accordingly Please note that new libraries’ names cannot start with the following characters reserved for SPEA: “@”, “#”, “!”, “$”, “%” and “&”.

6.1.7.3  Adding new components to Library It is possible to add components in the test model libraries for analogue (device with automatic test generator), digital and analogue-functional devices. •

Analogue (for device with automatic test generation) It is not possible to create a test model from scratch for this kind of component because these test models are software programs; but it is possible to create a component in the custom Library performing a copy from an existing one and subsequently modifying its parameters. 1. 2. 3. 4. 5. 6.

•

From the Library Editor toolbar, use the Library explorer tree to choose the library you want to copy from. From the Test model list toolbar, select the model to copy, then right-click and select “Copy model”. Back to the Library Editor toolbar, use the Library explorer tree to choose the library you want to copy to. From the Test model list toolbar, right-click and select “Paste model” Confirm the suggested model name. It is now possible to modify the parameters of the new copy of the model.

Analogue-Functional Test Model The analogue-functional model is a sequence of tests programmed using the Visual Test Editor. For each model the programmer has to specify: • • •

The list of the component names that are tested by the model. The pin description. The ties list. It is the configuration of the connection of the pin (e.g.: 1 connected to GND).

These items are considered during the test program generation process. Select one model into the analogue-functional libraries by performing the following operations: 1. From the Library Editor toolbar, use the Library explorer tree to choose the library you want to work on. 2. Select the model and click Test Pattern button. 3. The Visual Test Editor window is displayed. Now you can change, add, or modify all the tests you need. To add a test model, right click the “Test models linked to []:” box, then choose ‘New model’ to create a new test model or choose “Copy model from project” to create a test model based on a task of the Leonardo Project selected. •

Digital Test Pattern A digital test model is a sequence of instructions (pattern) required to test a component. The test models for digital components (Digital IC) contains test vectors (input and output) to functionally test the part. The input vector is a set of logic values that can be applied to the complete set of input tests at any moment. The output vector is the set of logic values (expected or measured) for all output pins of the component at a particular test step. 126

 User's Guide - Model Library Editor The digital test pattern consists in the description of the truth table of the digital IC under examination. Select one model into the digital libraries by performing the following operations: 1. From the Library Editor toolbar, use the Library explorer tree to choose the library you want to work on. 2. Select the models and click the “Test Pattern” button. 3. The Vector View IDE Editor window is displayed. Now you can change, add, or modify all the tests you need. To add a test model, right click the “Test models linked to []:” box, then choose ‘New model’ to create a new test model or choose “Copy model from project” to create a test model based on a task of the Leonardo Project selected.

6.1.7.4  Models associated to Main and Internal parts The visualization provided by the ”Model Library editor” is very powerful: in the case of a component with Internal Parts, it visualizes and allows the associated models not only to the component itself, but also to any internal part, to be edited. In the example below the list of models associated to the main component (Main Part) and to the Internal Part of a common relay.

Figure 6. Main and Internal Parts

6.1.7.5  Model editing It is possible to perform the editing of the main characteristics of the models as well as the relative parameters and pins. The modification can be carried out directly in the panel grids: with respect to the previous editor, however the modifications are not saved immediately, but must be confirmed with the save key (or cancelled with the cancel key). When a save action is started the editor changes its appearance. In particular the edited row turns blue in the case of the modification underway and valid and red in the case of a modification underway but containing errors. The two examples are shown in the figure:

Figure 7. Model editing

The figure shows a record modified and without errors (ready for the confirmation with save). The banner in the section turns purple at the same time. 127

 User's Guide - Model Library Editor

Figure 8. Model editing with errors

The figure shows a record modified with errors (in the example a string value has been inserted in a numeric field). The banner of the section turns red at the same time. It is possible to carry out a modification to one or more parameters of a model and decide to spread this modification to all the other models associated by using the tag.

Figure 9. Tagged parameters

128

 User's Guide - Model Library Editor

6.1.7.6  Ties editor In case of digital components the definition of the ties is assisted by a special wizard as shown below.

Figure 10. Ties editor

The string of the ties is made in real time by using the check-box where the columns have the following meaning: Column

Meaning

L

Ties to ground

H

Ties to 5V

A

Ties to negative voltage

P

Ties to positive voltage upper than 5V

N, N1, Nx

Pin not accessible (different group are possible)

Tied, T1, Tx

Pin tied together (different group are possible) Table 56. Ties meaning

6.1.7.7  Digital Test Pattern editor All the test patterns or analogue tests available are listed on the right top corner for each digital or analogue functional model:

Figure 11. Patterns

129

 User's Guide - Model Library Editor Double click the icon to open the test pattern editor for digital models or the analogue test editor for analog functional models:

Figure 12. Digital test pattern editor

Figure 13. Analogue test editor

Each different line refers to a different analogue test. It is possible to add, delete or modify analogue tests; double click on a line to execute the analogue test editor for that test:

Figure 14. Visual test editor

130

 User's Guide - Mechanical Adjustment Panel

6.2  Mechanical Adjustment Panel Information not available in this version of the document.

131

User's Guide - Admin functions

7.  Admin functions The Admin functions are used to set up the basic configurations required for the correct functioning of the Leonardo OS2 software. The following chapters describe the functions listed below: • • •

Authorization Editor License Recorder Wizard Disk Organization Editor

132

 User's Guide - Authorization Editor

7.1  Authorization Editor Contents 7.1.1  What it is for..................................................................................... 133 7.1.2  What it achieves.............................................................................. 133 7.1.3  On which systems it runs................................................................ 133 7.1.4  When to use it and when not to....................................................... 133 7.1.5  Support, prerequisites and system settings.................................... 133 7.1.6  What to do to use it.......................................................................... 134 7.1.6.1  Authorization Levels........................................................... 136

7.1.1  What it is for The “Authorization Editor” allows you to: • • •

create new users accounts for Leonardo; manage user rights; display the users default.

7.1.2  What it achieves The result of the function is the management of user accounts and the correspondent authorization levels.

7.1.3  On which systems it runs The “Authorization Editor” function can be used on Flying Probe SPEA systems.

7.1.4  When to use it and when not to It’s used whenever you want to create a new user or modify an existing user, only the user called “Administrator” (or with authorization level 70). SPEA Service” and SPEA Design” are reserved to the SPEA technicians.

7.1.5  Support, prerequisites and system settings No prerequisites or system settings are required to use the function.

133

 User's Guide - Authorization Editor

7.1.6  What to do to use it To use the “Autorization Editor” function, open Leonardo OS2 and click on “Authorization Editor”. Different users (the programmer, the test operator, and the administrator…) can use the Leonardo operative system with different purposes; for this reason, some of them will not be allowed to access some of the functions. When Leonardo is installed, the following default users are present: • • • • • • • •

90 SPEA Design 80 SPEA Service 70 Administrator 60 Programmer Level 2 50 Programmer Level 1 40 Service Operator 30 Test Operator Level 2 20 Test Operator Level 1

It is possible to modify, add or delete an user with the appropriate editor. Only the user called “Administrator” (or with similar authorization level) is enabled to modify, add or delete users and their rights. Two users (“SPEA Service” and “SPEA Design”) are reserved to SPEA personnel and cannot be modified by the user «Administrator». For every user level, default permissions are assigned, corresponding to the areas of the software they can have access to and to the functions they can use in the system. It is possible to: •

Add a New user 1. 2. 3. 4. 5. 6.

Click on “New user”; choose the User Name; choose the Level; choose the password (optional); confirm the password (optional); click on “OK”.

Figure 1. User Authorization Editor

134

 User's Guide - Authorization Editor •

Delete a user 1. click on “Delete”, 2. confirm the deletion of “User”. It is not possible to delete the pre-existing users created by SPEA (SPEA design, SPEA service, Administrator, Programmer Level 2, Programmer Level 1, Service Operator, Test Operator Level 2, Test Operator Level 1).

Figure 2. User Authorization Editor

•

Load windows user to load the windows user into the SPEA list. 1. Click on “Load windows user”.

•

Change user properties 1. 2. 3. 4. 5.

Click on “Change user properties”; change the user Level; insert the password (optional); confirm the password (optional); click on “OK“.

Figure 3. User Authorization Editor

135

 User's Guide - Authorization Editor

7.1.6.1  Authorization Levels The following tables provide an overview of the functions enabled according to the Authorization Levels on the different Leonardo OS2 environments. Notice

Only Authorization Level “70” can change the permissions of other levels.

Leonardo Express - Authorization Level Function Enabler Start Settings Download Translate CAD file check Pin typology check Internal parts check BMU check Power supply Frame Contact restriction area Board accessibility Panel of board Generation Safety system procedure Fiducial Fingers BMU verification Warpage Marker Serial number 2D Test points verification Board mounting check Test program debug Optical test debug Nzt debug Smart obp debug TPGM data collection Board testing report Test result analyzer New project Open project Project Management TPGM Settings Library

20

30

40

50

60

70

View/Edit View/Edit View/Edit View View View View

View/Edit View/Edit View/Edit View View View View

View/Edit View/Edit View/Edit View View View View

View/Edit View/Edit View/Edit Edit Edit Edit Edit

View/Edit View/Edit View/Edit Edit Edit Edit Edit

View/Edit View/Edit View/Edit Edit Edit Edit Edit

View View View View Disabled View View View View View View View View View View View Disabled View Disabled View View/Edit View/Edit View/Edit View/Edit View/Edit Disabled View

View View View View Disabled View View View View View View View View View View View Disabled View Disabled View View/Edit View/Edit View/Edit View/Edit View/Edit Disabled View

View View View View Disabled View View View View View View View View View View View Disabled View Disabled View View/Edit View/Edit View/Edit View/Edit View/Edit Disabled View

Edit Edit Edit Edit View/Edit Edit Edit Edit Edit Edit Edit Edit Edit Edit Edit Edit View/Edit Edit View/Edit Edit View/Edit View/Edit View/Edit View/Edit View/Edit View/Edit View

Edit Edit Edit Edit View/Edit Edit Edit Edit Edit Edit Edit Edit Edit Edit Edit Edit View/Edit Edit View/Edit Edit View/Edit View/Edit View/Edit View/Edit View/Edit View/Edit View

Edit Edit Edit Edit View/Edit Edit Edit Edit Edit Edit Edit Edit Edit Edit Edit Edit View/Edit Edit View/Edit Edit View/Edit View/Edit View/Edit View/Edit View/Edit View/Edit View

Table 57. Leonardo OS2 Express Authorization Levels

136

 User's Guide - Authorization Editor

Leonardo Board Learn - Authorization Level 20

30

40

50

60

70

Start Settings

Function Enabler

View/Edit

View/Edit

View/Edit

View/Edit

View/Edit

View/Edit

Download

View/Edit

View/Edit

View/Edit

View/Edit

View/Edit

View/Edit

Translate

View/Edit

View/Edit

View/Edit

View/Edit

View/Edit

View/Edit

View

View

View

View

View

View

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

View

View

View

Edit

Edit

Edit

Contact restriction area Panel of board Fiducial

View

View

View

Edit

Edit

Edit

View/Edit

View/Edit

View/Edit

View/Edit

View/Edit

View/Edit

Serial number 2D

View

View

View

Edit

Edit

Edit

ICT & Open Pin debug

View

View

View

Edit

Edit

Edit

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

Power ground tp define Test Program Learn

Optical test debug

Table 58. Leonardo OS2 Board Learn Authorization Levels

137

 User's Guide - Authorization Editor

Leonardo Advanced - Authorization Level Function Enabler

20

30

40

50

60

70

Project Properties

View

View

View

Edit

Edit

Edit

Project Files

View

View

View

Edit

Edit

Edit

Layout

View

View

View

Edit

Edit

Edit

BOM

View

View

View

Edit

Edit

Edit

Part List

View

View

View

Edit

Edit

Edit

Pin typology check

View

View

View

Edit

Edit

Edit

Power Supply

View

View

View

Edit

Edit

Edit

Net List

View

View

View

Edit

Edit

Edit

Pin List

View

View

View

Edit

Edit

Edit

Variant

View

View

View

Edit

Edit

Edit

Schematics

View

View

View

Edit

Edit

Edit

Layout Builder

View

View

View

Edit

Edit

Edit

Board Positioning

View

View

View

Edit

Edit

Edit

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

Flying Levels

View

View

View

Edit

Edit

Edit

Fiducial

View

View

View

Edit

Edit

Edit

BarCode

View

View

View

Edit

Edit

Edit

Marker

View

View

View

Edit

Edit

Edit

Warpage

View

View

View

Edit

Edit

Edit

Moving Fingers

View

View

View

Edit

Edit

Edit

Fixed Fingers

View

View

View

Edit

Edit

Edit

Test Point Layout

View

View

View

Edit

Edit

Edit

Escan Sensor

View

View

View

Edit

Edit

Edit

Documentation

View

View

View

Edit

Edit

Edit

Organizer

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

Test Plans

View

View

View

Edit

Edit

Edit

Optical

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

Functional

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

Obp

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

Reports

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

Rules

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

View

View

View

Edit

Edit

Edit

Test Program Structure

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

ATE HW Configuration

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

View

View

View

Edit

Edit

Edit

Panel

Case Rules

IC Test Scheme

View

View

View

Edit

Edit

Edit

Low Z Parts

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

Low Z Chain

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

Parallel Parts

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

Special Nets

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

Net Impedance

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

Charged Capacitor

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

Analogue Guard

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

NZT Setup

138

 User's Guide - Authorization Editor

Leonardo Advanced - Authorization Level 20

30

40

50

60

70

Tied Pins

Function Enabler

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

Not Available Pins

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

Digital Guard

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

Bus List

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

Board Disable

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

View

View

View

Edit

Edit

Edit

Test Point Layout

View

View

View

Edit

Edit

Edit

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

Boundary Scan

View

View

View

Edit

Edit

Edit

System Power Supply

View

View

View

Edit

Edit

Edit

Net Accessibility Testability

View

View

View

Edit

Edit

Edit

New project

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

Open project

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

Project Management

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

TPGM Settings

Disabled

Disabled

Disabled

View/Edit

View/Edit

View/Edit

Library

Disabled

Disabled

Disabled

View

View

Edit

Certifications

Table 59. Leonardo OS2 Advanced Authorization Levels

Leonardo Explorer - Authorization Level Function Enabler

20

30

40

50

60

70

Select Project

Enabled

Enabled

Enabled

Enabled

Enabled

Enabled

Create Project

Disabled

Disabled

Disabled

Enabled

Enabled

Enabled

Copy Project

Disabled

Disabled

Disabled

Enabled

Enabled

Enabled

Delete Project

Disabled

Disabled

Disabled

Enabled

Enabled

Enabled

Zip Project

Disabled

Disabled

Disabled

Enabled

Enabled

Enabled

Unzip Project

Disabled

Disabled

Disabled

Enabled

Enabled

Enabled

Optimize Project

Disabled

Disabled

Disabled

Enabled

Enabled

Enabled

Project information

Disabled

Enabled

Enabled

Enabled

Enabled

Enabled

Only Run Project

Disabled

Disabled

Disabled

Enabled

Enabled

Enabled

Only Released Project

Enabled

Enabled

Enabled

Enabled

Enabled

Enabled

Only Zip Released Project

Disabled

Disabled

Disabled

Disabled

Disabled

Disabled

Rename Project

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

Variant Zip

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

Variant Unzip

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

View Log Book

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

Enable Log Book

Disabled

Disabled

Disabled

Disabled

Disabled

Enabled

Erase Log Book

Disabled

Disabled

Disabled

Disabled

Disabled

Enabled

Delete History

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

Find

Disabled

Enabled

Enabled

Enabled

Enabled

Enabled

Recycle

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

Workstation Filter

Disabled

Disabled

Disabled

Disabled

Disabled

Enabled

Change Released Flag

Disabled

Disabled

Disabled

Disabled

Disabled

Disabled

Copy/Zip Part Number by default

Disabled

Disabled

Disabled

Disabled

Disabled

Disabled

Point Project after Copy/Zip operation

Enabled

Enabled

Enabled

Enabled

Enabled

Enabled

Table 60. Leonardo Explorer Authorization Levels

139

 User's Guide - Authorization Editor

Leonardo Runpack - Authorization Level Function Enabler

20

30

40

50

60

70

Initialize

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

Last System Initialization Report

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

Last Load Report

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

Load

Enabled

Enabled

Enabled

Enabled

Enabled

Enabled

Open

Enabled

Enabled

Enabled

Enabled

Enabled

Enabled

Automation Console

Enabled

Enabled

Enabled

Enabled

Enabled

Enabled

Automation I/O Monitor

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

Warm-Up

Enabled

Enabled

Enabled

Enabled

Enabled

Enabled

AutoProbe Console

Enabled

Enabled

Enabled

Enabled

Enabled

Enabled

Pin Finder

Enabled

Enabled

Enabled

Enabled

Enabled

Enabled

Board Navigator

Enabled

Enabled

Enabled

Enabled

Enabled

Enabled

Visual Debugger

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

System Composition

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

Service

Enabled

Enabled

Enabled

Enabled

Enabled

Enabled

Run Selected Environment

Disabled

Enabled

Enabled

Enabled

Enabled

Enabled

RAM Test

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

Diagnostic

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

Calibration

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

Adjustement

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

Variant Selection

Enabled

Enabled

Enabled

Enabled

Enabled

Enabled

Reset Alarm

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

Debug Console

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

TPGM Memory Contents Verify...

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

Mechanical Alignment

Enabled

Enabled

Enabled

Enabled

Enabled

Enabled

Automatic Probes Alignment

Enabled

Enabled

Enabled

Enabled

Enabled

Enabled

Board Align

Enabled

Enabled

Enabled

Enabled

Enabled

Enabled

Park for needle change

Enabled

Enabled

Enabled

Enabled

Enabled

Enabled

Eddris Setup

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

Self Diagnostic

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

Operating Mode Selection

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

Automation Mode Selection

Enabled*

Enabled

Enabled

Enabled

Enabled

Enabled

Job Panel

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

Test Fail Check

Disabled

Disabled

Disabled

Enabled

Enabled

Enabled

Test Fail Adjust

Enabled

Enabled

Enabled

Enabled

Enabled

Enabled

Test Fail Repeat

Enabled

Enabled

Enabled

Enabled

Enabled

Enabled

Test Select

Disabled

Disabled

Disabled

Enabled

Enabled

Enabled

Leonardo Debug

Disabled

Enabled

Enabled

Enabled

Enabled

Enabled

Organizer Editor

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

Functional Testplan Execution

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

Z Ultra-Soft Landing

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

Retouch

Disabled

Disabled

Enabled

Enabled

Enabled

Enabled

Table 61. Leonardo Runpack Authorization Levels

* Only Automatic and In Line Automation Mode enabled.

140

 User's Guide - License Recorder Wizard

7.2  License Recorder Wizard Information not available in this version of the document.

141

 User's Guide - Disk Organization Editor

7.3  Disk Organization Editor Information not available in this version of the document.

142

User's Guide - Admin functions

8.  Admin functions The Apps are stand alone utility applications for system options. The following chapters describe the functions listed below: •

Nodal Waveform Capture App

143

 User's Guide - Nodal Waveform Capture App

8.1  Nodal Waveform Capture App Contents 8.1.1  What it is for.................................................................................... 144 8.1.2  When to use it and when not to...................................................... 144 8.1.3  Support, prerequisites and system settings.................................... 144 8.1.4  What to do to use it......................................................................... 145 8.1.4.1  Operating Panel................................................................. 147 8.1.5  Using the function: a practical example.......................................... 148 8.1.5.1  Start acquisition................................................................. 148 8.1.5.2  Add new task..................................................................... 148 8.1.5.3  Add new test...................................................................... 149 8.1.5.4  Acquire waveform.............................................................. 149

8.1.1  What it is for The Nodal Waveform Capture App measures, displays and acquires the electrical signals generated by the UUT. It is used in conjunction with Flying Scope (FSCP) available on Flying Probe testers. Features: • • •

Waveform capture: Waveform measure, display and log; Oscilloscope manual control: Quick access to control oscilloscope parameters: voltage range, offset, acquisition timing, trigger; Nodal Waveforms Report: Automatic report generation for the captured waveforms.

8.1.2  When to use it and when not to The Nodal Waveform Capture App can be used on any type of board.

8.1.3  Support, prerequisites and system settings The system must be equipped with Flying Scope (FSCP). The board data must be available before using the Nodal Waveform Capture App. The tasks to add to the Test Program must be available in CSV file format, as shown in figure:

Figure 1. Example of CSV file format

144

 User's Guide - Nodal Waveform Capture App

8.1.4  What to do to use it Click Nodal Waveform Capture The App appears as follows:

on the Leonardo OS2 launchpad.

Figure 2. Nodal Waveform Capture App

Click IMPORT to import the Test Program (in CSV file format). All the included tasks will be displayed in the Task List. For each task, the following information are displayed: • •

Name: univocal name of the task (eg.: Task#1, Task#49). Measure TP, Reference TP: Test points used to analyze the waveform of the signal.

For tests of each task, the following information are displayed: • •

Test Name: univocal name of the test (eg.: Task #1-Test#1, Task#1-Test#2, etc.). Type: “Link” or “Oscilloscope” test.

Click Start on the Operating Panel to start waveforms acquisition for all tasks.

145

 User's Guide - Nodal Waveform Capture App Refer to the following table for the available operations: To do this

Do this

Remarks

Display the board layout

Click Image

Show the area currently framed by the system camera

Click Camera

Navigate the board under test and center on the measurement point

Click Camera Console

Use the cursor to move the camera around.

If the Operating Panel is not displayed, click Operating Panel on the bottom of the window. Refer to the “Operating Panel” chapter for more information.

Manage the execution of the Nodal Waveform Capture App

Click Operating Panel

Collect the captured waveforms

Click Report Explore

Display PicoScope ® software

Click PICO SCOPE

Edit the forlder path where to save the report and the image of the captured waveform

1. 2.

Click SETTINGS Edit Report folder path

Edit the folder path where to select the PicoScope ® software version to be executed when the “PICO SCOPE“ icon is selected

1. 2.

Click SETTINGS Edit PicoScope folder path

1. 2.

Click SETTINGS Enable Enable Serial Number reading check box

1. 2.

Click SETTINGS Select INSTANT display mode

waveform

Display the waveform that results from the average of the N acquired waveforms

1. 2.

Click SETTINGS Select AVERAGE display mode

waveform

Display the waveform that it is the result of the Y maximum value among the acquired waveforms.

1. 2.

Click SETTINGS Select MAXIMUM display mode

waveform

Enable the board Serial Number reading in the Operating Panel. At the test start also the generated reports (Report Explore icon) will contain the board Serial Number. Display only one waveform (default)

1. 2.

Open the Automation Console

For more information on this software, refer to the PicoScope ® software - User’s Guide”.

Click Common Apps Click Automation Console

The Console is the panel for the control and monitoring of the system automations. For more information on this panel, refer to the “Production Control Panel Advanced” chapter. This panel is generally used to execute the probes alignment.

Open the Mechanical alignment panel

1. 2.

Click Common Apps Click Mechanical Alignment

Open and close the system doors

1. 2.

Click Common Apps Click Open/Close door

1. 2. 3.

Click Common Apps Click Change site On the Board Panel Displayer, Only for panel of boards double click on the board to change the active site

Execute the automatic alignment of the board

1. 2. 3.

Click Common Apps Click Board alignment Follow the instructions on screen

Change the current composition of the unit under test

1. 2. 3.

Click Common Apps Click Change Composition Select the composition to enable

Change the current site of the unit under test

For more information on this procedure, refer to the “Calibration – Probe alignment” chapter of the Flying Probe system’s Use and Maintenance document. -

-

Only for variant test programs

Table 62. Nodal Waveform Capture App apps operations

146

 User's Guide - Nodal Waveform Capture App

8.1.4.1  Operating Panel The Operating Panel manages the execution of the Nodal Waveform Capture App:

Figure 3. Operating Panel

This console also displays the current status of the Nodal Waveform Capture App execution: Status

Description

READY

The system is waiting for commands.

TEST

The system is testing.

STOP

The test has been interrupted.

PASS

The measure of the waveform has been executed without error. It is displayed at end of the test.

FAIL

A timeout error occurs during the measure of the waveform. It is displayed at end of the test.

INITIALIZING

The App is opening the communication with system. Table 63. Nodal Waveform Capture App states

Refer to the following table for the available operations: To do this

Do this

Start waveforms acquisition

Click Start

-

Interrupt waveforms acquisition

Click Stop

-

Execute the selected task

Click One Shot

-

Recycle on the currently selected test

Click Recycle

-

Repeat the selected tasks a set number 1. of times 2. Run only the tagged tasks

1. 2.

Remarks

Set the amount of loops Click Repeat

-

Tag the tasks clicking the circle on the left of the Task name Click Run Tagged

-

Execute the currently selected task and Click Next moves the selection to the next one

-

Mark selected task as active, which is the first task on execution when start is pressed

-

1. 2.

Select the task Click GoTo

Figure 4. Operating Panel commands

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 User's Guide - Nodal Waveform Capture App

8.1.5  Using the function: a practical example 8.1.5.1  Start acquisition To measure and collect the test points waveforms on the board, proceed as follows: 1. Insert the board in the system. 2. Click Nodal Waveform Capture 3. The App appears:

on on the Leonardo OS2 launchpad.

Figure 5. Nodal Waveform Capture App

4. Click IMPORT to import the Test Program (in CSV file format). All the included tasks will be displayed in the Task List. 5. Click Start on the Operating Panel to generate all the waveform capture tests for all nets of the board. N.b.: if the Operating Panel in not on screen, click Operating Panel to show it. 6. After acquisition ending, click Report Explore to view the generated report and the waveforms images (in CSV format and JPEG).

8.1.5.2  Add new task Click NEW TASK to include more test points in the Task List: 1. 2. 3. 4.

Click Camera tab to show the area currently framed by the system camera. In the TASK IDENTIFICATION section, edit the task name. In the TEST IDENTIFICATION section, edit the test name of the task. In the TEST POINT DATA section, set the “Measure TP” and the “Reference TP”.

Figure 6. Test Point Data

5. Click to move the camera on the desidered test point. Use the cursor to correct the camera position on the test point. to acquire the new test point position. 6. Click 7. In the POWER SUPPLY section, choose the “Power On” and “Power Off” tasks according to the ICT Test Plan. N.b.: Make sure that these tasks do not have the “Jump” instruction in the ICT Test Plan. 148

 User's Guide - Nodal Waveform Capture App

8.1.5.3  Add new test Click NEW TEST to add a new test to the currently selected task in the Task List.

Figure 7. New Test

8.1.5.4  Acquire waveform To configure and acquire the waveform of the test selected in the Task List: 1. Select the test. 2. In the SCOPE SETUP section, configure the oscilloscope parameters (as timebase, voltage range, trigger, etc.) 3. Click ACQUIRE to store the captured waveforms. 4. Click to zoom the signal waveform changing the “voltage range (V)” and the “timing (T)”. 5. After acquisition ending, click Report Explore to view the generated report and the waveforms images (in CSV format and JPEG).

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